GB1097296A - Improvements in mounting of solid state electronic components - Google Patents

Improvements in mounting of solid state electronic components

Info

Publication number
GB1097296A
GB1097296A GB34169/66A GB3416966A GB1097296A GB 1097296 A GB1097296 A GB 1097296A GB 34169/66 A GB34169/66 A GB 34169/66A GB 3416966 A GB3416966 A GB 3416966A GB 1097296 A GB1097296 A GB 1097296A
Authority
GB
United Kingdom
Prior art keywords
cap
nut
high thermal
transistors
ambient temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34169/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1097296A publication Critical patent/GB1097296A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45—Differential amplifiers
    • H03F3/45071—Differential amplifiers with semiconductor devices only
    • H03F3/45479—Differential amplifiers with semiconductor devices only characterised by the way of common mode signal rejection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
GB34169/66A 1965-08-19 1966-07-29 Improvements in mounting of solid state electronic components Expired GB1097296A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US480992A US3292050A (en) 1965-08-19 1965-08-19 Mounting of solid state electronic components

Publications (1)

Publication Number Publication Date
GB1097296A true GB1097296A (en) 1968-01-03

Family

ID=23910152

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34169/66A Expired GB1097296A (en) 1965-08-19 1966-07-29 Improvements in mounting of solid state electronic components

Country Status (4)

Country Link
US (1) US3292050A (enExample)
BE (1) BE685232A (enExample)
DE (1) DE1564022A1 (enExample)
GB (1) GB1097296A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3463970A (en) * 1966-10-26 1969-08-26 Gen Electric Integrated semiconductor rectifier assembly
US3659164A (en) * 1970-11-23 1972-04-25 Rca Corp Internal construction for plastic semiconductor packages
US3735209A (en) * 1972-02-10 1973-05-22 Motorola Inc Semiconductor device package with energy absorbing layer
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket
US3859570A (en) * 1973-02-20 1975-01-07 Bose Corp Power transistor mounting
US4749821A (en) * 1986-07-10 1988-06-07 Fic Corporation EMI/RFI shield cap assembly
JPH0766331A (ja) * 1993-08-02 1995-03-10 Motorola Inc 半導体デバイス・パッケージの製造方法
US5957375A (en) * 1996-10-28 1999-09-28 Eaton Corporation Sunload sensor for automatic climate control systems
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法

Also Published As

Publication number Publication date
US3292050A (en) 1966-12-13
BE685232A (enExample) 1967-01-16
DE1564022A1 (de) 1970-01-22

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