GB1330019A - Soldering alloy - Google Patents

Soldering alloy

Info

Publication number
GB1330019A
GB1330019A GB4188771A GB4188771A GB1330019A GB 1330019 A GB1330019 A GB 1330019A GB 4188771 A GB4188771 A GB 4188771A GB 4188771 A GB4188771 A GB 4188771A GB 1330019 A GB1330019 A GB 1330019A
Authority
GB
United Kingdom
Prior art keywords
soldering alloy
sept
alloy
soldering
america
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4188771A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Howmet Aerospace Inc
Original Assignee
Aluminum Company of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aluminum Company of America filed Critical Aluminum Company of America
Publication of GB1330019A publication Critical patent/GB1330019A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/08—Alloys based on lead with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead

Abstract

1330019 Lead based alloy solder ALUMINUM CO OF AMERICA 8 Sept 1971 [10 Sept 1970] 41887/71 Heading C7A An alloy, for use in soldering aluminium members, consists, apart from incidental impurities, of:-
GB4188771A 1970-09-10 1971-09-08 Soldering alloy Expired GB1330019A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7128170A 1970-09-10 1970-09-10

Publications (1)

Publication Number Publication Date
GB1330019A true GB1330019A (en) 1973-09-12

Family

ID=22100362

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4188771A Expired GB1330019A (en) 1970-09-10 1971-09-08 Soldering alloy

Country Status (9)

Country Link
JP (1) JPS5347352B1 (en)
BE (1) BE772438A (en)
CA (1) CA963297A (en)
DE (1) DE2145184C3 (en)
FR (1) FR2107540A5 (en)
GB (1) GB1330019A (en)
IT (1) IT939407B (en)
NL (1) NL152477B (en)
SE (1) SE370891B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113924186A (en) * 2019-05-27 2022-01-11 千住金属工业株式会社 Solder alloy, solder powder, and solder joint

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123460A (en) * 1981-01-23 1982-07-31 Hitachi Ltd Hardware monitor system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113924186A (en) * 2019-05-27 2022-01-11 千住金属工业株式会社 Solder alloy, solder powder, and solder joint
CN113924186B (en) * 2019-05-27 2022-12-16 千住金属工业株式会社 Solder alloy, solder powder, and solder joint

Also Published As

Publication number Publication date
NL152477B (en) 1977-03-15
NL7112453A (en) 1972-03-14
AU3344471A (en) 1973-05-24
FR2107540A5 (en) 1972-05-05
DE2145184C3 (en) 1974-04-25
DE2145184B2 (en) 1973-09-27
CA963297A (en) 1975-02-25
BE772438A (en) 1972-03-10
IT939407B (en) 1973-02-10
SE370891B (en) 1974-11-04
JPS5347352B1 (en) 1978-12-20
DE2145184A1 (en) 1972-06-15

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee