NL6607300A - - Google Patents
Info
- Publication number
- NL6607300A NL6607300A NL6607300A NL6607300A NL6607300A NL 6607300 A NL6607300 A NL 6607300A NL 6607300 A NL6607300 A NL 6607300A NL 6607300 A NL6607300 A NL 6607300A NL 6607300 A NL6607300 A NL 6607300A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2260365A GB1084894A (en) | 1965-05-27 | 1965-05-27 | Improvements relating to the mounting of semi-conductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6607300A true NL6607300A (https=) | 1966-11-28 |
Family
ID=10182114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6607300A NL6607300A (https=) | 1965-05-27 | 1966-05-26 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1539648A1 (https=) |
| GB (1) | GB1084894A (https=) |
| NL (1) | NL6607300A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5600183A (en) * | 1994-11-15 | 1997-02-04 | Hughes Electronics | Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate |
-
1965
- 1965-05-27 GB GB2260365A patent/GB1084894A/en not_active Expired
-
1966
- 1966-05-24 DE DE19661539648 patent/DE1539648A1/de active Pending
- 1966-05-26 NL NL6607300A patent/NL6607300A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1084894A (en) | 1967-09-27 |
| DE1539648A1 (de) | 1969-07-24 |