GB1268059A - Improvements relating to apparatus for mounting semiconductor chips - Google Patents

Improvements relating to apparatus for mounting semiconductor chips

Info

Publication number
GB1268059A
GB1268059A GB05261/69A GB1526169A GB1268059A GB 1268059 A GB1268059 A GB 1268059A GB 05261/69 A GB05261/69 A GB 05261/69A GB 1526169 A GB1526169 A GB 1526169A GB 1268059 A GB1268059 A GB 1268059A
Authority
GB
United Kingdom
Prior art keywords
substrate
tool
chip
probe
tools
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB05261/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1268059A publication Critical patent/GB1268059A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0446
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06Work-clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/16Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine controlled in conjunction with the operation of the tool
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q39/00Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
    • B23Q39/04Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps
    • B23Q39/042Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps with circular arrangement of the sub-assemblies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H10W72/0711
    • H10W72/073
    • H10W72/075
    • H10W72/07511
    • H10W72/534
    • H10W72/5434
    • H10W72/884
    • H10W90/734
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
GB05261/69A 1968-04-15 1969-03-24 Improvements relating to apparatus for mounting semiconductor chips Expired GB1268059A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72132568A 1968-04-15 1968-04-15

Publications (1)

Publication Number Publication Date
GB1268059A true GB1268059A (en) 1972-03-22

Family

ID=24897509

Family Applications (1)

Application Number Title Priority Date Filing Date
GB05261/69A Expired GB1268059A (en) 1968-04-15 1969-03-24 Improvements relating to apparatus for mounting semiconductor chips

Country Status (8)

Country Link
US (1) US3523352A (cg-RX-API-DMAC10.html)
BE (1) BE729755A (cg-RX-API-DMAC10.html)
CH (1) CH486823A (cg-RX-API-DMAC10.html)
DE (1) DE1916568B2 (cg-RX-API-DMAC10.html)
FR (1) FR2006223A1 (cg-RX-API-DMAC10.html)
GB (1) GB1268059A (cg-RX-API-DMAC10.html)
NL (2) NL160985B (cg-RX-API-DMAC10.html)
SE (1) SE353440B (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107214538A (zh) * 2017-07-14 2017-09-29 芜湖德丰汽车零部件有限公司 一种万向装夹装置
CN108188457A (zh) * 2018-04-10 2018-06-22 沈阳百祥机械加工有限公司 控制长桁零件加工过程纵向变形加工装置及其工艺
CN109433999A (zh) * 2018-12-03 2019-03-08 广东盛茂达自动控制科技有限公司 伸缩架自动铆压系统
CN111703899A (zh) * 2020-08-12 2020-09-25 江西铭德半导体科技有限公司 一种用于激光器芯片挑晶的治具
CN112518670A (zh) * 2020-11-30 2021-03-19 九江检安石化工程有限公司 高压螺纹锁紧环换热器螺栓拆卸专用工装
CN117245388A (zh) * 2023-11-16 2023-12-19 济南二机床新光机电有限公司 一种端拾器组装系统及组装方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710479A (en) * 1971-03-01 1973-01-16 Ibm Component insertion apparatus
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
DE2818534A1 (de) * 1978-04-27 1979-11-08 Reinhold Schecker Grossgewaechshaus fuer freilandkulturen
NL8700445A (nl) * 1986-02-28 1987-09-16 Nippon Seiko Kk Positioneertafel voor een samengestelde beweging.
US4877174A (en) * 1988-12-21 1989-10-31 International Business Machines Corporation Tab device excise and lead form apparatus
CN108962813B (zh) * 2018-09-06 2023-07-18 重庆科技学院 一种可调式芯片卡具
TWI743726B (zh) * 2019-04-15 2021-10-21 日商新川股份有限公司 封裝裝置
CN112318160B (zh) * 2020-10-29 2022-07-15 贵州天义电器有限责任公司 一种高压接触器动触片专用铣加工夹具
CN114334783A (zh) * 2021-12-31 2022-04-12 深圳新益昌科技股份有限公司 晶片安装装置
CN114310113B (zh) * 2022-01-10 2023-11-17 合肥埃科光电科技股份有限公司 一种插座焊接的辅助装置
CN115942615B (zh) * 2022-12-16 2023-08-04 江苏迪飞达电子有限公司 多层金属基板钻孔方法
CN116581013B (zh) * 2023-04-07 2024-08-06 国仪量子技术(合肥)股份有限公司 离子阱芯片更换系统
CN118270306B (zh) * 2024-06-03 2024-08-30 沈阳和研科技股份有限公司 一种多排芯片导向装置及自动装管机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3307763A (en) * 1963-06-28 1967-03-07 Kulicke And Soffa Mfg Company Thermocompression wire bonding apparatus with scissors cut-off
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
US3226810A (en) * 1964-06-26 1966-01-04 Ibm Apparatus for positioning transistor header
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107214538A (zh) * 2017-07-14 2017-09-29 芜湖德丰汽车零部件有限公司 一种万向装夹装置
CN108188457A (zh) * 2018-04-10 2018-06-22 沈阳百祥机械加工有限公司 控制长桁零件加工过程纵向变形加工装置及其工艺
CN109433999A (zh) * 2018-12-03 2019-03-08 广东盛茂达自动控制科技有限公司 伸缩架自动铆压系统
CN111703899A (zh) * 2020-08-12 2020-09-25 江西铭德半导体科技有限公司 一种用于激光器芯片挑晶的治具
CN112518670A (zh) * 2020-11-30 2021-03-19 九江检安石化工程有限公司 高压螺纹锁紧环换热器螺栓拆卸专用工装
CN117245388A (zh) * 2023-11-16 2023-12-19 济南二机床新光机电有限公司 一种端拾器组装系统及组装方法

Also Published As

Publication number Publication date
NL160985C (cg-RX-API-DMAC10.html) 1900-01-01
NL6905594A (cg-RX-API-DMAC10.html) 1969-10-17
NL160985B (nl) 1979-07-16
DE1916568B2 (de) 1971-09-16
CH486823A (de) 1970-02-28
BE729755A (cg-RX-API-DMAC10.html) 1969-08-18
SE353440B (cg-RX-API-DMAC10.html) 1973-01-29
US3523352A (en) 1970-08-11
FR2006223A1 (cg-RX-API-DMAC10.html) 1969-12-26
DE1916568A1 (de) 1969-10-30

Similar Documents

Publication Publication Date Title
GB1268059A (en) Improvements relating to apparatus for mounting semiconductor chips
WO2023045349A1 (zh) 多工位回转式微型探针全自动卷边机
CN102825406B (zh) 银点自动焊机
CN104670889A (zh) 变压器自动贴侧胶机
CN204088285U (zh) 一种新型芯片自动焊接装置
CN109244783B (zh) 一种内存条连接器的耐高温胶带粘贴装置
CN211759211U (zh) 一种手机中框铜箔自动点焊装置
US2915616A (en) Wire bender and connector
GB1343043A (en) Apparatus for welding contact pellets onto contact elements
CN208248691U (zh) 全自动高效贴标机
WO1986001971A1 (fr) Appareil d'insertion automatique de composants electroniques
GB759076A (en) Apparatus for welding contacts onto wires of electrical relay components
GB2008991A (en) Method and Apparatus for Transferring a Workpiece to and from a Machine Tool
GB882490A (en) Improvements relating to the ejection of workpieces from machine tools
CN212217477U (zh) 一种机器人镭切供料系统
GB1308217A (en) Bonding
JPS6221075A (ja) コンタクトプロ−ブピンの組立装置
GB1339613A (en) Apparatus for caulking terminals
JP2558933B2 (ja) アウターリードボンディング装置
CN222972801U (zh) 一种芯片生产用铆压设备
US2264330A (en) Can end assembling machine
TWI600240B (zh) 全自動rf端子鉚壓沾錫機
GB1315984A (en) Method and machine for making decorative bows
CN219173611U (zh) 双向载带的工件剥离转贴自动化设备
CN109944851A (zh) 一种动子贴附机