GB1305593A - - Google Patents

Info

Publication number
GB1305593A
GB1305593A GB2877870A GB2877870A GB1305593A GB 1305593 A GB1305593 A GB 1305593A GB 2877870 A GB2877870 A GB 2877870A GB 2877870 A GB2877870 A GB 2877870A GB 1305593 A GB1305593 A GB 1305593A
Authority
GB
United Kingdom
Prior art keywords
chips
wafer
semi
base
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2877870A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1305593A publication Critical patent/GB1305593A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67271Sorting devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00Classifying, separating, and assorting solids
    • Y10S209/936Plural items tested as group

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB2877870A 1969-06-30 1970-06-15 Expired GB1305593A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83759569A 1969-06-30 1969-06-30

Publications (1)

Publication Number Publication Date
GB1305593A true GB1305593A (enrdf_load_stackoverflow) 1973-02-07

Family

ID=25274909

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2877870A Expired GB1305593A (enrdf_load_stackoverflow) 1969-06-30 1970-06-15

Country Status (5)

Country Link
US (1) US3584741A (enrdf_load_stackoverflow)
JP (1) JPS4827501B1 (enrdf_load_stackoverflow)
DE (1) DE2028910C3 (enrdf_load_stackoverflow)
FR (1) FR2052380A5 (enrdf_load_stackoverflow)
GB (1) GB1305593A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109454023A (zh) * 2018-12-21 2019-03-12 义乌臻格科技有限公司 一种用于拾取微型芯片的吸嘴装置及分选装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539508B2 (enrdf_load_stackoverflow) * 1971-06-25 1978-04-06
US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus
US3915784A (en) * 1972-04-26 1975-10-28 Ibm Method of semiconductor chip separation
US3847284A (en) * 1973-05-11 1974-11-12 Teledyne Inc Magnetic tape die sorting system
US3915850A (en) * 1973-11-14 1975-10-28 Gti Corp Component handler and method and apparatus utilizing same
US3894633A (en) * 1974-10-24 1975-07-15 Western Electric Co Method and apparatus for sorting articles
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
US4406373A (en) * 1981-08-03 1983-09-27 Palomar Systems & Machines, Inc. Means and method for testing and sorting miniature electronic units
JPS59110758U (ja) * 1983-01-18 1984-07-26 大谷 均 ダブルタイヤの石取器
EP0468153B1 (de) * 1990-07-25 1995-10-11 atg test systems GmbH Kontaktierungsvorrichtung für Prüfzwecke
JP3009743B2 (ja) * 1995-09-04 2000-02-14 株式会社アドバンテスト 半導体デバイス搬送処理装置
US6024526A (en) * 1995-10-20 2000-02-15 Aesop, Inc. Integrated prober, handler and tester for semiconductor components
CH694831A9 (de) * 1998-04-24 2005-10-14 Int Rectifier Corp Vorrichtung zur Pruefung vereinzelter Halbleiterchips.
US6505665B1 (en) * 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
US6222145B1 (en) 1998-10-29 2001-04-24 International Business Machines Corporation Mechanical strength die sorting
US6521853B1 (en) * 2000-05-08 2003-02-18 Micro Component Technology, Inc. Method and apparatus for sorting semiconductor devices
US6570374B1 (en) * 2000-06-23 2003-05-27 Honeywell International Inc. Vacuum chuck with integrated electrical testing points
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
CN103708713A (zh) * 2013-12-26 2014-04-09 深圳市华星光电技术有限公司 夹持机构、液晶面板切割机以及液晶面板切割工艺
US10173246B1 (en) * 2018-05-30 2019-01-08 Nanotronics Imaging, Inc. Systems, apparatus, and methods for sorting components using illumination
CN113426682B (zh) * 2021-06-04 2023-06-30 江苏暖阳半导体科技有限公司 一种MiniLED的检测分选工艺

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1153008A (en) * 1965-09-18 1969-05-21 Telefunken Patent Method of and apparatus for Measuring and Sorting the Individual Elements in a Semiconductor Wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109454023A (zh) * 2018-12-21 2019-03-12 义乌臻格科技有限公司 一种用于拾取微型芯片的吸嘴装置及分选装置

Also Published As

Publication number Publication date
DE2028910B2 (de) 1979-01-11
DE2028910C3 (de) 1979-09-06
JPS4827501B1 (enrdf_load_stackoverflow) 1973-08-23
US3584741A (en) 1971-06-15
FR2052380A5 (enrdf_load_stackoverflow) 1971-04-09
DE2028910A1 (de) 1971-01-07

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee