GB1222905A - Method of terminating a lamp filament - Google Patents

Method of terminating a lamp filament

Info

Publication number
GB1222905A
GB1222905A GB47285/69A GB4728569A GB1222905A GB 1222905 A GB1222905 A GB 1222905A GB 47285/69 A GB47285/69 A GB 47285/69A GB 4728569 A GB4728569 A GB 4728569A GB 1222905 A GB1222905 A GB 1222905A
Authority
GB
United Kingdom
Prior art keywords
wire
lead
gold
filament
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB47285/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chicago Miniature Lamp Inc
Original Assignee
Chicago Miniature Lamp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chicago Miniature Lamp Inc filed Critical Chicago Miniature Lamp Inc
Publication of GB1222905A publication Critical patent/GB1222905A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K1/00—Details
    • H01K1/02—Incandescent bodies
    • H01K1/16—Electric connection thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01K—ELECTRIC INCANDESCENT LAMPS
    • H01K3/00—Apparatus or processes adapted to the manufacture, installing, removal, or maintenance of incandescent lamps or parts thereof
    • H01K3/06—Attaching of incandescent bodies to mount
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/485—Material
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
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    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/207—Diameter ranges
    • H01L2924/20755—Diameter ranges larger or equal to 50 microns less than 60 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Processing (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)

Abstract

1,222,905. Welding by pressure. CHICAGO MINIATURE LAMP WORKS. 25 Sept., 1969 [4 Oct., 1968], No. 47285/69. Heading B3R. [Also in Division H1] A method of securing a tungsten lamp filament 10 to a metal lead-in wire 12 comprises the following steps:- (1) Coating the end of the lead-in wire with gold; (2) Placing the filament across the coated end of the lead-in wire; (3) Placing a body 14 of gold on the filament and over the coated end of the lead-in wire; (4) Heating the body to a temperature below the melting point of gold but above the point at which diffusion of gold begins; and (5) Applying pressure to the body to cause the gold to surround the filament and form a diffusion bond with the coating on the lead-in wire. The body 14 is preferably formed as a ball 6-8 mils in diameter on the end of a 1À5 mil diameter wire 16, and the pressure is applied by a member 18 having a 2 mil diameter bore through which the wire passes. The lead-in wire 12 may be made of copper or dumet, and the temperature to which the body is heated may be in the range 600-650‹ C.
GB47285/69A 1968-10-04 1969-09-25 Method of terminating a lamp filament Expired GB1222905A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76514968A 1968-10-04 1968-10-04

Publications (1)

Publication Number Publication Date
GB1222905A true GB1222905A (en) 1971-02-17

Family

ID=25072777

Family Applications (1)

Application Number Title Priority Date Filing Date
GB47285/69A Expired GB1222905A (en) 1968-10-04 1969-09-25 Method of terminating a lamp filament

Country Status (4)

Country Link
US (1) US3561084A (en)
DE (1) DE1949869A1 (en)
FR (1) FR2019895A1 (en)
GB (1) GB1222905A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2158757A (en) * 1984-05-14 1985-11-20 Pal Gal Hot press welding process

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3762029A (en) * 1971-08-04 1973-10-02 Ferranti Ltd Manufacture of supports for semiconductor devices
US3826000A (en) * 1972-05-18 1974-07-30 Essex International Inc Terminating of electrical conductors
US4038743A (en) * 1972-05-18 1977-08-02 Essex International, Inc. Terminating and splicing electrical conductors
GB1434833A (en) * 1972-06-02 1976-05-05 Siemens Ag Solder carrying electrical connector wires
CA2278020A1 (en) * 1997-01-16 1998-07-23 Ford Motor Company Method for doping metallic connecting wire
DE102020121157B4 (en) 2020-08-11 2022-03-31 Infrasolid Gmbh Arrangement and method for mechanical and electrical contacting of an incandescent wire of a thermal radiation source made of refractory metal in semiconductor and microsystems technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2158757A (en) * 1984-05-14 1985-11-20 Pal Gal Hot press welding process

Also Published As

Publication number Publication date
US3561084A (en) 1971-02-09
DE1949869A1 (en) 1970-04-16
FR2019895A1 (en) 1970-07-10
DE1949869B2 (en) 1970-12-23

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