GB1286737A - Multilevel conductive systems - Google Patents
Multilevel conductive systemsInfo
- Publication number
- GB1286737A GB1286737A GB4746270A GB4746270A GB1286737A GB 1286737 A GB1286737 A GB 1286737A GB 4746270 A GB4746270 A GB 4746270A GB 4746270 A GB4746270 A GB 4746270A GB 1286737 A GB1286737 A GB 1286737A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- channels
- silicon
- oct
- insulating layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 101100188555 Arabidopsis thaliana OCT6 gene Proteins 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86655569A | 1969-10-15 | 1969-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1286737A true GB1286737A (en) | 1972-08-23 |
Family
ID=25347860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4746270A Expired GB1286737A (en) | 1969-10-15 | 1970-10-06 | Multilevel conductive systems |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2049908B2 (enrdf_load_stackoverflow) |
| FR (1) | FR2066013A5 (enrdf_load_stackoverflow) |
| GB (1) | GB1286737A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0101960A1 (en) * | 1982-07-30 | 1984-03-07 | Hitachi, Ltd. | Method of manufacturing a semiconductor device having a self-aligned gate electrode |
| US5063175A (en) * | 1986-09-30 | 1991-11-05 | North American Philips Corp., Signetics Division | Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material |
| US5084414A (en) * | 1985-03-15 | 1992-01-28 | Hewlett-Packard Company | Metal interconnection system with a planar surface |
| EP0262719B1 (en) * | 1986-09-30 | 1993-12-15 | Koninklijke Philips Electronics N.V. | Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4960870A (enrdf_load_stackoverflow) * | 1972-10-16 | 1974-06-13 | ||
| US3844831A (en) * | 1972-10-27 | 1974-10-29 | Ibm | Forming a compact multilevel interconnection metallurgy system for semi-conductor devices |
| US3985597A (en) * | 1975-05-01 | 1976-10-12 | International Business Machines Corporation | Process for forming passivated metal interconnection system with a planar surface |
| US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
| DE3228399A1 (de) * | 1982-07-29 | 1984-02-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen einer monolithisch integrierten schaltung |
| JPS5982746A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | 半導体装置の電極配線方法 |
-
1970
- 1970-10-06 GB GB4746270A patent/GB1286737A/en not_active Expired
- 1970-10-10 DE DE19702049908 patent/DE2049908B2/de not_active Ceased
- 1970-10-15 FR FR7037272A patent/FR2066013A5/fr not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0101960A1 (en) * | 1982-07-30 | 1984-03-07 | Hitachi, Ltd. | Method of manufacturing a semiconductor device having a self-aligned gate electrode |
| US5084414A (en) * | 1985-03-15 | 1992-01-28 | Hewlett-Packard Company | Metal interconnection system with a planar surface |
| US5063175A (en) * | 1986-09-30 | 1991-11-05 | North American Philips Corp., Signetics Division | Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material |
| EP0262719B1 (en) * | 1986-09-30 | 1993-12-15 | Koninklijke Philips Electronics N.V. | Method for manufacturing a planar electrical interconnection utilizing isotropic deposition of conductive material |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2049908A1 (de) | 1971-04-22 |
| FR2066013A5 (enrdf_load_stackoverflow) | 1971-08-06 |
| DE2049908B2 (de) | 1976-03-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |