GB1233859A - - Google Patents
Info
- Publication number
- GB1233859A GB1233859A GB1233859DA GB1233859A GB 1233859 A GB1233859 A GB 1233859A GB 1233859D A GB1233859D A GB 1233859DA GB 1233859 A GB1233859 A GB 1233859A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hydrochloride
- vol
- soldering
- isopropanol
- oct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
1,233,859. Soldering. INTERNATIONAL BUSINESS MACHINES CORP. 22 Oct., 1969 [23 Oct., 1968], No. 51662/69. Heading B3R. [Also in Division C7] Water-soluble liquid fluxes for soldering comprise: (a) triethylene glycol or higher molecular weight polymer of ethylene glycol; (b) at least one of n-butanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butyoxyethanol; (c) at least one of methanol, ethanol, isopropanol; (d) at least one of dimethylamine hydrochloride, diethylamine hydrochloride, monoethanolamine hydrochloride. They may also contain malic, citric, tartaric or oxalic acid e.g. 25-75 g./l. tartaric acid. Hydrochloride content sufficient to yield 0À7- 20 g./l. Cle.g. 1À6-46 g./l. dimethylamine hydrochloride. Preferred composition: 24% vol. methanol, 13% vol. isopropanol, 29% vol. 2-butoxyethanol, 31% vol. polyethylene glycol 400, 6.25 g./l. dimethylamine hydrochloride, 50 g./l. tartaric acid. In soldering e.g. printed circuit using Pb-Sn eutectic solder, the flux is applied to the site, heated to e.g. 110‹ C. to activate, depositing molten solder e.g. 260‹ C., cooling and removing flux residue by water wash.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR6009464 | 1968-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1233859A true GB1233859A (en) | 1971-06-03 |
Family
ID=8970839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1233859D Expired GB1233859A (en) | 1968-10-23 | 1969-10-22 |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR1592166A (en) |
| GB (1) | GB1233859A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2212521A (en) * | 1986-10-02 | 1989-07-26 | Toyo Kohan Co Ltd | Method for post-treatment of plated steel sheet for soldering |
| EP0346070A1 (en) * | 1988-06-07 | 1989-12-13 | Johnson Matthey Public Limited Company | Solder paste |
| EP0430772A2 (en) * | 1989-11-24 | 1991-06-05 | Nippondenso Co., Ltd. | Water-soluble soldering flux |
-
1968
- 1968-10-23 FR FR1592166D patent/FR1592166A/fr not_active Expired
-
1969
- 1969-10-22 GB GB1233859D patent/GB1233859A/en not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2212521A (en) * | 1986-10-02 | 1989-07-26 | Toyo Kohan Co Ltd | Method for post-treatment of plated steel sheet for soldering |
| GB2212521B (en) * | 1986-10-02 | 1992-07-22 | Toyo Kohan Co Ltd | Method for post-treatment of plated steel sheet for soldering |
| EP0346070A1 (en) * | 1988-06-07 | 1989-12-13 | Johnson Matthey Public Limited Company | Solder paste |
| EP0430772A2 (en) * | 1989-11-24 | 1991-06-05 | Nippondenso Co., Ltd. | Water-soluble soldering flux |
| EP0430772A3 (en) * | 1989-11-24 | 1992-01-02 | Nippondenso Co., Ltd. | Water-soluble soldering flux |
| AU635794B2 (en) * | 1989-11-24 | 1993-04-01 | Nippondenso Co. Ltd. | Water-soluble soldering flux |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1953218A1 (en) | 1970-05-06 |
| FR1592166A (en) | 1970-05-11 |
| DE1953218B2 (en) | 1977-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |