GB1297954A - - Google Patents

Info

Publication number
GB1297954A
GB1297954A GB2218069A GB1297954DA GB1297954A GB 1297954 A GB1297954 A GB 1297954A GB 2218069 A GB2218069 A GB 2218069A GB 1297954D A GB1297954D A GB 1297954DA GB 1297954 A GB1297954 A GB 1297954A
Authority
GB
United Kingdom
Prior art keywords
slice
diaphragm
diaphragms
platen
enclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2218069A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1297954A publication Critical patent/GB1297954A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

1297954 Splitting JOSEPH LUCAS (INDUSTRIES) Ltd 2 April 1970 [1 May 1969] 22180/69 Heading B5E [Also in Division H1] A method of cracking a previously scribed semi-conductor slice 17 comprises trapping the slice between a pair of resilient diaphragms 13, 16 and distending the diaphragms to a domed configuration. The slice is treated to have a P-N junction therein and when cracked forms a plurality of P-N wafers constituting diodes. The apparatus for carrying out the method comprises a base 11 formed with a chamber 12 enclosed by a rubber diaphragm 13. A platen 14 is movable towards and away from the base and is formed with recess 15 enclosed by a diaphragm 16. In operation, the scribed slice is placed on diaphragm 13 and the platen 14 moved so that the slice is trapped between the diaphragms. Compressed air, gas or a liquid is then supplied to chamber 12 to cause the diaphragms to dome and crack the slice along the score lines. So that only bending, and not shear stresses act on the slice, the diaphragm 13 is thicker than diaphragm 16 and contains the neutral plane during doming.
GB2218069A 1969-05-01 1969-05-01 Expired GB1297954A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2218069 1969-05-01

Publications (1)

Publication Number Publication Date
GB1297954A true GB1297954A (en) 1972-11-29

Family

ID=10175251

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2218069A Expired GB1297954A (en) 1969-05-01 1969-05-01

Country Status (3)

Country Link
US (1) US3667661A (en)
JP (1) JPS4844051B1 (en)
GB (1) GB1297954A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3006314A1 (en) * 1980-02-20 1981-09-03 Robert Bosch Gmbh, 7000 Stuttgart Splitting device for semiconductor substrate plates - used for hybrid circuit mfr. using suction field with edges along substrate dividing lines
DE10007642A1 (en) * 2000-02-19 2001-11-29 Bosch Gmbh Robert Separating substrate with defined preferred break points involves applying separating blade to preferred break points with substrate held on rubber mat by suction
DE10345964A1 (en) * 2003-10-02 2005-05-04 Hans Joachim Weitzel Gmbh & Co Granulated material for spreading on large areas, e.g. artificial lawns, sports facilities or play areas, has a core containing rubber powder, mineral and binder and an outer layer of mineral material

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363548B1 (en) * 1988-10-10 1994-03-23 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150836A (en) 1998-11-06 2000-05-30 Canon Inc Processing system for sample
TW484184B (en) * 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
US6488565B1 (en) 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
JP2002353081A (en) 2001-05-25 2002-12-06 Canon Inc Device and method for separating plate member
JP2002353423A (en) * 2001-05-25 2002-12-06 Canon Inc Separation device and processing method of plate member
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
PL3516238T3 (en) * 2016-09-26 2021-12-06 Fluid Handling Llc. Multi-stage impeller produced via additive manufacturing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers
US3493155A (en) * 1969-05-05 1970-02-03 Nasa Apparatus and method for separating a semiconductor wafer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3006314A1 (en) * 1980-02-20 1981-09-03 Robert Bosch Gmbh, 7000 Stuttgart Splitting device for semiconductor substrate plates - used for hybrid circuit mfr. using suction field with edges along substrate dividing lines
DE10007642A1 (en) * 2000-02-19 2001-11-29 Bosch Gmbh Robert Separating substrate with defined preferred break points involves applying separating blade to preferred break points with substrate held on rubber mat by suction
DE10007642C2 (en) * 2000-02-19 2002-03-14 Bosch Gmbh Robert Process for separating substrates in utility format with predetermined breaking points
DE10345964A1 (en) * 2003-10-02 2005-05-04 Hans Joachim Weitzel Gmbh & Co Granulated material for spreading on large areas, e.g. artificial lawns, sports facilities or play areas, has a core containing rubber powder, mineral and binder and an outer layer of mineral material
DE10345964B4 (en) * 2003-10-02 2016-02-11 Hans-Joachim Weitzel Gmbh & Co. Kg Granules, process for its preparation and use

Also Published As

Publication number Publication date
US3667661A (en) 1972-06-06
JPS4844051B1 (en) 1973-12-22

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee