GB1157041A - Improvements in Semiconductor Device Assemblies - Google Patents

Improvements in Semiconductor Device Assemblies

Info

Publication number
GB1157041A
GB1157041A GB1298467A GB1298467A GB1157041A GB 1157041 A GB1157041 A GB 1157041A GB 1298467 A GB1298467 A GB 1298467A GB 1298467 A GB1298467 A GB 1298467A GB 1157041 A GB1157041 A GB 1157041A
Authority
GB
United Kingdom
Prior art keywords
housing
stud
base
spring
shims
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1298467A
Inventor
John L Boyer
Richard A Hartman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of GB1157041A publication Critical patent/GB1157041A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

1,157,041. Semi-conductor devices. INTERNATIONAL RECTIFIER CORP. 20 March, 1967 [29 April, 1966], No. 12984/67. Heading H1K. A semi-conductor device, consists of a wafer 11 containing a PN junction and sandwiched between expansion plates 12, 13, e.g. of molybdenum, of which the former is preferably smaller and the latter larger than the wafer, and is held between a housing base 10 forming one terminal and a stud 15 forming another by means of a spring constituted by one or more dished washers 24-26. The washer or washers act between the housing and an annular shoulder 16 on the stud 15. The spring tension depends on the distance between the base and top of the housing and this is adjusted in assembly by inserting shims 43, 44 before welding the body 41 of the housing to its base 10. The housing is assembled by first placing the spring washers in a cup-shaped insulator 40 and fitting this on the stud 15. The housing body 41 is then placed over the stud 15 and the shims 43, 44 are inserted between the body and the base of the housing. The number of shims is adjusted to attain the requisite spring pressure and a weld is then effected between the members 10 and 41.
GB1298467A 1966-04-29 1967-03-20 Improvements in Semiconductor Device Assemblies Expired GB1157041A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54636066A 1966-04-29 1966-04-29

Publications (1)

Publication Number Publication Date
GB1157041A true GB1157041A (en) 1969-07-02

Family

ID=24180080

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1298467A Expired GB1157041A (en) 1966-04-29 1967-03-20 Improvements in Semiconductor Device Assemblies

Country Status (2)

Country Link
GB (1) GB1157041A (en)
NL (1) NL6705125A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157487A (en) * 1984-04-12 1985-10-23 Marconi Electronic Devices Housing for an electrical component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2157487A (en) * 1984-04-12 1985-10-23 Marconi Electronic Devices Housing for an electrical component

Also Published As

Publication number Publication date
NL6705125A (en) 1967-10-30

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee