GB1303861A - - Google Patents

Info

Publication number
GB1303861A
GB1303861A GB1080770A GB1080770A GB1303861A GB 1303861 A GB1303861 A GB 1303861A GB 1080770 A GB1080770 A GB 1080770A GB 1080770 A GB1080770 A GB 1080770A GB 1303861 A GB1303861 A GB 1303861A
Authority
GB
United Kingdom
Prior art keywords
wafers
contact
semi
wafer
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1080770A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1911915A external-priority patent/DE1911915C3/de
Application filed filed Critical
Publication of GB1303861A publication Critical patent/GB1303861A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/70—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the mechanical construction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y10T29/49899—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"] by multiple cooperating aligning means

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connecting Device With Holders (AREA)
GB1080770A 1969-03-08 1970-03-06 Expired GB1303861A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1911915A DE1911915C3 (de) 1967-09-12 1969-03-08 Halbleiterbauelement und Verfahren zu seiner Hersteilung

Publications (1)

Publication Number Publication Date
GB1303861A true GB1303861A (enExample) 1973-01-24

Family

ID=5727571

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1080770A Expired GB1303861A (enExample) 1969-03-08 1970-03-06

Country Status (6)

Country Link
US (1) US3689985A (enExample)
CH (1) CH528819A (enExample)
ES (1) ES377255A1 (enExample)
FR (1) FR2031024A5 (enExample)
GB (1) GB1303861A (enExample)
SE (1) SE364407B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3992770A (en) * 1974-08-30 1976-11-23 Rca Corporation Automatic assembly of semiconductor devices
US3978579A (en) * 1974-08-30 1976-09-07 Rca Corporation Automatic assembly of semiconductor devices
DE2610136A1 (de) * 1976-03-11 1977-09-22 Bosch Gmbh Robert Spannungsregler fuer generatoren
DE2610137A1 (de) * 1976-03-11 1977-09-29 Bosch Gmbh Robert Generator mit freilaufdiode und spannungsregler
GB2100076B (en) * 1981-06-05 1985-11-20 Bosch Gmbh Robert Battery charging system
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
US4638938A (en) * 1984-09-07 1987-01-27 Rockwell International Corporation Vapor phase bonding for RF microstrip line circuits
FR2591810B1 (fr) * 1985-12-13 1988-02-19 Labo Electronique Physique Dispositif de centrage pour la realisation du brochage d'un boitier multibroches
US5067228A (en) * 1990-05-09 1991-11-26 Saratoga Spa & Bath Co. Apparatus and method for blind attachment of a liner to a pool support structure
US5052353A (en) * 1990-05-18 1991-10-01 Outboard Marine Corporation Marine propulsion device cowl assembly
JPH0724981B2 (ja) * 1990-07-27 1995-03-22 栄一 市川 部品組付方法及び装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3204327A (en) * 1957-10-28 1965-09-07 Motorola Inc Method for making semiconductor devices employing a hollow, slotted cylindrical jig and vertical mounting posts
US3153275A (en) * 1961-01-19 1964-10-20 Motorola Inc Self-jigging method of making semiconductor devices
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices
US3568295A (en) * 1968-08-14 1971-03-09 Goodyear Aerospace Corp Method and apparatus for assembling electrical components onto a circuit board
DE1903274A1 (de) * 1969-01-23 1970-07-30 Bosch Gmbh Robert Verfahren zum Aufloeten eines Halbleiterkoerpers auf einen Traeger

Also Published As

Publication number Publication date
ES377255A1 (es) 1972-06-16
CH528819A (de) 1972-09-30
US3689985A (en) 1972-09-12
FR2031024A5 (enExample) 1970-11-13
SE364407B (enExample) 1974-02-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee