GB1238695A - - Google Patents
Info
- Publication number
- GB1238695A GB1238695A GB1238695DA GB1238695A GB 1238695 A GB1238695 A GB 1238695A GB 1238695D A GB1238695D A GB 1238695DA GB 1238695 A GB1238695 A GB 1238695A
- Authority
- GB
- United Kingdom
- Prior art keywords
- islands
- frame
- semi
- conductor
- july
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4774467 | 1967-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1238695A true GB1238695A (de) | 1971-07-07 |
Family
ID=12783841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1238695D Expired GB1238695A (de) | 1967-07-25 | 1968-07-24 |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1764718A1 (de) |
GB (1) | GB1238695A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2221092A (en) * | 1988-07-19 | 1990-01-24 | Tektronix Inc | "a semiconductor integrated circuit with temperature sensor" |
-
1968
- 1968-07-24 DE DE19681764718 patent/DE1764718A1/de active Pending
- 1968-07-24 GB GB1238695D patent/GB1238695A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2221092A (en) * | 1988-07-19 | 1990-01-24 | Tektronix Inc | "a semiconductor integrated circuit with temperature sensor" |
GB2221092B (en) * | 1988-07-19 | 1992-06-03 | Tektronix Inc | Integrated circuit and method of treating an integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
DE1764718A1 (de) | 1971-10-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1193837A (en) | Improvements in or relating to Face Bonding of Semiconductor Devices | |
GB1147469A (en) | Semiconductor devices, integrated circuits and methods for making same | |
GB1261067A (en) | Improvements in and relating to methods of manufacturing semiconductor devices | |
JPH06500668A (ja) | Cmos技術のモノリシック集積センサ回路 | |
GB1238695A (de) | ||
JPS5743453A (en) | Integrated circuit | |
GB1036051A (en) | Microelectronic device | |
GB945736A (en) | Improvements relating to semiconductor circuits | |
MY6900312A (en) | Semiconductor devices and methods of fabricating same | |
JPS52122090A (en) | Semiconductor integrated circuit device | |
JPH0661439A (ja) | 半導体集積回路装置 | |
JPH0711474Y2 (ja) | 半導体装置 | |
JPH01231361A (ja) | 半導体装置 | |
JPH04309267A (ja) | 入力保護回路を有する半導体装置 | |
JPS56110260A (en) | Semiconductor device | |
JPS638810A (ja) | 電源回路 | |
JPH0440867B2 (de) | ||
KR970051077A (ko) | 반도체 메모리 장치의 입력 패드의 회로 | |
GB1107343A (en) | Microminiaturised, integrated circuit arrangement | |
JPH0260260U (de) | ||
JPS51114884A (en) | Semiconductor ic devices and their manufacturing method | |
JPH04271142A (ja) | 半導体集積回路装置 | |
JPS52109376A (en) | Semiconductor integrated circuit | |
JPS6466963A (en) | Semiconductor integrated circuit | |
JPH02206126A (ja) | バイポーラ型半導体集積回路装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |