GB1103067A - The division of semiconductor wafers into wafers of smaller face area - Google Patents
The division of semiconductor wafers into wafers of smaller face areaInfo
- Publication number
- GB1103067A GB1103067A GB3404866A GB3404866A GB1103067A GB 1103067 A GB1103067 A GB 1103067A GB 3404866 A GB3404866 A GB 3404866A GB 3404866 A GB3404866 A GB 3404866A GB 1103067 A GB1103067 A GB 1103067A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- tools
- holder
- wafers
- scoring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 title abstract 14
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0098475 | 1965-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1103067A true GB1103067A (en) | 1968-02-14 |
Family
ID=7521497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB3404866A Expired GB1103067A (en) | 1965-07-28 | 1966-07-28 | The division of semiconductor wafers into wafers of smaller face area |
Country Status (3)
| Country | Link |
|---|---|
| BE (1) | BE684563A (enExample) |
| GB (1) | GB1103067A (enExample) |
| NL (1) | NL6610661A (enExample) |
-
1966
- 1966-07-25 BE BE684563D patent/BE684563A/xx unknown
- 1966-07-28 NL NL6610661A patent/NL6610661A/xx unknown
- 1966-07-28 GB GB3404866A patent/GB1103067A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE684563A (enExample) | 1967-01-03 |
| NL6610661A (enExample) | 1967-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3699644A (en) | Method of dividing wafers | |
| SE396899B (sv) | Anordning for att styra en slipningsprocess, som utfores med en drivmekanism for att ge en konstant relativ rorelse mellan ett arbetsstycke och ett roterande slipverktyg | |
| GB1047872A (en) | Improvements in and relating to apparatus for the production of semiconductor and other articles | |
| GB1103067A (en) | The division of semiconductor wafers into wafers of smaller face area | |
| JP3470177B2 (ja) | 切削装置 | |
| GB805292A (en) | Semiconductor devices | |
| JPH1074712A (ja) | ウェハーブレーク装置 | |
| ES276020A1 (es) | Un procedimiento y un dispositivo para la mecanización de la superficie de piezas de trabajo | |
| JPS55101365A (en) | Belt grinding machine for machining wrist watch case | |
| JPS5216172A (en) | Rotatory treatment device | |
| FR2016875B1 (enExample) | ||
| JPS56119367A (en) | Surface polishing method | |
| JPS5416792A (en) | Cutting apparatus | |
| JPS55131463A (en) | Method and apparatus for cutting semiconductor block | |
| SU137416A1 (ru) | Устройство дл шлифовани и полировани оптических конусов и однополостных гиперболоидов вращени | |
| JPS55165625A (en) | Manufacture of semiconductor device | |
| US2669907A (en) | Work support for long workpieces with machine tools | |
| JPS52132497A (en) | Device for grinding both opposite surfaces of wafer | |
| JPS5244162A (en) | Method of processing semiconductor wafer | |
| GB982243A (en) | Improvements in or relating to apparatus for grinding and/or polishing sheets of glass | |
| JPS5640246A (en) | Surface treatment of silicon wafer | |
| SU461829A1 (ru) | Устройство дл магнитно-абразивной обработки деталей | |
| JPS5242365A (en) | Tool for semiconductors | |
| JPS5335373A (en) | Working method of semiconductor wafers | |
| JPS5542718A (en) | Concaved curved surface processing of liquid crystal indicating cell |