GB1103297A - Improvements in or relating to the production of metal coatings - Google Patents
Improvements in or relating to the production of metal coatingsInfo
- Publication number
- GB1103297A GB1103297A GB57308/66A GB5730866A GB1103297A GB 1103297 A GB1103297 A GB 1103297A GB 57308/66 A GB57308/66 A GB 57308/66A GB 5730866 A GB5730866 A GB 5730866A GB 1103297 A GB1103297 A GB 1103297A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- bath
- wafers
- nah2po2
- nicl2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 6
- 239000002184 metal Substances 0.000 title abstract 6
- 238000000576 coating method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract 6
- 235000012431 wafers Nutrition 0.000 abstract 3
- 229910021205 NaH2PO2 Inorganic materials 0.000 abstract 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 abstract 2
- 238000009835 boiling Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 abstract 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 abstract 1
- 229910020630 Co Ni Inorganic materials 0.000 abstract 1
- 229910021580 Cobalt(II) chloride Inorganic materials 0.000 abstract 1
- 229910002440 Co–Ni Inorganic materials 0.000 abstract 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 abstract 1
- 235000019270 ammonium chloride Nutrition 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002923 metal particle Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000004576 sand Substances 0.000 abstract 1
- 150000003346 selenoethers Chemical class 0.000 abstract 1
- 238000003756 stirring Methods 0.000 abstract 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A metal A such as Ni or Co-Ni is deposited from a reducing bath on to a body B comprising a semi-conductor or a metal more noble than A, the surface of which is seeded with a metal C e.g. Al equally or less noble than A by suspending particles of the metal C in the reducing bath e.g. by stirring the bath or heating it to its boiling point. The bath may be a solution of (1) NiCl2, NaH2PO2, Na citrate and NH4Cl; or (2) CoCl2, NiCl2, Na glycolate and NaH2PO2. For example, semi-conductor wafers e.g. discs of bismuth telluride, selenide or antimonide, cleansed with sand jets and boiled in methanol, are introduced into the reducing bath in which is suspended Al powder of grain size 15.10-3 mm to produce a coating thereon of metal A 3.10-3 mm thick. After again boiling in methanol, the coated wafers are dried and heat treated at 120 DEG C. The wafers were then divided into pieces to form legs of thermocouple elements and the process is repeated to provide the legs with a second coating of metal A 1.10-3 mm thick.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0101158 | 1965-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1103297A true GB1103297A (en) | 1968-02-14 |
Family
ID=7523564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB57308/66A Expired GB1103297A (en) | 1965-12-24 | 1966-12-21 | Improvements in or relating to the production of metal coatings |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1521486A1 (en) |
| FR (1) | FR1506003A (en) |
| GB (1) | GB1103297A (en) |
| NL (1) | NL6615681A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1227173A1 (en) * | 1999-09-27 | 2002-07-31 | Citizen Watch Co. Ltd. | Electroless plating method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554561A (en) * | 1978-10-18 | 1980-04-21 | Nippon Mining Co Ltd | Metal plating method for powdered body by substitution method |
-
1965
- 1965-12-24 DE DE19651521486 patent/DE1521486A1/en active Pending
-
1966
- 1966-11-07 NL NL6615681A patent/NL6615681A/xx unknown
- 1966-12-21 GB GB57308/66A patent/GB1103297A/en not_active Expired
- 1966-12-22 FR FR88561A patent/FR1506003A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1227173A1 (en) * | 1999-09-27 | 2002-07-31 | Citizen Watch Co. Ltd. | Electroless plating method |
| EP1227173A4 (en) * | 1999-09-27 | 2003-03-12 | Citizen Watch Co Ltd | Electroless plating method |
| US6841476B1 (en) | 1999-09-27 | 2005-01-11 | Citizen Watch Co., Ltd. | Electroless plating method |
| CN100335679C (en) * | 1999-09-27 | 2007-09-05 | 西铁城时计株式会社 | Electroless plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1521486A1 (en) | 1969-08-21 |
| FR1506003A (en) | 1967-12-15 |
| NL6615681A (en) | 1967-06-26 |
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