GB1259249A - - Google Patents
Info
- Publication number
- GB1259249A GB1259249A GB1259249DA GB1259249A GB 1259249 A GB1259249 A GB 1259249A GB 1259249D A GB1259249D A GB 1259249DA GB 1259249 A GB1259249 A GB 1259249A
- Authority
- GB
- United Kingdom
- Prior art keywords
- grid
- slot
- crystal
- slots
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013078 crystal Substances 0.000 abstract 6
- 210000001520 comb Anatomy 0.000 abstract 3
- 238000005520 cutting process Methods 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 239000004576 sand Substances 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000003491 array Methods 0.000 abstract 1
- 210000000988 bone and bone Anatomy 0.000 abstract 1
- 229920002678 cellulose Polymers 0.000 abstract 1
- 239000001913 cellulose Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 125000006850 spacer group Chemical group 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
1,259,249. Splitting. SIEMENS A.G. 19 June, 1970 [20 June, 1970], No. 29766/70. Heading B5E. [Also in Division B3] A method of separating a plate-shaped crystal 9 comprises placing the crystal with a main face upwards on a grid 5, the face of the grid supporting the crystal being provided with a slot 21, directing a sand jet from a nozzle 11 against the face of the crystal whilst effecting continuous relative movement between the nozzle and the slot of the grid in the longitudinal direction of the slot to cut the crystal along the line to the slot, and sucking away sand from the slot. In apparatus for carrying out the method, a base 2 adjustably supports the grid 5 above a pipe 4 connected to a suction device and is angularly indexable through 90 degrees to positions determined by engagement of an abutment 17 with stops 18. The nozzle 11, which may be of elongated shape, is carried by a blower 10 mounted for movement in two perpendicular directions parallel to the supporting surface of the grid. The latter consists of a frame 5a containing a plurality of combs 15 separated at their ends by spacers 16 whereby two arrays of slots 21, 24 are formed and gaps are formed between the combs to enable used sand to be sucked into the pipe 4. The tips of the combs act as the supporting surface on which discs 9 of crystal, such as silicon plates having metal coatings on their main faces and consisting of several zones parallel to the faces of alternating conductivity, are secured by cellulose varnish. The nozzle is then traversed above a slot 21 so as to cut the body and the process repeated along parallel slots 21. Thereafter the base is indexed through 90 degrees to effect cutting along the slots 24. Alternatively, a plurality of nozzles may be provided to produce a plurality of cuts simultaneously. The small bodies produced by cutting are then removed from the grid and etched for a short time to remove damage caused by the cutting operation. In an alternative form, the grid consists of a block having a plurality of perpendicularly arranged slots in its upper-surface, and the lower surface has a plurality of bones communicating with the slots for connection to the pipe.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691931335 DE1931335C3 (en) | 1969-06-20 | Method for separating a body from a disk-shaped crystal and device for carrying out this method |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1259249A true GB1259249A (en) | 1972-01-05 |
Family
ID=5737534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1259249D Expired GB1259249A (en) | 1969-06-20 | 1970-06-19 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3694972A (en) |
JP (1) | JPS5013510B1 (en) |
AT (1) | AT315241B (en) |
CH (1) | CH504783A (en) |
FR (1) | FR2046967B1 (en) |
GB (1) | GB1259249A (en) |
NL (1) | NL7008966A (en) |
SE (1) | SE351523B (en) |
ZA (1) | ZA704234B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2570638A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | METHOD FOR ABRASIVE FLUID JET CUTTING OF REINFORCED GLASS SHEET |
FR2570637A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | METHOD OF CUTTING GLASS OF VARIOUS THICKNESSES |
FR2570636A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | APPARATUS AND METHOD FOR SUPPORTING SHEET IN A FLUID JET CUTTING FACILITY |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3778935A (en) * | 1972-01-26 | 1973-12-18 | Pennwalt Corp | Abrading apparatus with rotary index table |
CH566643A5 (en) * | 1973-10-11 | 1975-09-15 | Bbc Brown Boveri & Cie | |
US3888054A (en) * | 1973-11-16 | 1975-06-10 | Western Electric Co | Method for abrasive cutting in a liquid |
US3866357A (en) * | 1974-06-06 | 1975-02-18 | Pennwalt Corp | Abrading apparatus |
DE2522346C3 (en) * | 1975-05-20 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Method for manufacturing semiconductor components |
JPS61159371A (en) * | 1984-12-28 | 1986-07-19 | Fuji Seiki Seizosho:Kk | Lapping method for silicone wafer for substrate of integrated circuit, etc. and blasting device therefor |
US5052155A (en) * | 1989-08-10 | 1991-10-01 | Emc Technology, Inc. | Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material |
DE4235091C2 (en) * | 1992-10-17 | 2001-09-06 | Trumpf Sachsen Gmbh | Liquid and abrasive supply for a fluid jet cutting system |
US6705925B1 (en) * | 2000-10-20 | 2004-03-16 | Lightwave Microsystems | Apparatus and method to dice integrated circuits from a wafer using a pressurized jet |
TW200406026A (en) * | 2002-09-13 | 2004-04-16 | Intercon Technology Inc | Jet singulation |
EP1873824B1 (en) * | 2002-09-13 | 2009-03-11 | Towa-Intercon Technology, Inc. | Jet singulation of a substrate |
US7153186B2 (en) * | 2002-09-13 | 2006-12-26 | Towa Intercon Technology, Inc. | Jet singulation |
DE10337920B4 (en) * | 2003-08-18 | 2008-08-28 | Schott Ag | Process for producing a plurality of components and intermediate product in the form of a layer composite |
US20060180579A1 (en) * | 2005-02-11 | 2006-08-17 | Towa Intercon Technology, Inc. | Multidirectional cutting chuck |
JP4791787B2 (en) * | 2005-09-22 | 2011-10-12 | Towa株式会社 | Cutting device using abrasive water jet |
JP2008284635A (en) * | 2007-05-16 | 2008-11-27 | Disco Abrasive Syst Ltd | Water jet machining method |
JP2008307639A (en) * | 2007-06-14 | 2008-12-25 | Disco Abrasive Syst Ltd | Water jet machining method |
JP6022862B2 (en) * | 2012-05-08 | 2016-11-09 | 株式会社不二製作所 | Hard brittle substrate cutting method and cutting device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US587892A (en) * | 1897-08-10 | M a t iiia s w a l t e k | ||
US1664159A (en) * | 1926-04-23 | 1928-03-27 | Elroy A Chase | Apparatus for producing ornamental background on stone |
GB794528A (en) * | 1955-10-07 | 1958-05-07 | William Howard Mead | Improvements in receivers for particulate material |
US3205104A (en) * | 1961-07-10 | 1965-09-07 | Litton Industries Inc | Fabrication of interdigital delay lines |
US3187412A (en) * | 1963-04-26 | 1965-06-08 | Gen Electric | Method of mounting and aligning transducers on delay lines |
US3262234A (en) * | 1963-10-04 | 1966-07-26 | Int Rectifier Corp | Method of forming a semiconductor rim by sandblasting |
US3453781A (en) * | 1966-03-30 | 1969-07-08 | Ibm | Tailoring microminiature components |
US3516204A (en) * | 1967-08-21 | 1970-06-23 | Pennwalt Corp | Abrading apparatus |
-
1970
- 1970-06-15 CH CH897770A patent/CH504783A/en not_active IP Right Cessation
- 1970-06-17 AT AT546470A patent/AT315241B/en not_active IP Right Cessation
- 1970-06-18 NL NL7008966A patent/NL7008966A/xx unknown
- 1970-06-19 GB GB1259249D patent/GB1259249A/en not_active Expired
- 1970-06-19 FR FR7022770A patent/FR2046967B1/fr not_active Expired
- 1970-06-20 JP JP5399070A patent/JPS5013510B1/ja active Pending
- 1970-06-22 SE SE08611/70A patent/SE351523B/xx unknown
- 1970-06-22 ZA ZA704234A patent/ZA704234B/en unknown
- 1970-06-26 US US50181A patent/US3694972A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2570638A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | METHOD FOR ABRASIVE FLUID JET CUTTING OF REINFORCED GLASS SHEET |
FR2570637A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | METHOD OF CUTTING GLASS OF VARIOUS THICKNESSES |
FR2570636A1 (en) * | 1984-09-27 | 1986-03-28 | Libbey Owens Ford Co | APPARATUS AND METHOD FOR SUPPORTING SHEET IN A FLUID JET CUTTING FACILITY |
GB2164879A (en) * | 1984-09-27 | 1986-04-03 | Libbey Owens Ford Co | Ultra-high pressure abrasive jet cutting of glass |
Also Published As
Publication number | Publication date |
---|---|
ZA704234B (en) | 1971-03-31 |
NL7008966A (en) | 1970-12-22 |
US3694972A (en) | 1972-10-03 |
JPS5013510B1 (en) | 1975-05-20 |
SE351523B (en) | 1972-11-27 |
FR2046967A1 (en) | 1971-03-12 |
DE1931335A1 (en) | 1970-12-23 |
DE1931335B2 (en) | 1976-03-11 |
AT315241B (en) | 1974-05-10 |
FR2046967B1 (en) | 1974-09-20 |
CH504783A (en) | 1971-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |