GB1294801A - Tin, lead and indium alloys - Google Patents

Tin, lead and indium alloys

Info

Publication number
GB1294801A
GB1294801A GB2859771A GB2859771A GB1294801A GB 1294801 A GB1294801 A GB 1294801A GB 2859771 A GB2859771 A GB 2859771A GB 2859771 A GB2859771 A GB 2859771A GB 1294801 A GB1294801 A GB 1294801A
Authority
GB
United Kingdom
Prior art keywords
tin
lead
indium alloys
alloy
indium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2859771A
Other languages
English (en)
Inventor
Wentzle Ruml Deboskey
George Mcconnell Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1294801A publication Critical patent/GB1294801A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
GB2859771A 1970-09-17 1971-06-18 Tin, lead and indium alloys Expired GB1294801A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7291270A 1970-09-17 1970-09-17

Publications (1)

Publication Number Publication Date
GB1294801A true GB1294801A (en) 1972-11-01

Family

ID=22110514

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2859771A Expired GB1294801A (en) 1970-09-17 1971-06-18 Tin, lead and indium alloys

Country Status (6)

Country Link
BE (1) BE769784A (fr)
DE (1) DE2145091A1 (fr)
ES (1) ES395141A1 (fr)
FR (1) FR2105808A5 (fr)
GB (1) GB1294801A (fr)
NL (1) NL7111357A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5011658A (en) * 1989-05-31 1991-04-30 International Business Machines Corporation Copper doped low melt solder for component assembly and rework

Also Published As

Publication number Publication date
DE2145091A1 (de) 1972-03-23
BE769784A (fr) 1971-11-16
FR2105808A5 (fr) 1972-04-28
NL7111357A (fr) 1972-03-21
ES395141A1 (es) 1973-12-16

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Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed