GB1115105A - Improvements in or relating to the manufacture of multiterminal electrical components - Google Patents
Improvements in or relating to the manufacture of multiterminal electrical componentsInfo
- Publication number
- GB1115105A GB1115105A GB11634/66A GB1163466A GB1115105A GB 1115105 A GB1115105 A GB 1115105A GB 11634/66 A GB11634/66 A GB 11634/66A GB 1163466 A GB1163466 A GB 1163466A GB 1115105 A GB1115105 A GB 1115105A
- Authority
- GB
- United Kingdom
- Prior art keywords
- carrier
- transistors
- transistor
- rungs
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004568 cement Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 238000004382 potting Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0096025 | 1965-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1115105A true GB1115105A (en) | 1968-05-29 |
Family
ID=7519772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB11634/66A Expired GB1115105A (en) | 1965-03-18 | 1966-03-17 | Improvements in or relating to the manufacture of multiterminal electrical components |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE678041A (en:Method) |
| DE (1) | DE1514418A1 (en:Method) |
| ES (1) | ES324264A1 (en:Method) |
| FR (1) | FR1473478A (en:Method) |
| GB (1) | GB1115105A (en:Method) |
| NL (1) | NL6601942A (en:Method) |
| SE (1) | SE318950B (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2526877A1 (en) * | 2011-05-27 | 2012-11-28 | Tyco Healthcare Group LP | Method of internally potting or sealing a handheld medical device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2549291B2 (fr) * | 1982-10-29 | 1986-05-09 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
| FR2535526B1 (fr) * | 1982-10-29 | 1986-03-28 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
-
1965
- 1965-03-18 DE DE19651514418 patent/DE1514418A1/de active Pending
-
1966
- 1966-02-15 NL NL6601942A patent/NL6601942A/xx unknown
- 1966-03-16 ES ES0324264A patent/ES324264A1/es not_active Expired
- 1966-03-17 FR FR53893A patent/FR1473478A/fr not_active Expired
- 1966-03-17 GB GB11634/66A patent/GB1115105A/en not_active Expired
- 1966-03-18 BE BE678041D patent/BE678041A/xx unknown
- 1966-03-18 SE SE3671/66A patent/SE318950B/xx unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2526877A1 (en) * | 2011-05-27 | 2012-11-28 | Tyco Healthcare Group LP | Method of internally potting or sealing a handheld medical device |
| AU2012202181B2 (en) * | 2011-05-27 | 2014-04-24 | Covidien Lp | Method of internally potting or sealing a handheld medical device |
| EP3138516A1 (en) * | 2011-05-27 | 2017-03-08 | Covidien LP | Method of internally potting and sealing a handheld medical device |
| US10542978B2 (en) | 2011-05-27 | 2020-01-28 | Covidien Lp | Method of internally potting or sealing a handheld medical device |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6601942A (en:Method) | 1966-09-19 |
| ES324264A1 (es) | 1967-02-01 |
| FR1473478A (fr) | 1967-03-17 |
| DE1514418A1 (de) | 1969-06-26 |
| SE318950B (en:Method) | 1969-12-22 |
| BE678041A (en:Method) | 1966-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES349093A1 (es) | Un dispositivo de paquete de semiconductor. | |
| GB1384823A (en) | Hermetic power package | |
| GB1060397A (en) | Improvements in and relating to the manufacture of semiconductor devices | |
| SE7702719L (sv) | Generator med tomgangsdiod och spenningsregulator | |
| NL6405157A (en:Method) | ||
| GB1115105A (en) | Improvements in or relating to the manufacture of multiterminal electrical components | |
| US2888736A (en) | Transistor packages | |
| US3581387A (en) | Method of making strip mounted semiconductor device | |
| GB1181198A (en) | Improvements in or relating to Semiconductor Components | |
| GB1101906A (en) | Improvements in or relating to the manufacture of semiconductor circuits or assemblies | |
| US4740868A (en) | Rail bonded multi-chip leadframe, method and package | |
| US20200098671A1 (en) | Power modules and related methods | |
| GB1273175A (en) | Semi-conductor devices | |
| US6396091B2 (en) | Chip scale package | |
| US3395447A (en) | Method for mass producing semiconductor devices | |
| US3278813A (en) | Transistor housing containing packed, earthy, nonmetallic, electrically insulating material | |
| GB1285735A (en) | Integrated semiconductor unit | |
| JP2015231027A (ja) | 半導体装置 | |
| GB1173506A (en) | Metallic Frame Member for Fabrication of Semiconductor Devices. | |
| KR102283390B1 (ko) | 멀티칩용 반도체 패키지 및 그 제조방법 | |
| US3492547A (en) | Radiation hardened semiconductor device | |
| KR102228938B1 (ko) | 커플드 반도체 패키지 | |
| JPS5449066A (en) | Semiconductor device | |
| US3679946A (en) | Strip mounted semiconductor device | |
| GB1270288A (en) | Header system for a semiconductor device |