GB1254576A - Electrolytic copper plating bath and a method for depositing copper films therefrom - Google Patents
Electrolytic copper plating bath and a method for depositing copper films therefromInfo
- Publication number
- GB1254576A GB1254576A GB28519/69A GB2851969A GB1254576A GB 1254576 A GB1254576 A GB 1254576A GB 28519/69 A GB28519/69 A GB 28519/69A GB 2851969 A GB2851969 A GB 2851969A GB 1254576 A GB1254576 A GB 1254576A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ions
- mole
- film
- electro
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
1,254,576. Electro-depositing copper. INTERNATIONAL BUSINESS MACHINES CORP. June 5, 1969 [June 17, 1968], No.28519/69. Heading C7B. A thick (3-12 microns) Cu film is electrodeposited from an aquous plating bath comprising Cu ions e.g. 0.20-0.36 mole/l, SO 4 ions e.g. 0.21-0.47 mole/l, NO 3 ions e.g. 0.22-0.52 mole/l, formic acid e.g. 0.21-0.62 mole/l, acetic acid e.g. 0.10-0.32 mole/ l, and optionally a surfactant e.g. 0.4-0.7 g/l (Registered Trade Mark), "Triton" in which the molar ratio of SO 4 to NO 3 ions is 0.52- 1.90. Cu SO 4 may be the source of SO 4 and Cu ions, with HNO 3 ; or Cu (NO 3 ) 2 may be the source of NO 3 and Cu ions, with H 2 SO 4 . The bath is preferably flowed over the area to be plated while passing a current of density 40-50 ma/cm<SP>2</SP>. The invention is preferably used to electro-plate a thick Cu film on to a permalloy film, such as electro-deposited by the method disclosed in Specification 1, 139, 987, in the formation of a magnetic coupled film memory device (see Specification 1, 254, 575.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73736768A | 1968-06-17 | 1968-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1254576A true GB1254576A (en) | 1971-11-24 |
Family
ID=24963642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB28519/69A Expired GB1254576A (en) | 1968-06-17 | 1969-06-05 | Electrolytic copper plating bath and a method for depositing copper films therefrom |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3527681A (en) |
| DE (1) | DE1929563A1 (en) |
| FR (1) | FR2011036A1 (en) |
| GB (1) | GB1254576A (en) |
-
1968
- 1968-06-17 US US737367A patent/US3527681A/en not_active Expired - Lifetime
-
1969
- 1969-04-29 FR FR6912339A patent/FR2011036A1/fr not_active Withdrawn
- 1969-06-05 GB GB28519/69A patent/GB1254576A/en not_active Expired
- 1969-06-11 DE DE19691929563 patent/DE1929563A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3527681A (en) | 1970-09-08 |
| DE1929563A1 (en) | 1970-02-12 |
| FR2011036A1 (en) | 1970-02-27 |
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