GB1201452A - Improvements in or relating to stacked electric circuit constructions - Google Patents

Improvements in or relating to stacked electric circuit constructions

Info

Publication number
GB1201452A
GB1201452A GB794069A GB794069A GB1201452A GB 1201452 A GB1201452 A GB 1201452A GB 794069 A GB794069 A GB 794069A GB 794069 A GB794069 A GB 794069A GB 1201452 A GB1201452 A GB 1201452A
Authority
GB
United Kingdom
Prior art keywords
plate
housing
plates
stack
distributer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB794069A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681616351 external-priority patent/DE1616351A1/en
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB1201452A publication Critical patent/GB1201452A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

1,201,452. Circuit assemblies. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 13 Feb., 1969 [29 Feb., 1968], No. 7940/69. Heading H1R. Components mounted on a stacked electric circuit construction are cooled by inserting the stack into a heat conductive housing in such manner that the edges of heat conductive plates of the stack are in contact with the walls of the housing. Integrated circuits are mounted on spokes 3 and tongues 4 of a flexible metal plate 1 provided with spring tongues. Electrical connection is made to the integrated circuits by connector plate 6 having a pattern of electric conductors on its surface and which is mounted on the underside of plate 1. Screening plate 10 rests on the top face of plate 1 and covers all the integrated circuits of its plate. The stack is assembled by first mounting a spacer ring 11 and distributer plate 16 over tie rods 13 projecting from base 12 and connecting the cable wires projecting from the housing base 12 to terminals 17 on distributer plate 16, which terminals 17 are connected by electrical conductors to terminal connections 7. Further spacer rings 11 and distributer plates 16 are mounted over the tie rods and over a last spacer ring is mounted a plate assembly 1, 2, and 10. This is followed by the next spacer ring 11 and plate assembly. The final screen plate 10 is omitted. Notches 8 in screen plates 10 and rings 11 allow for connections to be made between the terminals 7 of the plate assemblies and distributer plates. The stack is inserted in a metal cylindrical housing, Fig. 3 (not shown), with the spring tongues 2 against the inner surface of the housing to provide good heat transfer to the housing. A good weather seal is provided between the housing and housing base. Insulating layers may be provided with connector plates 6 and plates 1.
GB794069A 1968-02-29 1969-02-13 Improvements in or relating to stacked electric circuit constructions Expired GB1201452A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681616351 DE1616351A1 (en) 1968-02-29 1968-02-29 Circuit structure for electrical components

Publications (1)

Publication Number Publication Date
GB1201452A true GB1201452A (en) 1970-08-05

Family

ID=5682189

Family Applications (1)

Application Number Title Priority Date Filing Date
GB794069A Expired GB1201452A (en) 1968-02-29 1969-02-13 Improvements in or relating to stacked electric circuit constructions

Country Status (1)

Country Link
GB (1) GB1201452A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558666A1 (en) * 1984-01-19 1985-07-26 Standard Telephones Cables Plc OPTICAL REPEATER FOR UNDERWATER COMMUNICATIONS CIRCUIT
GB2192758A (en) * 1986-07-18 1988-01-20 Anamartic Ltd Package for wafer scale integrated circuits
EP0584669A1 (en) * 1992-08-14 1994-03-02 Hughes Aircraft Company High density electronics package having stacked circuit boards

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2558666A1 (en) * 1984-01-19 1985-07-26 Standard Telephones Cables Plc OPTICAL REPEATER FOR UNDERWATER COMMUNICATIONS CIRCUIT
GB2153151A (en) * 1984-01-19 1985-08-14 Standard Telephones Cables Ltd Optical repeaters
US4679250A (en) * 1984-01-19 1987-07-07 Standard Telephones And Cables Plc Optical repeaters
GB2192758A (en) * 1986-07-18 1988-01-20 Anamartic Ltd Package for wafer scale integrated circuits
GB2192758B (en) * 1986-07-18 1990-03-28 Anamartic Ltd A modular high-density packaging scheme for wsi components
EP0584669A1 (en) * 1992-08-14 1994-03-02 Hughes Aircraft Company High density electronics package having stacked circuit boards

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees