GB1103067A - The division of semiconductor wafers into wafers of smaller face area - Google Patents

The division of semiconductor wafers into wafers of smaller face area

Info

Publication number
GB1103067A
GB1103067A GB3404866A GB3404866A GB1103067A GB 1103067 A GB1103067 A GB 1103067A GB 3404866 A GB3404866 A GB 3404866A GB 3404866 A GB3404866 A GB 3404866A GB 1103067 A GB1103067 A GB 1103067A
Authority
GB
United Kingdom
Prior art keywords
wafer
tools
holder
wafers
scoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3404866A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1103067A publication Critical patent/GB1103067A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
GB3404866A 1965-07-28 1966-07-28 The division of semiconductor wafers into wafers of smaller face area Expired GB1103067A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0098475 1965-07-28

Publications (1)

Publication Number Publication Date
GB1103067A true GB1103067A (en) 1968-02-14

Family

ID=7521497

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3404866A Expired GB1103067A (en) 1965-07-28 1966-07-28 The division of semiconductor wafers into wafers of smaller face area

Country Status (3)

Country Link
BE (1) BE684563A (cg-RX-API-DMAC7.html)
GB (1) GB1103067A (cg-RX-API-DMAC7.html)
NL (1) NL6610661A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
BE684563A (cg-RX-API-DMAC7.html) 1967-01-03
NL6610661A (cg-RX-API-DMAC7.html) 1967-01-30

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