GB1115105A - Improvements in or relating to the manufacture of multiterminal electrical components - Google Patents
Improvements in or relating to the manufacture of multiterminal electrical componentsInfo
- Publication number
- GB1115105A GB1115105A GB11634/66A GB1163466A GB1115105A GB 1115105 A GB1115105 A GB 1115105A GB 11634/66 A GB11634/66 A GB 11634/66A GB 1163466 A GB1163466 A GB 1163466A GB 1115105 A GB1115105 A GB 1115105A
- Authority
- GB
- United Kingdom
- Prior art keywords
- carrier
- transistors
- transistor
- rungs
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004568 cement Substances 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 238000004382 potting Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
1,115,105. Semi-conductor devices; capacitors. SIEMENS A.G. 17 March, 1966 [18 March, 1965], No. 11634/66. Heading H1K. In the manufacture of microplanar transistors each processed semi-conductor wafer is alloyed to a rung of a gilded iron-cobalt-nickel alloy ladder-like carrier 1 to form one electrode of the transistor. Silver wires 2 are spot welded across the ladder adjacent the rungs, and emitter and base leads are thermocompression bonded between these and contact areas on the transistor. That aide of the carrier bearing the transistors is then enveloped in an oven hardened potting compound such as an epoxy resin so that the devices and their leads are covered. The side member of the carrier is then cut away and the resin cut through between transistors to leave these secured to the remaining part of the carrier by the electrode connections. So that the transistors may subsequently be readily handled the remaining side of the carrier is encapsulated and then cut through between the groups of connections for each transistor, Fig. 6 (not shown). This encapsulation may utilize epoxy resins, silicone resins, polyester resins, low-melting point glasses, ceramics, or inorganic cements. An alternative carrier (Fig. 2, not shown) has the silver wires replaced by narrow rungs adjacent the main rungs and integral with the carrier which is punched from foil. Instead of transistors it is possible to similarly mount microplanar diodes, integrated circuits, resistors and capacitors.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0096025 | 1965-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1115105A true GB1115105A (en) | 1968-05-29 |
Family
ID=7519772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB11634/66A Expired GB1115105A (en) | 1965-03-18 | 1966-03-17 | Improvements in or relating to the manufacture of multiterminal electrical components |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE678041A (en) |
| DE (1) | DE1514418A1 (en) |
| ES (1) | ES324264A1 (en) |
| FR (1) | FR1473478A (en) |
| GB (1) | GB1115105A (en) |
| NL (1) | NL6601942A (en) |
| SE (1) | SE318950B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2526877A1 (en) * | 2011-05-27 | 2012-11-28 | Tyco Healthcare Group LP | Method of internally potting or sealing a handheld medical device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2549291B2 (en) * | 1982-10-29 | 1986-05-09 | Radiotechnique Compelec | METHOD OF ENCAPSULATION OF ELECTRONIC COMPONENTS BY EXTRUSION OF PLASTIC MATERIAL AND APPLICATIONS TO THE MANUFACTURE OF LIGHT INDICATORS AND TO THE ENCAPSULATION OF ELECTRONIC CIRCUITS |
| FR2535526B1 (en) * | 1982-10-29 | 1986-03-28 | Radiotechnique Compelec | METHOD OF ENCAPSULATION OF ELECTRONIC COMPONENTS BY EXTRUSION OF PLASTIC MATERIAL AND APPLICATIONS TO THE MANUFACTURE OF LIGHT INDICATORS AND TO THE ENCAPSULATION OF ELECTRONIC CIRCUITS |
-
1965
- 1965-03-18 DE DE19651514418 patent/DE1514418A1/en active Pending
-
1966
- 1966-02-15 NL NL6601942A patent/NL6601942A/xx unknown
- 1966-03-16 ES ES0324264A patent/ES324264A1/en not_active Expired
- 1966-03-17 FR FR53893A patent/FR1473478A/en not_active Expired
- 1966-03-17 GB GB11634/66A patent/GB1115105A/en not_active Expired
- 1966-03-18 SE SE3671/66A patent/SE318950B/xx unknown
- 1966-03-18 BE BE678041D patent/BE678041A/xx unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2526877A1 (en) * | 2011-05-27 | 2012-11-28 | Tyco Healthcare Group LP | Method of internally potting or sealing a handheld medical device |
| AU2012202181B2 (en) * | 2011-05-27 | 2014-04-24 | Covidien Lp | Method of internally potting or sealing a handheld medical device |
| EP3138516A1 (en) * | 2011-05-27 | 2017-03-08 | Covidien LP | Method of internally potting and sealing a handheld medical device |
| US10542978B2 (en) | 2011-05-27 | 2020-01-28 | Covidien Lp | Method of internally potting or sealing a handheld medical device |
Also Published As
| Publication number | Publication date |
|---|---|
| BE678041A (en) | 1966-09-19 |
| SE318950B (en) | 1969-12-22 |
| ES324264A1 (en) | 1967-02-01 |
| DE1514418A1 (en) | 1969-06-26 |
| NL6601942A (en) | 1966-09-19 |
| FR1473478A (en) | 1967-03-17 |
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