JPS5013510B1 - - Google Patents

Info

Publication number
JPS5013510B1
JPS5013510B1 JP5399070A JP5399070A JPS5013510B1 JP S5013510 B1 JPS5013510 B1 JP S5013510B1 JP 5399070 A JP5399070 A JP 5399070A JP 5399070 A JP5399070 A JP 5399070A JP S5013510 B1 JPS5013510 B1 JP S5013510B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5399070A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691931335 external-priority patent/DE1931335C3/de
Application filed filed Critical
Publication of JPS5013510B1 publication Critical patent/JPS5013510B1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP5399070A 1969-06-20 1970-06-20 Pending JPS5013510B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931335 DE1931335C3 (de) 1969-06-20 Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens

Publications (1)

Publication Number Publication Date
JPS5013510B1 true JPS5013510B1 (ja) 1975-05-20

Family

ID=5737534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5399070A Pending JPS5013510B1 (ja) 1969-06-20 1970-06-20

Country Status (9)

Country Link
US (1) US3694972A (ja)
JP (1) JPS5013510B1 (ja)
AT (1) AT315241B (ja)
CH (1) CH504783A (ja)
FR (1) FR2046967B1 (ja)
GB (1) GB1259249A (ja)
NL (1) NL7008966A (ja)
SE (1) SE351523B (ja)
ZA (1) ZA704234B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
CH566643A5 (ja) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
US3888054A (en) * 1973-11-16 1975-06-10 Western Electric Co Method for abrasive cutting in a liquid
US3866357A (en) * 1974-06-06 1975-02-18 Pennwalt Corp Abrading apparatus
DE2522346C3 (de) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von Halbleiterbauelementen
CA1252711A (en) * 1984-09-27 1989-04-18 Richard A. Herrington Ultra-high pressure abrasive jet cutting of glass
US4702042A (en) * 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPS61159371A (ja) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Ｉｃの基板用シリコンウェーハのブラスト装置
US5052155A (en) * 1989-08-10 1991-10-01 Emc Technology, Inc. Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (de) * 1992-10-17 2001-09-06 Trumpf Sachsen Gmbh Flüssigkeits- und Abrasivmittelzuführung für eine Fluidstrahlschneidanlage
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
TW200406026A (en) * 2002-09-13 2004-04-16 Intercon Technology Inc Jet singulation
DE10337920B4 (de) * 2003-08-18 2008-08-28 Schott Ag Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
JP4791787B2 (ja) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 アブレイシブウォータジェットを使用した切断装置
JP2008284635A (ja) * 2007-05-16 2008-11-27 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP2008307639A (ja) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd ウォータジェット加工方法
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587892A (en) * 1897-08-10 M a t iiia s w a l t e k
US1664159A (en) * 1926-04-23 1928-03-27 Elroy A Chase Apparatus for producing ornamental background on stone
GB794528A (en) * 1955-10-07 1958-05-07 William Howard Mead Improvements in receivers for particulate material
US3205104A (en) * 1961-07-10 1965-09-07 Litton Industries Inc Fabrication of interdigital delay lines
US3187412A (en) * 1963-04-26 1965-06-08 Gen Electric Method of mounting and aligning transducers on delay lines
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US3453781A (en) * 1966-03-30 1969-07-08 Ibm Tailoring microminiature components
US3516204A (en) * 1967-08-21 1970-06-23 Pennwalt Corp Abrading apparatus

Also Published As

Publication number Publication date
ZA704234B (en) 1971-03-31
DE1931335B2 (de) 1976-03-11
US3694972A (en) 1972-10-03
AT315241B (de) 1974-05-10
GB1259249A (ja) 1972-01-05
SE351523B (ja) 1972-11-27
NL7008966A (ja) 1970-12-22
FR2046967B1 (ja) 1974-09-20
DE1931335A1 (de) 1970-12-23
CH504783A (de) 1971-03-15
FR2046967A1 (ja) 1971-03-12

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