GB1054660A - - Google Patents
Info
- Publication number
- GB1054660A GB1054660A GB1054660DA GB1054660A GB 1054660 A GB1054660 A GB 1054660A GB 1054660D A GB1054660D A GB 1054660DA GB 1054660 A GB1054660 A GB 1054660A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- anode
- cathode
- vessel
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 abstract 9
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 229910020018 Nb Zr Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 229910052741 iridium Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052758 niobium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US309159A US3282816A (en) | 1963-09-16 | 1963-09-16 | Process of cathode sputtering from a cylindrical cathode |
US574216A US3354074A (en) | 1963-09-16 | 1966-08-22 | Cylindrical cathode sputtering apparatus including means for establishing a quadrupole magnetic field transverse of the discharge |
US574868A US3341442A (en) | 1963-09-16 | 1966-08-22 | Method of cathode sputtering including cleaning by ion bombardment wherein an article to be coated is subjected to canal rays |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1054660A true GB1054660A (lm) |
Family
ID=27405363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1054660D Active GB1054660A (lm) | 1963-09-16 |
Country Status (3)
Country | Link |
---|---|
US (2) | US3354074A (lm) |
DE (1) | DE1515301A1 (lm) |
GB (1) | GB1054660A (lm) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3548189A (en) * | 1965-06-16 | 1970-12-15 | Aden B Meinel | Method employing ion beams for polishing and figuring refractory dielectrics |
US3404084A (en) * | 1965-10-20 | 1968-10-01 | Gen Precision Systems Inc | Apparatus for depositing ionized electron beam evaporated material on a negatively biased substrate |
US3410774A (en) * | 1965-10-23 | 1968-11-12 | Ibm | Method and apparatus for reverse sputtering selected electrically exposed areas of a cathodically biased workpiece |
US3544445A (en) * | 1966-09-01 | 1970-12-01 | Bendix Corp | Floating shield in a triode sputtering apparatus protecting the base from the discharge |
US3925182A (en) * | 1973-09-25 | 1975-12-09 | Shatterproof Glass Corp | Method for continuous production of sputter-coated glass products |
US4132613A (en) * | 1974-12-23 | 1979-01-02 | Telic Corporation | Glow discharge method and apparatus |
JPS51117933A (en) * | 1975-04-10 | 1976-10-16 | Tokuda Seisakusho | Spattering apparatus |
US4179351A (en) * | 1976-09-09 | 1979-12-18 | Hewlett-Packard Company | Cylindrical magnetron sputtering source |
US4090941A (en) * | 1977-03-18 | 1978-05-23 | United Technologies Corporation | Cathode sputtering apparatus |
US4126530A (en) * | 1977-08-04 | 1978-11-21 | Telic Corporation | Method and apparatus for sputter cleaning and bias sputtering |
US4252626A (en) * | 1980-03-10 | 1981-02-24 | United Technologies Corporation | Cathode sputtering with multiple targets |
US5069770A (en) * | 1990-07-23 | 1991-12-03 | Eastman Kodak Company | Sputtering process employing an enclosed sputtering target |
US7335426B2 (en) * | 1999-11-19 | 2008-02-26 | Advanced Bio Prosthetic Surfaces, Ltd. | High strength vacuum deposited nitinol alloy films and method of making same |
DE102004005663A1 (de) * | 2004-02-05 | 2005-09-01 | Zentrum für Material- und Umwelttechnik GmbH | Verfahren zum Herstellen einer Targetanordnung |
DE102006020004B4 (de) * | 2006-04-26 | 2011-06-01 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Vorrichtung und Verfahren zur homogenen PVD-Beschichtung |
CN106884150B (zh) * | 2017-04-24 | 2023-06-09 | 爱瑞德科技(大连)有限公司 | 一种悬浮阳极及带有悬浮阳极的磁控溅射装置 |
CN111074208B (zh) * | 2019-12-19 | 2021-04-06 | 中国科学院高能物理研究所 | 一种纯铌腔内表面镀铌三锡薄膜的方法及真空炉 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL50072C (lm) * | 1935-12-28 | |||
US2189580A (en) * | 1937-05-29 | 1940-02-06 | Gen Electric | Method of making a photoelectric cell |
DE722131C (de) * | 1937-08-15 | 1942-07-01 | Bernhard Berghaus | Anordnung und Verfahren zum Metallisieren von Gegenstaenden mittels Kathodenzerstaeubung |
US3087838A (en) * | 1955-10-05 | 1963-04-30 | Hupp Corp | Methods of photoelectric cell manufacture |
GB830391A (en) * | 1955-10-28 | 1960-03-16 | Edwards High Vacuum Ltd | Improvements in or relating to cathodic sputtering of metal and dielectric films |
US2897129A (en) * | 1957-03-04 | 1959-07-28 | Titanium Metals Corp | Electrode handling and storing apparatus |
GB1022360A (en) * | 1961-12-13 | 1966-03-09 | Berghaus Elektrophysik Anst | Method of and apparatus for coating an article |
US3250694A (en) * | 1962-10-17 | 1966-05-10 | Ibm | Apparatus for coating articles by cathode sputtering |
-
0
- GB GB1054660D patent/GB1054660A/en active Active
-
1964
- 1964-09-12 DE DE19641515301 patent/DE1515301A1/de active Pending
-
1966
- 1966-08-22 US US574216A patent/US3354074A/en not_active Expired - Lifetime
- 1966-08-22 US US574868A patent/US3341442A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE1515301A1 (de) | 1969-06-19 |
US3354074A (en) | 1967-11-21 |
US3341442A (en) | 1967-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1054660A (lm) | ||
US3884793A (en) | Electrode type glow discharge apparatus | |
US4031424A (en) | Electrode type glow discharge apparatus | |
US3995187A (en) | Electrode type glow discharge apparatus | |
TW402759B (en) | Plasma vapor deposition with the coil sputtering | |
GB1162832A (en) | A Process and Device for Coating Surfaces | |
US6132575A (en) | Magnetron reactor for providing a high density, inductively coupled plasma source for sputtering metal and dielectric films | |
GB1263830A (en) | Arc deposition process and apparatus | |
US4030996A (en) | Electrode type glow discharge method and apparatus | |
US5215638A (en) | Rotating magnetron cathode and method for the use thereof | |
GB1343137A (en) | Sputtering apparatus | |
US3654110A (en) | Method of applying a coating by cathode sputtering | |
US3644191A (en) | Sputtering apparatus | |
JP2921874B2 (ja) | 高効率シートプラズマスパタリング装置 | |
GB1504548A (en) | Method and apparatus for depositing thin layers of insulating or slightly conductive materials by reactive sputtering in a high-frequency inductive plasma | |
US3627663A (en) | Method and apparatus for coating a substrate by utilizing the hollow cathode effect with rf sputtering | |
US3294669A (en) | Apparatus for sputtering in a highly purified gas atmosphere | |
GB1132867A (en) | Improvements in or relating to apparatus for depositing thin films | |
US3325394A (en) | Magnetic control of film deposition | |
GB1226004A (lm) | ||
US3741886A (en) | Sputtering system and target electrode construction for use therewith | |
US3395089A (en) | Method of depositing films of controlled specific resistivity and temperature coefficient of resistance using cathode sputtering | |
US3296115A (en) | Sputtering of metals wherein gas flow is confined to increase the purity of deposition | |
US3282816A (en) | Process of cathode sputtering from a cylindrical cathode | |
US3502562A (en) | Multiple cathode sputtering fixture |