GB953503A - An integrated circuit arrangement - Google Patents

An integrated circuit arrangement

Info

Publication number
GB953503A
GB953503A GB25478/62A GB2547862A GB953503A GB 953503 A GB953503 A GB 953503A GB 25478/62 A GB25478/62 A GB 25478/62A GB 2547862 A GB2547862 A GB 2547862A GB 953503 A GB953503 A GB 953503A
Authority
GB
United Kingdom
Prior art keywords
transistor
plate
recess
active element
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25478/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB953503A publication Critical patent/GB953503A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)

Abstract

953,503. Transistors; circuit assemblies. TELEFUNKEN PATENTVERWERTUNGSGESELLSCHAFT m.b.H. July 3, 1962 [July 8, 1961], No. 25478/62. Headings H1K and H1R. An integrated circuit arrangement comprises an insulating carrier plate 1 having, on one side, a recess 3 which forms the housing of an active element 2, and being provided on the other side with passive elements 11 ... 14, and electrically conductive pins 4, 5, 6, which secure and contact the active element, pass through the carrier plate below the recess 3, the faces of the pins at the said other side being ground level and contacted by evaporated or sprayed metal films which form the passive elements or the connections thereto. As shown, active element 2 comprises a mesa-type transistor which is soldered to pin 5; alternatively, the collector may be mounted on a metal plate which is soldered to the pin. Pins 4, 6 extend into recess 3 and are connected by leads 9, 10 to the other transistor electrodes 7, 8, by soldering at about 100-150‹ C. A cover-plate 15 provides vacuum-tight enclosure of the transistor. Passive elements 11 ... 14 are applied to the polished surface of the plate 1, which is of ceramic, by cathode evaporation or vapour deposition after, or possibly before, the mounting of the transistor. A plurality of active elements may be used, being located in one or more recesses in the carrier plate.
GB25478/62A 1961-07-08 1962-07-03 An integrated circuit arrangement Expired GB953503A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET20412A DE1156457B (en) 1961-07-08 1961-07-08 Process for the production of an integrated circuit arrangement

Publications (1)

Publication Number Publication Date
GB953503A true GB953503A (en) 1964-03-25

Family

ID=7549685

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25478/62A Expired GB953503A (en) 1961-07-08 1962-07-03 An integrated circuit arrangement

Country Status (2)

Country Link
DE (1) DE1156457B (en)
GB (1) GB953503A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1791006B1 (en) * 1967-08-30 1971-04-08 Gen Electric MIXED EQUIPPED MICROELECTRONIC CIRCUIT MODULE FOR MICROWAVE CIRCUITS AND PROCESS FOR ITS PRODUCTION
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
CN111328191A (en) * 2018-12-17 2020-06-23 北京梦之墨科技有限公司 Circuit based on liquid metal

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1265256B (en) * 1965-11-04 1968-04-04 Siemens Ag Method of manufacturing a thin-film electronics assembly
DE3402538A1 (en) * 1984-01-26 1985-08-01 Robert Bosch Gmbh, 7000 Stuttgart Heat-dissipating mounting
DE3912893A1 (en) * 1989-04-19 1990-10-25 Siemens Ag Semiconductor module as micro-pack assembly - has rear contact forming substrate terminal on side from circuit board contacts

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178165B (en) * 1953-05-07 1900-01-01 Bristol Myers Co METHOD FOR PREPARING OR MANUFACTURING A MEDICINAL PRODUCT WITH BLOOD PRESSURE LOWERING AND/OR ANTI-BLOOD PLATELET AGGREGATION ACTIVITY; METHOD FOR PREPARING A CONNECTION WITH SUCH ACTIVITY.
US2884612A (en) * 1953-08-06 1959-04-28 Du Mont Allen B Lab Inc Electrical panel assembly for dip soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1791006B1 (en) * 1967-08-30 1971-04-08 Gen Electric MIXED EQUIPPED MICROELECTRONIC CIRCUIT MODULE FOR MICROWAVE CIRCUITS AND PROCESS FOR ITS PRODUCTION
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
CN111328191A (en) * 2018-12-17 2020-06-23 北京梦之墨科技有限公司 Circuit based on liquid metal

Also Published As

Publication number Publication date
DE1156457B (en) 1963-10-31

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