GB1259249A - - Google Patents

Info

Publication number
GB1259249A
GB1259249A GB1259249DA GB1259249A GB 1259249 A GB1259249 A GB 1259249A GB 1259249D A GB1259249D A GB 1259249DA GB 1259249 A GB1259249 A GB 1259249A
Authority
GB
United Kingdom
Prior art keywords
grid
slot
crystal
slots
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691931335 external-priority patent/DE1931335C3/en
Application filed filed Critical
Publication of GB1259249A publication Critical patent/GB1259249A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

1,259,249. Splitting. SIEMENS A.G. 19 June, 1970 [20 June, 1970], No. 29766/70. Heading B5E. [Also in Division B3] A method of separating a plate-shaped crystal 9 comprises placing the crystal with a main face upwards on a grid 5, the face of the grid supporting the crystal being provided with a slot 21, directing a sand jet from a nozzle 11 against the face of the crystal whilst effecting continuous relative movement between the nozzle and the slot of the grid in the longitudinal direction of the slot to cut the crystal along the line to the slot, and sucking away sand from the slot. In apparatus for carrying out the method, a base 2 adjustably supports the grid 5 above a pipe 4 connected to a suction device and is angularly indexable through 90 degrees to positions determined by engagement of an abutment 17 with stops 18. The nozzle 11, which may be of elongated shape, is carried by a blower 10 mounted for movement in two perpendicular directions parallel to the supporting surface of the grid. The latter consists of a frame 5a containing a plurality of combs 15 separated at their ends by spacers 16 whereby two arrays of slots 21, 24 are formed and gaps are formed between the combs to enable used sand to be sucked into the pipe 4. The tips of the combs act as the supporting surface on which discs 9 of crystal, such as silicon plates having metal coatings on their main faces and consisting of several zones parallel to the faces of alternating conductivity, are secured by cellulose varnish. The nozzle is then traversed above a slot 21 so as to cut the body and the process repeated along parallel slots 21. Thereafter the base is indexed through 90 degrees to effect cutting along the slots 24. Alternatively, a plurality of nozzles may be provided to produce a plurality of cuts simultaneously. The small bodies produced by cutting are then removed from the grid and etched for a short time to remove damage caused by the cutting operation. In an alternative form, the grid consists of a block having a plurality of perpendicularly arranged slots in its upper-surface, and the lower surface has a plurality of bones communicating with the slots for connection to the pipe.
GB1259249D 1969-06-20 1970-06-19 Expired GB1259249A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931335 DE1931335C3 (en) 1969-06-20 Method for separating a body from a disk-shaped crystal and device for carrying out this method

Publications (1)

Publication Number Publication Date
GB1259249A true GB1259249A (en) 1972-01-05

Family

ID=5737534

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1259249D Expired GB1259249A (en) 1969-06-20 1970-06-19

Country Status (9)

Country Link
US (1) US3694972A (en)
JP (1) JPS5013510B1 (en)
AT (1) AT315241B (en)
CH (1) CH504783A (en)
FR (1) FR2046967B1 (en)
GB (1) GB1259249A (en)
NL (1) NL7008966A (en)
SE (1) SE351523B (en)
ZA (1) ZA704234B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570638A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co METHOD FOR ABRASIVE FLUID JET CUTTING OF REINFORCED GLASS SHEET
FR2570637A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co METHOD OF CUTTING GLASS OF VARIOUS THICKNESSES
FR2570636A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co APPARATUS AND METHOD FOR SUPPORTING SHEET IN A FLUID JET CUTTING FACILITY

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
CH566643A5 (en) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
US3888054A (en) * 1973-11-16 1975-06-10 Western Electric Co Method for abrasive cutting in a liquid
US3866357A (en) * 1974-06-06 1975-02-18 Pennwalt Corp Abrading apparatus
DE2522346C3 (en) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Method for manufacturing semiconductor components
JPS61159371A (en) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Lapping method for silicone wafer for substrate of integrated circuit, etc. and blasting device therefor
US5052155A (en) * 1989-08-10 1991-10-01 Emc Technology, Inc. Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (en) * 1992-10-17 2001-09-06 Trumpf Sachsen Gmbh Liquid and abrasive supply for a fluid jet cutting system
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
TW200406026A (en) * 2002-09-13 2004-04-16 Intercon Technology Inc Jet singulation
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
DE10337920B4 (en) * 2003-08-18 2008-08-28 Schott Ag Process for producing a plurality of components and intermediate product in the form of a layer composite
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
JP4791787B2 (en) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 Cutting device using abrasive water jet
JP2008284635A (en) * 2007-05-16 2008-11-27 Disco Abrasive Syst Ltd Water jet machining method
JP2008307639A (en) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd Water jet machining method
JP6022862B2 (en) * 2012-05-08 2016-11-09 株式会社不二製作所 Hard brittle substrate cutting method and cutting device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587892A (en) * 1897-08-10 M a t iiia s w a l t e k
US1664159A (en) * 1926-04-23 1928-03-27 Elroy A Chase Apparatus for producing ornamental background on stone
GB794528A (en) * 1955-10-07 1958-05-07 William Howard Mead Improvements in receivers for particulate material
US3205104A (en) * 1961-07-10 1965-09-07 Litton Industries Inc Fabrication of interdigital delay lines
US3187412A (en) * 1963-04-26 1965-06-08 Gen Electric Method of mounting and aligning transducers on delay lines
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US3453781A (en) * 1966-03-30 1969-07-08 Ibm Tailoring microminiature components
US3516204A (en) * 1967-08-21 1970-06-23 Pennwalt Corp Abrading apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2570638A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co METHOD FOR ABRASIVE FLUID JET CUTTING OF REINFORCED GLASS SHEET
FR2570637A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co METHOD OF CUTTING GLASS OF VARIOUS THICKNESSES
FR2570636A1 (en) * 1984-09-27 1986-03-28 Libbey Owens Ford Co APPARATUS AND METHOD FOR SUPPORTING SHEET IN A FLUID JET CUTTING FACILITY
GB2164879A (en) * 1984-09-27 1986-04-03 Libbey Owens Ford Co Ultra-high pressure abrasive jet cutting of glass

Also Published As

Publication number Publication date
ZA704234B (en) 1971-03-31
NL7008966A (en) 1970-12-22
US3694972A (en) 1972-10-03
JPS5013510B1 (en) 1975-05-20
SE351523B (en) 1972-11-27
FR2046967A1 (en) 1971-03-12
DE1931335A1 (en) 1970-12-23
DE1931335B2 (en) 1976-03-11
AT315241B (en) 1974-05-10
FR2046967B1 (en) 1974-09-20
CH504783A (en) 1971-03-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees