GB1305337A - - Google Patents

Info

Publication number
GB1305337A
GB1305337A GB3975471A GB3975471A GB1305337A GB 1305337 A GB1305337 A GB 1305337A GB 3975471 A GB3975471 A GB 3975471A GB 3975471 A GB3975471 A GB 3975471A GB 1305337 A GB1305337 A GB 1305337A
Authority
GB
United Kingdom
Prior art keywords
strip
leads
plane
heat sink
station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3975471A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1305337A publication Critical patent/GB1305337A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
GB3975471A 1970-09-08 1971-08-24 Expired GB1305337A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7003470A 1970-09-08 1970-09-08

Publications (1)

Publication Number Publication Date
GB1305337A true GB1305337A (cg-RX-API-DMAC10.html) 1973-01-31

Family

ID=22092718

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3975471A Expired GB1305337A (cg-RX-API-DMAC10.html) 1970-09-08 1971-08-24

Country Status (11)

Country Link
US (1) US3650232A (cg-RX-API-DMAC10.html)
AT (1) AT318042B (cg-RX-API-DMAC10.html)
AU (1) AU450494B2 (cg-RX-API-DMAC10.html)
BE (1) BE772314A (cg-RX-API-DMAC10.html)
CA (1) CA966986A (cg-RX-API-DMAC10.html)
DE (1) DE2143809A1 (cg-RX-API-DMAC10.html)
ES (1) ES394780A1 (cg-RX-API-DMAC10.html)
FR (1) FR2106369B1 (cg-RX-API-DMAC10.html)
GB (1) GB1305337A (cg-RX-API-DMAC10.html)
NL (1) NL7112352A (cg-RX-API-DMAC10.html)
SE (1) SE360216B (cg-RX-API-DMAC10.html)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815205A (en) * 1973-03-02 1974-06-11 Nasa Device for configuring multiple leads
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
KR910001118B1 (ko) * 1985-11-13 1991-02-23 후지쓰 가부시끼가이샤 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US4819476A (en) * 1987-07-17 1989-04-11 Amp Incorporated Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
USD358804S (en) 1993-09-02 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
DE69712999T2 (de) * 1996-07-26 2003-01-23 Nec Corp., Tokio/Tokyo Festelektrolytkondensator mit vorplattierten Leiteranschlüssen und dessen Herstellungsverfahren
JP2000243889A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム
WO2018087027A1 (en) * 2016-11-11 2018-05-17 Lumileds Holding B.V. Method of manufacturing a lead frame
CN117644134B (zh) * 2024-01-23 2024-05-14 佛山市阿玛达机械科技有限公司 一种金属板材加工用冷弯成型装置及其操作方法
CN121755608A (zh) * 2024-09-26 2026-03-31 恩智浦美国有限公司 用于使封装式半导体装置的j形引脚变形的方法和设备
CN119747739B (zh) * 2025-03-07 2025-07-18 厦门特克精密工业有限公司 一种引线框架的切断装置及切断工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
US3650232A (en) 1972-03-21
DE2143809A1 (de) 1972-03-09
FR2106369B1 (cg-RX-API-DMAC10.html) 1977-04-22
CA966986A (en) 1975-05-06
SE360216B (cg-RX-API-DMAC10.html) 1973-09-17
BE772314A (fr) 1972-03-07
FR2106369A1 (cg-RX-API-DMAC10.html) 1972-05-05
ES394780A1 (es) 1974-03-01
AU3235571A (en) 1973-02-15
NL7112352A (cg-RX-API-DMAC10.html) 1972-03-10
AU450494B2 (en) 1974-07-11
AT318042B (de) 1974-09-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees