CH504783A - Method for separating a body from a disk-shaped crystal and device for carrying out this method - Google Patents

Method for separating a body from a disk-shaped crystal and device for carrying out this method

Info

Publication number
CH504783A
CH504783A CH897770A CH897770A CH504783A CH 504783 A CH504783 A CH 504783A CH 897770 A CH897770 A CH 897770A CH 897770 A CH897770 A CH 897770A CH 504783 A CH504783 A CH 504783A
Authority
CH
Switzerland
Prior art keywords
separating
disk
carrying
shaped crystal
crystal
Prior art date
Application number
CH897770A
Other languages
German (de)
Inventor
Reimer Dr Emeis
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691931335 external-priority patent/DE1931335C3/en
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH504783A publication Critical patent/CH504783A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CH897770A 1969-06-20 1970-06-15 Method for separating a body from a disk-shaped crystal and device for carrying out this method CH504783A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931335 DE1931335C3 (en) 1969-06-20 Method for separating a body from a disk-shaped crystal and device for carrying out this method

Publications (1)

Publication Number Publication Date
CH504783A true CH504783A (en) 1971-03-15

Family

ID=5737534

Family Applications (1)

Application Number Title Priority Date Filing Date
CH897770A CH504783A (en) 1969-06-20 1970-06-15 Method for separating a body from a disk-shaped crystal and device for carrying out this method

Country Status (9)

Country Link
US (1) US3694972A (en)
JP (1) JPS5013510B1 (en)
AT (1) AT315241B (en)
CH (1) CH504783A (en)
FR (1) FR2046967B1 (en)
GB (1) GB1259249A (en)
NL (1) NL7008966A (en)
SE (1) SE351523B (en)
ZA (1) ZA704234B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778935A (en) * 1972-01-26 1973-12-18 Pennwalt Corp Abrading apparatus with rotary index table
CH566643A5 (en) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
US3888054A (en) * 1973-11-16 1975-06-10 Western Electric Co Method for abrasive cutting in a liquid
US3866357A (en) * 1974-06-06 1975-02-18 Pennwalt Corp Abrading apparatus
DE2522346C3 (en) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Method for manufacturing semiconductor components
US4702042A (en) * 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
CA1252711A (en) * 1984-09-27 1989-04-18 Richard A. Herrington Ultra-high pressure abrasive jet cutting of glass
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
JPS61159371A (en) * 1984-12-28 1986-07-19 Fuji Seiki Seizosho:Kk Lapping method for silicone wafer for substrate of integrated circuit, etc. and blasting device therefor
US5052155A (en) * 1989-08-10 1991-10-01 Emc Technology, Inc. Apparatus for the treatment of articles by high velocity impacting thereof with a particulate abrasive material
DE4235091C2 (en) * 1992-10-17 2001-09-06 Trumpf Sachsen Gmbh Liquid and abrasive supply for a fluid jet cutting system
US6705925B1 (en) * 2000-10-20 2004-03-16 Lightwave Microsystems Apparatus and method to dice integrated circuits from a wafer using a pressurized jet
EP1873824B1 (en) * 2002-09-13 2009-03-11 Towa-Intercon Technology, Inc. Jet singulation of a substrate
US7153186B2 (en) * 2002-09-13 2006-12-26 Towa Intercon Technology, Inc. Jet singulation
CN1703774A (en) * 2002-09-13 2005-11-30 东和－英特康科技公司 Jet singulation of a substrate
DE10337920B4 (en) * 2003-08-18 2008-08-28 Schott Ag Process for producing a plurality of components and intermediate product in the form of a layer composite
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
JP4791787B2 (en) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 Cutting device using abrasive water jet
JP2008284635A (en) * 2007-05-16 2008-11-27 Disco Abrasive Syst Ltd Water jet machining method
JP2008307639A (en) * 2007-06-14 2008-12-25 Disco Abrasive Syst Ltd Water jet machining method
JP6022862B2 (en) * 2012-05-08 2016-11-09 株式会社不二製作所 Hard brittle substrate cutting method and cutting device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US587892A (en) * 1897-08-10 M a t iiia s w a l t e k
US1664159A (en) * 1926-04-23 1928-03-27 Elroy A Chase Apparatus for producing ornamental background on stone
GB794528A (en) * 1955-10-07 1958-05-07 William Howard Mead Improvements in receivers for particulate material
US3205104A (en) * 1961-07-10 1965-09-07 Litton Industries Inc Fabrication of interdigital delay lines
US3187412A (en) * 1963-04-26 1965-06-08 Gen Electric Method of mounting and aligning transducers on delay lines
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
US3453781A (en) * 1966-03-30 1969-07-08 Ibm Tailoring microminiature components
US3516204A (en) * 1967-08-21 1970-06-23 Pennwalt Corp Abrading apparatus

Also Published As

Publication number Publication date
ZA704234B (en) 1971-03-31
FR2046967A1 (en) 1971-03-12
DE1931335B2 (en) 1976-03-11
NL7008966A (en) 1970-12-22
GB1259249A (en) 1972-01-05
AT315241B (en) 1974-05-10
US3694972A (en) 1972-10-03
FR2046967B1 (en) 1974-09-20
DE1931335A1 (en) 1970-12-23
JPS5013510B1 (en) 1975-05-20
SE351523B (en) 1972-11-27

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Legal Events

Date Code Title Description
PL Patent ceased