GB1305593A - - Google Patents

Info

Publication number
GB1305593A
GB1305593A GB2877870A GB2877870A GB1305593A GB 1305593 A GB1305593 A GB 1305593A GB 2877870 A GB2877870 A GB 2877870A GB 2877870 A GB2877870 A GB 2877870A GB 1305593 A GB1305593 A GB 1305593A
Authority
GB
United Kingdom
Prior art keywords
chips
wafer
semi
base
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2877870A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1305593A publication Critical patent/GB1305593A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00—Classifying, separating, and assorting solids
    • Y10S209/936—Plural items tested as group

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

1305593 Testing and sorting semi-conductor chips INTERNATIONAL BUSINESS MACHINES CORP 15 June 1970 [30 June 1969] 28778/70 Heading G1U A device for use in the testing, and subsequent sorting, of semi-conductor chips comprises (1) a base 20, Figs. 2, 3, on to which a member 22, carrying a semi-conductor wafer 24 diced into chips 38, can be accurately positioned, (by means not shown), temporarily held by a vacuum 41, 42, and then clamped 44, 46, (2) an intermediate member 61 including a matrix of compartments 32 corresponding to the individual chips 38 of the diced wafer and arranged so that when it is fitted on to the base as shown in Fig. 3 (not shown), and clamped by screws 60, each chip 38 is individually held in position so that the whole unit may be immersed in a solvent to wash away the adhesive fixing the wafer 24 to the member 20, without any movement of the chips, and (3) an upper member 62 which includes a disc 67 in which a plurality of tubes 65 terminate, the arrangement being such that by lowering the upper member on to the intermediate member as shown in Fig. 3 (not shown), and then applying a vacuum to selected tubes 65, selected chips may be held in the matrix of compartments 32, so that the intermediate member and the upper member may be jointly removed from the base member in order to transport the selected chips to an appropriate location. In operation Fig. 9, a semi-conductor wafer 24 is fixed to the member 22 by a suitable adhesive, the member 22 is accurately positioned on the base 20 and clamped, the wafer is diced and the individual chips are tested. The intermediate member carrying the matrix of compartments 32 is then put in position to hold the individual chips, and the adhesive is washed away. Finally, the upper member is placed in position, vacuum is applied to selected tubes 65 and the selected chips are transported away. The whole operation is computer controlled. (For Figures see next page)
GB2877870A 1969-06-30 1970-06-15 Expired GB1305593A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US83759569A 1969-06-30 1969-06-30

Publications (1)

Publication Number Publication Date
GB1305593A true GB1305593A (en) 1973-02-07

Family

ID=25274909

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2877870A Expired GB1305593A (en) 1969-06-30 1970-06-15

Country Status (5)

Country Link
US (1) US3584741A (en)
JP (1) JPS4827501B1 (en)
DE (1) DE2028910C3 (en)
FR (1) FR2052380A5 (en)
GB (1) GB1305593A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109454023A (en) * 2018-12-21 2019-03-12 义乌臻格科技有限公司 It is a kind of for picking up the nozzle unit and sorting unit of microchip

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS539508B2 (en) * 1971-06-25 1978-04-06
US3811182A (en) * 1972-03-31 1974-05-21 Ibm Object handling fixture, system, and process
US3915784A (en) * 1972-04-26 1975-10-28 Ibm Method of semiconductor chip separation
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus
US3847284A (en) * 1973-05-11 1974-11-12 Teledyne Inc Magnetic tape die sorting system
US3915850A (en) * 1973-11-14 1975-10-28 Gti Corp Component handler and method and apparatus utilizing same
US3894633A (en) * 1974-10-24 1975-07-15 Western Electric Co Method and apparatus for sorting articles
CA1044379A (en) * 1974-12-28 1978-12-12 Sony Corporation Wafer transfer device
US4406373A (en) * 1981-08-03 1983-09-27 Palomar Systems & Machines, Inc. Means and method for testing and sorting miniature electronic units
JPS59110758U (en) * 1983-01-18 1984-07-26 大谷　均 double tire stone remover
EP0468153B1 (en) * 1990-07-25 1995-10-11 atg test systems GmbH Device for contacting elements for testing
JP3009743B2 (en) * 1995-09-04 2000-02-14 株式会社アドバンテスト Semiconductor device transfer processing equipment
US6024526A (en) * 1995-10-20 2000-02-15 Aesop, Inc. Integrated prober, handler and tester for semiconductor components
US6246251B1 (en) * 1998-04-24 2001-06-12 International Rectifier Corp. Test process and apparatus for testing singulated semiconductor die
US6505665B1 (en) * 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
US6222145B1 (en) 1998-10-29 2001-04-24 International Business Machines Corporation Mechanical strength die sorting
US6521853B1 (en) * 2000-05-08 2003-02-18 Micro Component Technology, Inc. Method and apparatus for sorting semiconductor devices
US6570374B1 (en) * 2000-06-23 2003-05-27 Honeywell International Inc. Vacuum chuck with integrated electrical testing points
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
CN103708713A (en) * 2013-12-26 2014-04-09 深圳市华星光电技术有限公司 Clamping mechanism, liquid crystal panel cutting machine and liquid crystal panel cutting process
US10173246B1 (en) * 2018-05-30 2019-01-08 Nanotronics Imaging, Inc. Systems, apparatus, and methods for sorting components using illumination
CN113426682B (en) * 2021-06-04 2023-06-30 江苏暖阳半导体科技有限公司 MiniLED detection and separation process

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1153008A (en) * 1965-09-18 1969-05-21 Telefunken Patent Method of and apparatus for Measuring and Sorting the Individual Elements in a Semiconductor Wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109454023A (en) * 2018-12-21 2019-03-12 义乌臻格科技有限公司 It is a kind of for picking up the nozzle unit and sorting unit of microchip

Also Published As

Publication number Publication date
DE2028910C3 (en) 1979-09-06
US3584741A (en) 1971-06-15
FR2052380A5 (en) 1971-04-09
JPS4827501B1 (en) 1973-08-23
DE2028910A1 (en) 1971-01-07
DE2028910B2 (en) 1979-01-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee