JPS4844051B1 - - Google Patents
Info
- Publication number
- JPS4844051B1 JPS4844051B1 JP3693170A JP3693170A JPS4844051B1 JP S4844051 B1 JPS4844051 B1 JP S4844051B1 JP 3693170 A JP3693170 A JP 3693170A JP 3693170 A JP3693170 A JP 3693170A JP S4844051 B1 JPS4844051 B1 JP S4844051B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
- B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2218069 | 1969-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4844051B1 true JPS4844051B1 (ja) | 1973-12-22 |
Family
ID=10175251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3693170A Pending JPS4844051B1 (ja) | 1969-05-01 | 1970-05-01 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3667661A (ja) |
| JP (1) | JPS4844051B1 (ja) |
| GB (1) | GB1297954A (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3006314A1 (de) * | 1980-02-20 | 1981-09-03 | Robert Bosch Gmbh, 7000 Stuttgart | Brecheinrichtung |
| DE3888685T2 (de) * | 1988-10-10 | 1994-10-20 | Ibm | Verfahren zum Brechen eines plattenförmigen Werkstücks, insbesondere eines Halbleiterplättchens, und Vorrichtung zum Brechen des genannten zwischen zwei Folien sandwichartig angeordneten Werkstücks. |
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| EP0989593A3 (en) * | 1998-09-25 | 2002-01-02 | Canon Kabushiki Kaisha | Substrate separating apparatus and method, and substrate manufacturing method |
| US6672358B2 (en) * | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
| JP2000150836A (ja) | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
| TW484184B (en) | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
| DE10007642C2 (de) * | 2000-02-19 | 2002-03-14 | Bosch Gmbh Robert | Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen |
| US6488565B1 (en) | 2000-08-29 | 2002-12-03 | Applied Materials, Inc. | Apparatus for chemical mechanical planarization having nested load cups |
| JP2002353423A (ja) * | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び処理方法 |
| JP2002353081A (ja) | 2001-05-25 | 2002-12-06 | Canon Inc | 板部材の分離装置及び分離方法 |
| DE10345964B4 (de) * | 2003-10-02 | 2016-02-11 | Hans-Joachim Weitzel Gmbh & Co. Kg | Granulat, Verfahren zu seiner Herstellung und Verwendung |
| CA2490849C (en) * | 2004-12-22 | 2009-12-22 | Ibm Canada Limited - Ibm Canada Limitee | An automated singularization tool for brittle insulating arrays |
| CN109996963B (zh) * | 2016-09-26 | 2021-01-26 | 流体处理有限责任公司 | 经由增材制造而产生的多级叶轮 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3182873A (en) * | 1961-09-11 | 1965-05-11 | Motorola Inc | Method for dicing semiconductor material |
| US3507426A (en) * | 1968-02-23 | 1970-04-21 | Rca Corp | Method of dicing semiconductor wafers |
| US3493155A (en) * | 1969-05-05 | 1970-02-03 | Nasa | Apparatus and method for separating a semiconductor wafer |
-
1969
- 1969-05-01 GB GB2218069A patent/GB1297954A/en not_active Expired
-
1970
- 1970-04-08 US US26734A patent/US3667661A/en not_active Expired - Lifetime
- 1970-05-01 JP JP3693170A patent/JPS4844051B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1297954A (ja) | 1972-11-29 |
| US3667661A (en) | 1972-06-06 |