GB1258514A - - Google Patents
Info
- Publication number
- GB1258514A GB1258514A GB1258514DA GB1258514A GB 1258514 A GB1258514 A GB 1258514A GB 1258514D A GB1258514D A GB 1258514DA GB 1258514 A GB1258514 A GB 1258514A
- Authority
- GB
- United Kingdom
- Prior art keywords
- finishing
- ring
- receiver
- workpieces
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000969 carrier Substances 0.000 abstract 2
- 238000006073 displacement reaction Methods 0.000 abstract 2
- 239000002002 slurry Substances 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 abstract 1
- 239000010432 diamond Substances 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 239000003921 oil Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US71535068A | 1968-03-22 | 1968-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1258514A true GB1258514A (enrdf_load_stackoverflow) | 1971-12-30 |
Family
ID=24873677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1258514D Expired GB1258514A (enrdf_load_stackoverflow) | 1968-03-22 | 1969-02-20 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3550325A (enrdf_load_stackoverflow) |
| DE (1) | DE1914082C3 (enrdf_load_stackoverflow) |
| FR (1) | FR1600784A (enrdf_load_stackoverflow) |
| GB (1) | GB1258514A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2144354A (en) * | 1983-07-15 | 1985-03-06 | Helical Springs Limited | Grinding apparatus |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
| US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
| DE19756536A1 (de) * | 1997-12-18 | 1999-07-01 | Wacker Siltronic Halbleitermat | Verfahren zum Polieren von scheibenförmigen Werkstücken und Vorrichtung zur Durchführung des Verfahrens |
| DE10004578C1 (de) * | 2000-02-03 | 2001-07-26 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante |
| RU2175283C1 (ru) * | 2000-06-22 | 2001-10-27 | Воронежская государственная технологическая академия | Устройство для шлифовки полупроводниковых пластин |
| RU2191674C1 (ru) * | 2001-08-06 | 2002-10-27 | Государственное образовательное учреждение Воронежская государственная технологическая академия | Устройство для шлифования полупроводниковых пластин |
| US20040157539A1 (en) * | 2002-07-26 | 2004-08-12 | Stenftenagel John R. | Scuffing machine for finishing wood products |
| CN111515838A (zh) * | 2019-07-23 | 2020-08-11 | 杭州友邻电子有限公司 | 一种高效率的智能锁外壳加工设备 |
| CN110918338A (zh) * | 2019-10-17 | 2020-03-27 | 福清市海威钓具有限公司 | 一种环保型鱼竿喷漆装置及喷漆工艺 |
| CN112123197B (zh) * | 2020-09-24 | 2024-03-22 | 郑州方铭高温陶瓷新材料有限公司 | 一种双轨道滑板砖平面研磨机 |
| CN113997176B (zh) * | 2021-10-21 | 2023-02-28 | 西安银马实业发展有限公司 | 磨头自浮动石材磨削抛光机 |
-
1968
- 1968-03-22 US US715350A patent/US3550325A/en not_active Expired - Lifetime
- 1968-12-30 FR FR1600784D patent/FR1600784A/fr not_active Expired
-
1969
- 1969-02-20 GB GB1258514D patent/GB1258514A/en not_active Expired
- 1969-03-20 DE DE1914082A patent/DE1914082C3/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2144354A (en) * | 1983-07-15 | 1985-03-06 | Helical Springs Limited | Grinding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| US3550325A (en) | 1970-12-29 |
| DE1914082C3 (de) | 1980-03-13 |
| DE1914082B2 (de) | 1979-07-05 |
| FR1600784A (enrdf_load_stackoverflow) | 1970-07-27 |
| DE1914082A1 (de) | 1969-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |