GB1206759A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1206759A
GB1206759A GB3337867A GB3337867A GB1206759A GB 1206759 A GB1206759 A GB 1206759A GB 3337867 A GB3337867 A GB 3337867A GB 3337867 A GB3337867 A GB 3337867A GB 1206759 A GB1206759 A GB 1206759A
Authority
GB
United Kingdom
Prior art keywords
layer
die
july
bonding pads
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3337867A
Other languages
English (en)
Inventor
Robert David Peacock
Christopher Wren Pitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB3337867A priority Critical patent/GB1206759A/en
Priority claimed from GB33478/67A external-priority patent/GB1169069A/en
Priority to IE62368A priority patent/IE32069B1/xx
Priority to DE19681764554 priority patent/DE1764554A1/de
Priority to ES356030A priority patent/ES356030A1/es
Priority to CH1055468A priority patent/CH483724A/de
Priority to NL6810225A priority patent/NL6810225A/xx
Priority to FR1572077D priority patent/FR1572077A/fr
Publication of GB1206759A publication Critical patent/GB1206759A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB3337867A 1967-07-20 1967-07-20 Semiconductor devices Expired GB1206759A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB3337867A GB1206759A (en) 1967-07-20 1967-07-20 Semiconductor devices
IE62368A IE32069B1 (en) 1967-07-20 1968-05-23 Semiconductor devices
DE19681764554 DE1764554A1 (de) 1967-07-20 1968-06-26 Halbleiterbauelement
ES356030A ES356030A1 (es) 1967-07-20 1968-07-11 Un metodo para fabricar dispositivos semiconductores.
CH1055468A CH483724A (de) 1967-07-20 1968-07-15 Halbleiterbauelement
NL6810225A NL6810225A (https=) 1967-07-20 1968-07-19
FR1572077D FR1572077A (https=) 1967-07-20 1968-07-19

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB33478/67A GB1169069A (en) 1966-08-04 1967-07-20 Ionogenic Polymerization of Lactams
GB3337867A GB1206759A (en) 1967-07-20 1967-07-20 Semiconductor devices

Publications (1)

Publication Number Publication Date
GB1206759A true GB1206759A (en) 1970-09-30

Family

ID=26261845

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3337867A Expired GB1206759A (en) 1967-07-20 1967-07-20 Semiconductor devices

Country Status (5)

Country Link
CH (1) CH483724A (https=)
DE (1) DE1764554A1 (https=)
FR (1) FR1572077A (https=)
GB (1) GB1206759A (https=)
NL (1) NL6810225A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074168A1 (en) * 1981-07-24 1983-03-16 Fujitsu Limited Device and method for packaging electronic devices
EP0135416A1 (en) * 1983-07-22 1985-03-27 Fairchild Semiconductor Corporation Integrated circuit having a pre-attached conductive mounting media and method of making the same
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
GB2254186A (en) * 1991-03-23 1992-09-30 Samsung Electronics Co Ltd Semiconductor lead frame

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2628951C2 (de) * 1976-06-28 1989-11-23 Ed. Scharwächter GmbH & Co KG, 5630 Remscheid Aushängbares Scharnier, insbesondere für Kraftfahrzeuge
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
US6096848A (en) * 1994-06-06 2000-08-01 Henkel Kommanditgesellschaft Auf Aktien Process for the production of biscyanoacrylates
WO1996020501A1 (en) * 1994-12-27 1996-07-04 National Semiconductor Corporation An integrated circuit package encapsulated by fiber laden molding material and its method of manufacturing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0074168A1 (en) * 1981-07-24 1983-03-16 Fujitsu Limited Device and method for packaging electronic devices
US4590672A (en) * 1981-07-24 1986-05-27 Fujitsu Limited Package for electronic device and method for producing same
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
EP0135416A1 (en) * 1983-07-22 1985-03-27 Fairchild Semiconductor Corporation Integrated circuit having a pre-attached conductive mounting media and method of making the same
US4688075A (en) * 1983-07-22 1987-08-18 Fairchild Semiconductor Corporation Integrated circuit having a pre-attached conductive mounting media and method of making the same
GB2254186A (en) * 1991-03-23 1992-09-30 Samsung Electronics Co Ltd Semiconductor lead frame

Also Published As

Publication number Publication date
FR1572077A (https=) 1969-06-20
DE1764554A1 (de) 1971-08-26
NL6810225A (https=) 1969-01-22
CH483724A (de) 1969-12-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PLNP Patent lapsed through nonpayment of renewal fees