GB1303650A - - Google Patents

Info

Publication number
GB1303650A
GB1303650A GB6055569A GB6055569A GB1303650A GB 1303650 A GB1303650 A GB 1303650A GB 6055569 A GB6055569 A GB 6055569A GB 6055569 A GB6055569 A GB 6055569A GB 1303650 A GB1303650 A GB 1303650A
Authority
GB
United Kingdom
Prior art keywords
conductors
circuit
foil
contact places
dec
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6055569A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1303650A publication Critical patent/GB1303650A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
GB6055569A 1968-12-14 1969-12-11 Expired GB1303650A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6818017A NL6818017A (enExample) 1968-12-14 1968-12-14

Publications (1)

Publication Number Publication Date
GB1303650A true GB1303650A (enExample) 1973-01-17

Family

ID=19805406

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6055569A Expired GB1303650A (enExample) 1968-12-14 1969-12-11

Country Status (10)

Country Link
AT (1) AT301666B (enExample)
BE (1) BE743089A (enExample)
BR (1) BR6915013D0 (enExample)
CH (1) CH506230A (enExample)
DE (1) DE1958811A1 (enExample)
DK (1) DK121806B (enExample)
ES (1) ES374491A1 (enExample)
FR (1) FR2026186A1 (enExample)
GB (1) GB1303650A (enExample)
NL (1) NL6818017A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2158367A (en) * 1984-03-31 1985-11-13 Nitto Electric Ind Co Process for producing polyimide/metallic foil composite film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2633434C2 (de) * 1976-07-24 1981-04-30 Diehl GmbH & Co, 8500 Nürnberg Verlorener Verschlußstopfen
JPS566498A (en) * 1979-06-26 1981-01-23 Hitachi Chemical Co Ltd Method of manufacturing flexible printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2158367A (en) * 1984-03-31 1985-11-13 Nitto Electric Ind Co Process for producing polyimide/metallic foil composite film

Also Published As

Publication number Publication date
DE1958811A1 (de) 1970-07-02
CH506230A (de) 1971-04-15
NL6818017A (enExample) 1970-06-16
BE743089A (enExample) 1970-06-12
BR6915013D0 (pt) 1973-01-02
FR2026186A1 (enExample) 1970-09-11
DK121806B (da) 1971-12-06
ES374491A1 (es) 1972-01-01
AT301666B (de) 1972-09-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee