GB1369787A - Mounts for semi-conductor devices - Google Patents
Mounts for semi-conductor devicesInfo
- Publication number
- GB1369787A GB1369787A GB3575973A GB3575973A GB1369787A GB 1369787 A GB1369787 A GB 1369787A GB 3575973 A GB3575973 A GB 3575973A GB 3575973 A GB3575973 A GB 3575973A GB 1369787 A GB1369787 A GB 1369787A
- Authority
- GB
- United Kingdom
- Prior art keywords
- blank
- copper
- silver
- cup
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
1369787 Brazing; welding by pressure GKN FLOFORM Ltd 26 July 1973 [11 Aug 1972] 35759/73 Addition to 1352317 Heading B3R A method of making a mount for a semiconductor device comprises the steps of positioning a metallic blank 12 in a through bore 17 in a cup-shaped member 17, applying pressure to deform the blank and thereby to cause relative movement between parts of the surfaces of the blank and cup-shape member which are in contact, followed by heating to cause diffusion bonding between the said parts. A semiconductor device 18 and cover 19 may subsequently be bonded to the mount by conventional techniques. The cup-shape member may be of steel, optionally coated e.g. with copper, nickel, silver or tin. The blank may be of copper or copper base alloy and may be coated on the cylindrical surfaces with silver; thus the blank may be a disc 12 cut from a silver-coated copper rod. Heating, e.g. to 800‹ C. for 30 minutes, may be effected in a furnace having a hydrogen atmosphere. During heating the silver diffuses into the copper to form an alloy which provides a brazed joint.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1092970 | 1970-03-06 | ||
| US27986772A | 1972-08-11 | 1972-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1369787A true GB1369787A (en) | 1974-10-09 |
Family
ID=26247860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3575973A Expired GB1369787A (en) | 1970-03-06 | 1973-07-26 | Mounts for semi-conductor devices |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1369787A (en) |
-
1973
- 1973-07-26 GB GB3575973A patent/GB1369787A/en not_active Expired
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |