FR2321374A1 - PROCESS FOR CUTTING HARD AND BREAKING MATERIALS, IN PARTICULAR SEMICONDUCTOR MATERIALS, AND RECIPROCATING CHASSIS SAW INTENDED FOR THE IMPLEMENTATION OF THE SAID PROCESS - Google Patents

PROCESS FOR CUTTING HARD AND BREAKING MATERIALS, IN PARTICULAR SEMICONDUCTOR MATERIALS, AND RECIPROCATING CHASSIS SAW INTENDED FOR THE IMPLEMENTATION OF THE SAID PROCESS

Info

Publication number
FR2321374A1
FR2321374A1 FR7625111A FR7625111A FR2321374A1 FR 2321374 A1 FR2321374 A1 FR 2321374A1 FR 7625111 A FR7625111 A FR 7625111A FR 7625111 A FR7625111 A FR 7625111A FR 2321374 A1 FR2321374 A1 FR 2321374A1
Authority
FR
France
Prior art keywords
materials
chassis
reciprocating
implementation
particular semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7625111A
Other languages
French (fr)
Other versions
FR2321374B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19752537088 external-priority patent/DE2537088C3/en
Priority claimed from DE19762611520 external-priority patent/DE2611520A1/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2321374A1 publication Critical patent/FR2321374A1/en
Application granted granted Critical
Publication of FR2321374B1 publication Critical patent/FR2321374B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D51/00—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends
    • B23D51/04—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for feeding, positioning, clamping, or rotating work
    • B23D51/046—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for feeding, positioning, clamping, or rotating work for feeding work into engagement with the saw blade, e.g. rotating work while sawing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
FR7625111A 1975-08-20 1976-08-18 PROCESS FOR CUTTING HARD AND BREAKING MATERIALS, IN PARTICULAR SEMICONDUCTOR MATERIALS, AND RECIPROCATING CHASSIS SAW INTENDED FOR THE IMPLEMENTATION OF THE SAID PROCESS Granted FR2321374A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19752537088 DE2537088C3 (en) 1975-08-20 1975-08-20 Arrangement for dividing hard, brittle material, in particular semiconductor material
DE19762611520 DE2611520A1 (en) 1976-03-18 1976-03-18 Hard brittle material slicing machine - uses low frequency high amplitude work piece oscillations with reciprocal blade oscillations

Publications (2)

Publication Number Publication Date
FR2321374A1 true FR2321374A1 (en) 1977-03-18
FR2321374B1 FR2321374B1 (en) 1982-07-09

Family

ID=25769296

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7625111A Granted FR2321374A1 (en) 1975-08-20 1976-08-18 PROCESS FOR CUTTING HARD AND BREAKING MATERIALS, IN PARTICULAR SEMICONDUCTOR MATERIALS, AND RECIPROCATING CHASSIS SAW INTENDED FOR THE IMPLEMENTATION OF THE SAID PROCESS

Country Status (4)

Country Link
JP (1) JPS5226092A (en)
CH (1) CH602302A5 (en)
FR (1) FR2321374A1 (en)
GB (1) GB1533456A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2401753A1 (en) * 1977-08-31 1979-03-30 Wacker Chemitronic DEVICE AND METHOD FOR MACHINING PARTS BY ABRASION
CN109591211A (en) * 2019-01-03 2019-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Crystal-cut device and method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554125A (en) * 1978-10-15 1980-04-21 Nippon Telegr & Teleph Corp <Ntt> Cutting machine
US4920946A (en) * 1987-03-03 1990-05-01 Applied Magnetic Lab. Co., Ltd. Blade cutting apparatus for hard brittle material
JP4578637B2 (en) * 2000-07-24 2010-11-10 サムコ オレゴン コーポレーション Interval holder and cutting method using the same
CN108556159B (en) * 2018-01-11 2023-12-15 王金生 Multi-saw-blade cutting device
CN109454765B (en) * 2019-01-09 2023-09-08 泉州市大鲨鱼机械科技有限公司 Diamond string bead wire saw
CN112885769B (en) * 2021-02-02 2022-12-06 安徽明洋电子有限公司 Clamping equipment for diode processing and working method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH222850A (en) * 1939-12-27 1942-08-15 Biermann Oscar Saw blade for gang saws.
US2967381A (en) * 1958-04-07 1961-01-10 Bendix Corp Means for cutting
GB1176431A (en) * 1968-06-07 1970-01-01 Elektromat Veb Process and apparatus for Cutting Discs from a Hard Material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH222850A (en) * 1939-12-27 1942-08-15 Biermann Oscar Saw blade for gang saws.
US2967381A (en) * 1958-04-07 1961-01-10 Bendix Corp Means for cutting
GB1176431A (en) * 1968-06-07 1970-01-01 Elektromat Veb Process and apparatus for Cutting Discs from a Hard Material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2401753A1 (en) * 1977-08-31 1979-03-30 Wacker Chemitronic DEVICE AND METHOD FOR MACHINING PARTS BY ABRASION
CN109591211A (en) * 2019-01-03 2019-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Crystal-cut device and method
CN109591211B (en) * 2019-01-03 2021-06-18 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Crystal cutting device and method

Also Published As

Publication number Publication date
JPS5226092A (en) 1977-02-26
CH602302A5 (en) 1978-07-31
FR2321374B1 (en) 1982-07-09
GB1533456A (en) 1978-11-22

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Legal Events

Date Code Title Description
ST Notification of lapse