FR3131971B1 - Caisson pour système acoustique, système acoustique et procédé de fabrication associés - Google Patents
Caisson pour système acoustique, système acoustique et procédé de fabrication associés Download PDFInfo
- Publication number
- FR3131971B1 FR3131971B1 FR2200394A FR2200394A FR3131971B1 FR 3131971 B1 FR3131971 B1 FR 3131971B1 FR 2200394 A FR2200394 A FR 2200394A FR 2200394 A FR2200394 A FR 2200394A FR 3131971 B1 FR3131971 B1 FR 3131971B1
- Authority
- FR
- France
- Prior art keywords
- acoustic system
- housing
- wall
- manufacturing process
- internal wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
- H04R2201/028—Structural combinations of loudspeakers with built-in power amplifiers, e.g. in the same acoustic enclosure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/022—Cooling arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Caisson pour système acoustique, système acoustique et procédé de fabrication associés L’invention concerne un caisson (10) pour système acoustique (12), le caisson (10) comprenant : - une paroi externe (18) et une paroi interne (20) s’étendant chacune selon un axe (D), la paroi externe (18) et la paroi interne (20) délimitant entre elles un volume périphérique (46) s’étendant le long de la paroi interne (20) autour de l’axe (D), - au moins une structure (22) située dans le volume périphérique (46), la structure (22) reliant la paroi externe (18) et la paroi interne (20), la structure (22) définissant une pluralité de canaux de circulation d’air (54). La paroi externe (18), la paroi interne (20) et la structure (22) étant thermiquement conductrices et venues de matière les unes avec les autres. Figure pour l'abrégé : Figure 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2200394A FR3131971B1 (fr) | 2022-01-18 | 2022-01-18 | Caisson pour système acoustique, système acoustique et procédé de fabrication associés |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR2200394 | 2022-01-18 | ||
FR2200394A FR3131971B1 (fr) | 2022-01-18 | 2022-01-18 | Caisson pour système acoustique, système acoustique et procédé de fabrication associés |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3131971A1 FR3131971A1 (fr) | 2023-07-21 |
FR3131971B1 true FR3131971B1 (fr) | 2024-02-02 |
Family
ID=80933892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR2200394A Active FR3131971B1 (fr) | 2022-01-18 | 2022-01-18 | Caisson pour système acoustique, système acoustique et procédé de fabrication associés |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3131971B1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719991B2 (ja) * | 1990-02-28 | 1995-03-06 | 三菱電機株式会社 | 制御装置ケース |
JP3854920B2 (ja) * | 2002-10-10 | 2006-12-06 | 株式会社ソニー・コンピュータエンタテインメント | 電子機器の放熱構造 |
US8561756B2 (en) * | 2012-02-17 | 2013-10-22 | Bose Corporation | Acoustic ports aligned to create free convective airflow |
FR3015166B1 (fr) * | 2013-12-18 | 2017-07-14 | Devialet | Enceinte acoustique comprenant une paroi externe non conductrice de la chaleur, un haut-parleur electrodynamique et un circuit electronique de commande |
-
2022
- 2022-01-18 FR FR2200394A patent/FR3131971B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3131971A1 (fr) | 2023-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20230721 |
|
PLFP | Fee payment |
Year of fee payment: 3 |