GB1171467A - Semiconductor Manufacturing Method and Apparatus - Google Patents
Semiconductor Manufacturing Method and ApparatusInfo
- Publication number
- GB1171467A GB1171467A GB30898/66A GB3089866A GB1171467A GB 1171467 A GB1171467 A GB 1171467A GB 30898/66 A GB30898/66 A GB 30898/66A GB 3089866 A GB3089866 A GB 3089866A GB 1171467 A GB1171467 A GB 1171467A
- Authority
- GB
- United Kingdom
- Prior art keywords
- tape
- wires
- station
- wire
- flats
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 8
- 229910052757 nitrogen Inorganic materials 0.000 abstract 4
- 238000005538 encapsulation Methods 0.000 abstract 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 2
- 125000006850 spacer group Chemical group 0.000 abstract 2
- 239000007921 spray Substances 0.000 abstract 2
- 238000003860 storage Methods 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004809 Teflon Substances 0.000 abstract 1
- 229920006362 Teflon® Polymers 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 238000005242 forging Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- 230000013011 mating Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/003—Placing of components on belts holding the terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Resistance Welding (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47041065A | 1965-07-08 | 1965-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1171467A true GB1171467A (en) | 1969-11-19 |
Family
ID=23867535
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB30898/66A Expired GB1171467A (en) | 1965-07-08 | 1966-07-08 | Semiconductor Manufacturing Method and Apparatus |
| GB04490/69A Expired GB1171469A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
| GB04489/69A Expired GB1171468A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
| GB04491/69A Expired GB1171470A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB04490/69A Expired GB1171469A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
| GB04489/69A Expired GB1171468A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
| GB04491/69A Expired GB1171470A (en) | 1965-07-08 | 1966-07-08 | Improvements in or relating to the Manufacture of Semiconductor Devices |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3426423A (enExample) |
| JP (2) | JPS557701B1 (enExample) |
| DE (1) | DE1564416C3 (enExample) |
| ES (6) | ES318263A1 (enExample) |
| GB (4) | GB1171467A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2261548A (en) * | 1991-11-12 | 1993-05-19 | Motorola Inc | Crack resistant semiconductor package and method for making |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3497948A (en) * | 1967-09-05 | 1970-03-03 | Transistor Automation Corp | Method and apparatus for sorting semi-conductor devices |
| US3698073A (en) * | 1970-10-13 | 1972-10-17 | Motorola Inc | Contact bonding and packaging of integrated circuits |
| JPS559826B2 (enExample) * | 1971-08-24 | 1980-03-12 | ||
| US3793709A (en) * | 1972-04-24 | 1974-02-26 | Texas Instruments Inc | Process for making a plastic-encapsulated semiconductor device |
| US4480150A (en) * | 1982-07-12 | 1984-10-30 | Motorola Inc. | Lead frame and method |
| US4567642A (en) * | 1984-09-28 | 1986-02-04 | The Standard Oil Company | Method of making photovoltaic modules |
| EP3174088B1 (en) * | 2015-11-26 | 2020-12-30 | Siyang Grande Electronics Co., Ltd. | Method of manufacturing a plastic packaged smd diode |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2962058A (en) * | 1953-07-06 | 1960-11-29 | Texas Instruments Inc | Apparatus for forming point contacts for transistors |
| US3073007A (en) * | 1958-09-29 | 1963-01-15 | Sprague Electric Co | Method and means for assembling capacitors |
| US3171187A (en) * | 1962-05-04 | 1965-03-02 | Nippon Electric Co | Method of manufacturing semiconductor devices |
| GB1015909A (en) * | 1963-12-30 | 1966-01-05 | Gen Micro Electronics Inc | Method of and product for packaging electronic devices |
| DE1514822A1 (de) * | 1964-08-14 | 1969-06-26 | Telefunken Patent | Verfahren zur Herstellung einer Halbleiteranordnung |
-
1965
- 1965-07-08 US US470410A patent/US3426423A/en not_active Expired - Lifetime
- 1965-10-08 ES ES0318263A patent/ES318263A1/es not_active Expired
-
1966
- 1966-07-06 DE DE1564416A patent/DE1564416C3/de not_active Expired
- 1966-07-07 ES ES0328792A patent/ES328792A1/es not_active Expired
- 1966-07-07 ES ES0328814A patent/ES328814A1/es not_active Expired
- 1966-07-07 ES ES0328794A patent/ES328794A1/es not_active Expired
- 1966-07-07 ES ES0328793A patent/ES328793A1/es not_active Expired
- 1966-07-07 ES ES0328795A patent/ES328795A1/es not_active Expired
- 1966-07-08 GB GB30898/66A patent/GB1171467A/en not_active Expired
- 1966-07-08 GB GB04490/69A patent/GB1171469A/en not_active Expired
- 1966-07-08 GB GB04489/69A patent/GB1171468A/en not_active Expired
- 1966-07-08 GB GB04491/69A patent/GB1171470A/en not_active Expired
-
1975
- 1975-06-18 JP JP7424975A patent/JPS557701B1/ja active Pending
- 1975-06-18 JP JP7424875A patent/JPS557700B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2261548A (en) * | 1991-11-12 | 1993-05-19 | Motorola Inc | Crack resistant semiconductor package and method for making |
Also Published As
| Publication number | Publication date |
|---|---|
| ES328792A1 (es) | 1967-04-16 |
| ES328793A1 (es) | 1967-04-16 |
| ES328795A1 (es) | 1967-04-16 |
| JPS557700B1 (enExample) | 1980-02-27 |
| GB1171469A (en) | 1969-11-19 |
| ES328794A1 (es) | 1967-08-16 |
| ES318263A1 (es) | 1966-03-16 |
| GB1171470A (en) | 1969-11-19 |
| DE1564416C3 (de) | 1975-04-17 |
| DE1564416B2 (de) | 1974-08-29 |
| DE1564416A1 (de) | 1972-03-30 |
| ES328814A1 (es) | 1967-04-16 |
| US3426423A (en) | 1969-02-11 |
| GB1171468A (en) | 1969-11-19 |
| JPS557701B1 (enExample) | 1980-02-27 |
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