GB1189062A - Semiconductor Rectifier Assembly - Google Patents
Semiconductor Rectifier AssemblyInfo
- Publication number
- GB1189062A GB1189062A GB1189062DA GB1189062A GB 1189062 A GB1189062 A GB 1189062A GB 1189062D A GB1189062D A GB 1189062DA GB 1189062 A GB1189062 A GB 1189062A
- Authority
- GB
- United Kingdom
- Prior art keywords
- discs
- semi
- conductor
- rubber
- march
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 229920001971 elastomer Polymers 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62549367A | 1967-03-23 | 1967-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1189062A true GB1189062A (en) | 1970-04-22 |
Family
ID=24506343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1189062D Expired GB1189062A (en) | 1967-03-23 | 1968-03-11 | Semiconductor Rectifier Assembly |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE712547A (enrdf_load_stackoverflow) |
| CH (1) | CH471467A (enrdf_load_stackoverflow) |
| FR (1) | FR1556831A (enrdf_load_stackoverflow) |
| GB (1) | GB1189062A (enrdf_load_stackoverflow) |
| NL (1) | NL6804124A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131952U (enrdf_load_stackoverflow) * | 1976-03-31 | 1977-10-06 | ||
| JPS52131953U (enrdf_load_stackoverflow) * | 1976-03-31 | 1977-10-06 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2102512A5 (enrdf_load_stackoverflow) * | 1970-08-06 | 1972-04-07 | Liaison Electr Silec | |
| DE2118356A1 (de) * | 1971-04-15 | 1972-10-26 | Siemens AG, 1000 Berlin u. 8000 München | Scheibenförmiges Halbleiterbauelement |
| FR2162275A1 (en) * | 1971-12-08 | 1973-07-20 | Sescosem | Encapsulated high power semiconductor - with improved heat dissipation |
-
1968
- 1968-03-11 GB GB1189062D patent/GB1189062A/en not_active Expired
- 1968-03-19 CH CH408468A patent/CH471467A/fr not_active IP Right Cessation
- 1968-03-20 FR FR1556831D patent/FR1556831A/fr not_active Expired
- 1968-03-21 BE BE712547A patent/BE712547A/xx unknown
- 1968-03-22 NL NL6804124A patent/NL6804124A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131952U (enrdf_load_stackoverflow) * | 1976-03-31 | 1977-10-06 | ||
| JPS52131953U (enrdf_load_stackoverflow) * | 1976-03-31 | 1977-10-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| CH471467A (fr) | 1969-04-15 |
| FR1556831A (enrdf_load_stackoverflow) | 1969-02-07 |
| BE712547A (enrdf_load_stackoverflow) | 1968-09-23 |
| NL6804124A (enrdf_load_stackoverflow) | 1968-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |