GB1039259A - Photoconductive layer and method of making the same - Google Patents

Photoconductive layer and method of making the same

Info

Publication number
GB1039259A
GB1039259A GB2256765A GB2256765A GB1039259A GB 1039259 A GB1039259 A GB 1039259A GB 2256765 A GB2256765 A GB 2256765A GB 2256765 A GB2256765 A GB 2256765A GB 1039259 A GB1039259 A GB 1039259A
Authority
GB
United Kingdom
Prior art keywords
base
layer
photoconductive
making
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2256765A
Inventor
Eihachi Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1039259A publication Critical patent/GB1039259A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/225Oblique incidence of vaporised material on substrate
    • C23C14/226Oblique incidence of vaporised material on substrate in order to form films with columnar structure
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic
    • G03G5/082Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic and not being incorporated in a bonding material, e.g. vacuum deposited
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/233Manufacture of photoelectric screens or charge-storage screens
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
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    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2924/01005Boron [B]
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    • H01L2924/01006Carbon [C]
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    • H01L2924/01051Antimony [Sb]
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    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249953Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978Voids specified as micro
    • Y10T428/24998Composite has more than two layers

Abstract

1,039,259. Photoconductive devices; television pick-up tubes. SONY CORPORATION. May 27, 1965, No. 22567/65. Headings H1D and H1K. A target for a television camera comprises a transparent base carrying a transparent electrode layer and a layer of continuous photoconductive material having minute cavities distributed therethrough; the photoconductive layer is deposited by a process in which the base is rotated about an axis substantially perpendicular to the face to which the layer is to be applied and evaporated photoconductive material (such as an oxysulphide of antimony) is projected at the base at an acute angle to the axis. Deposition takes place under substantially vacuum conditions and the base is preheated to a temperature between 50‹ and 200‹ C.
GB2256765A 1965-05-25 1965-05-27 Photoconductive layer and method of making the same Expired GB1039259A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45863665 US3391022A (en) 1965-05-25 1965-05-25 Photoconductive layer and method of making the same
DES0097485 1965-06-04

Publications (1)

Publication Number Publication Date
GB1039259A true GB1039259A (en) 1966-08-17

Family

ID=25998111

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2256765A Expired GB1039259A (en) 1965-05-25 1965-05-27 Photoconductive layer and method of making the same

Country Status (3)

Country Link
US (1) US3391022A (en)
DE (1) DE1514472A1 (en)
GB (1) GB1039259A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857708A (en) * 1968-04-26 1974-12-31 Agfa Gevaert Zinc oxide-binder medium containing microscopic cavities
US3620829A (en) * 1968-05-06 1971-11-16 Gen Motors Corp Coatings for germanium semiconductor devices
US4165923A (en) * 1972-04-10 1979-08-28 Ncr Corporation Liquid crystal alignment structure
CA991735A (en) * 1972-04-10 1976-06-22 Ncr Corporation Alignment film for a liquid crystal display cell and method of making same
US3964158A (en) * 1973-08-07 1976-06-22 Janning John L Method of making a liquid crystal display cell
US3908263A (en) * 1974-11-14 1975-09-30 Rca Corp Separate interdigital electrodes without using any special photolithographic techniques
JPS5160529A (en) * 1974-11-22 1976-05-26 Konishiroku Photo Ind Denshishashinkankozairyo
JPS5527323B2 (en) * 1975-01-30 1980-07-19
US4587191A (en) * 1984-01-05 1986-05-06 Futures C, Inc. Collapsible photoreceptive sheet including a high concentration of voids
DE3447876C1 (en) * 1984-12-31 1986-03-13 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Semiconductor layer having a laminar structure, and process for producing it
US4664935A (en) * 1985-09-24 1987-05-12 Machine Technology, Inc. Thin film deposition apparatus and method
US4921773A (en) * 1988-12-30 1990-05-01 Xerox Corporation Process for preparing an electrophotographic imaging member

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2759861A (en) * 1954-09-22 1956-08-21 Bell Telephone Labor Inc Process of making photoconductive compounds

Also Published As

Publication number Publication date
US3391022A (en) 1968-07-02
DE1514472A1 (en) 1969-05-08

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