GB1189124A - Improvements in Methods of Forming Metallic Patterns - Google Patents

Abstract

1,189,124. Ornamenting. NATIONAL RESEARCH DEVELOPMENT CORP. 30 May, 1967 [7 June, 1966], No. 25369/66. Heading B6G. [Also in Divisions B2 and C7] A metallic pattern is formed on a substrate by subjecting metallic material containing a polymerizable organic component in situ on the substrate to charged particle bombardment to polymerize the component and thus fix the material on the substrate in selected areas constituting the desired pattern. Electricallyconductive patterns on the substrate are thereby formed. An overall coating may be effected by flooding the substrate with the patterning material and spinning, or a selective coating of those parts forming the pattern may be affected by silk-screen printing. The hole is then dried to remove excess solvent and placed in a vacuum chamber of an electron beam machine. The machine is then caused to scan the coated substrate surface in the desired pattern to effect localized fixing of the patterning material. The scanning of the beam may be effected by a computer. The substrate is finally washed in a suitable solvent for the unpolymerized patterning material which removes all the coating except the part scanned by the beam. The pattern substrate is then baked. The metallic patterning material may consist of a solution or suspension of precious metal or previous metal compounds together with adhesion promoting agents in an organic liquid. During the final baking step the organic components of the preparation are either oxidized or volatilized and the metal compounds reduced to metal. The substrate may be glazed or unglazed alumina. The metallic patterning materials may also be sprayed on to the substrate.