GB1084894A - Improvements relating to the mounting of semi-conductor devices - Google Patents

Improvements relating to the mounting of semi-conductor devices

Info

Publication number
GB1084894A
GB1084894A GB2260365A GB2260365A GB1084894A GB 1084894 A GB1084894 A GB 1084894A GB 2260365 A GB2260365 A GB 2260365A GB 2260365 A GB2260365 A GB 2260365A GB 1084894 A GB1084894 A GB 1084894A
Authority
GB
United Kingdom
Prior art keywords
semi
metallic layers
support
conductor devices
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2260365A
Other languages
English (en)
Inventor
John Arthur Chandler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB2260365A priority Critical patent/GB1084894A/en
Priority to DE19661539648 priority patent/DE1539648A1/de
Priority to FR62892A priority patent/FR1480988A/fr
Priority to NL6607300A priority patent/NL6607300A/xx
Publication of GB1084894A publication Critical patent/GB1084894A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
GB2260365A 1965-05-27 1965-05-27 Improvements relating to the mounting of semi-conductor devices Expired GB1084894A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB2260365A GB1084894A (en) 1965-05-27 1965-05-27 Improvements relating to the mounting of semi-conductor devices
DE19661539648 DE1539648A1 (de) 1965-05-27 1966-05-24 Isolierendes Stuetzglied fuer Halbleiterbauelemente
FR62892A FR1480988A (fr) 1965-05-27 1966-05-25 Perfectionnement au montage des dispositifs semi-conducteurs
NL6607300A NL6607300A (https=) 1965-05-27 1966-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2260365A GB1084894A (en) 1965-05-27 1965-05-27 Improvements relating to the mounting of semi-conductor devices

Publications (1)

Publication Number Publication Date
GB1084894A true GB1084894A (en) 1967-09-27

Family

ID=10182114

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2260365A Expired GB1084894A (en) 1965-05-27 1965-05-27 Improvements relating to the mounting of semi-conductor devices

Country Status (3)

Country Link
DE (1) DE1539648A1 (https=)
GB (1) GB1084894A (https=)
NL (1) NL6607300A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate

Also Published As

Publication number Publication date
NL6607300A (https=) 1966-11-28
DE1539648A1 (de) 1969-07-24

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