GB1279141A - A process for the electrodeposition of gold-copper-cadmium alloy coatings - Google Patents

A process for the electrodeposition of gold-copper-cadmium alloy coatings

Info

Publication number
GB1279141A
GB1279141A GB31750/69A GB3175069A GB1279141A GB 1279141 A GB1279141 A GB 1279141A GB 31750/69 A GB31750/69 A GB 31750/69A GB 3175069 A GB3175069 A GB 3175069A GB 1279141 A GB1279141 A GB 1279141A
Authority
GB
United Kingdom
Prior art keywords
gold
copper
cyanide
bath
electrodeposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB31750/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Deutsche Gold und Silber Scheideanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681771712 external-priority patent/DE1771712C3/de
Application filed by Degussa GmbH, Deutsche Gold und Silber Scheideanstalt filed Critical Degussa GmbH
Publication of GB1279141A publication Critical patent/GB1279141A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
GB31750/69A 1968-06-28 1969-06-24 A process for the electrodeposition of gold-copper-cadmium alloy coatings Expired GB1279141A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE283841X 1968-06-28
DE19681771712 DE1771712C3 (de) 1968-06-28 Verfahren zur galvanischen Abscheidung von Gold-Kupfer-Cadmium-LegierungsüberzUgen

Publications (1)

Publication Number Publication Date
GB1279141A true GB1279141A (en) 1972-06-28

Family

ID=25755604

Family Applications (1)

Application Number Title Priority Date Filing Date
GB31750/69A Expired GB1279141A (en) 1968-06-28 1969-06-24 A process for the electrodeposition of gold-copper-cadmium alloy coatings

Country Status (7)

Country Link
US (1) US3586611A (enExample)
AT (1) AT283841B (enExample)
CH (1) CH522740A (enExample)
FR (1) FR2011755A1 (enExample)
GB (1) GB1279141A (enExample)
NL (1) NL6906666A (enExample)
SE (1) SE345697B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2369239A (en) * 2000-11-17 2002-05-22 Univ Hong Kong Polytechnic Nickel oxyhydroxide and cadmium electrodes for storage cells
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH529843A (fr) * 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bain pour le dépôt électrolytique d'alliages d'or et son utilisation en galvanoplastie
US4179344A (en) * 1973-07-02 1979-12-18 Lea-Ronal, Inc. Gold alloy plating compositions and method
US4547436A (en) * 1982-11-19 1985-10-15 E. I. Du Pont De Nemours And Company Conductive element metallized with a thick film gold composition
US4486275A (en) * 1983-02-07 1984-12-04 Heinz Emmenegger Solution for electroplating a gold-copper-cadmium alloy
CH662583A5 (fr) * 1985-03-01 1987-10-15 Heinz Emmenegger Bain galvanique pour le depot electrolytique d'alliages d'or-cuivre-cadmium-zinc.
DE3929569C1 (enExample) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576114B1 (en) 1995-11-03 2003-06-10 Enthone Inc. Electroplating composition bath
GB2369239A (en) * 2000-11-17 2002-05-22 Univ Hong Kong Polytechnic Nickel oxyhydroxide and cadmium electrodes for storage cells

Also Published As

Publication number Publication date
NL6906666A (enExample) 1969-12-30
CH522740A (de) 1972-06-30
US3586611A (en) 1971-06-22
FR2011755A1 (enExample) 1970-03-06
AT283841B (de) 1970-08-25
SE345697B (enExample) 1972-06-05

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees