FR3094610B1 - Carte de circuit imprimé définissant un condensateur haute fréquence - Google Patents
Carte de circuit imprimé définissant un condensateur haute fréquence Download PDFInfo
- Publication number
- FR3094610B1 FR3094610B1 FR1903457A FR1903457A FR3094610B1 FR 3094610 B1 FR3094610 B1 FR 3094610B1 FR 1903457 A FR1903457 A FR 1903457A FR 1903457 A FR1903457 A FR 1903457A FR 3094610 B1 FR3094610 B1 FR 3094610B1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- printed circuit
- face
- high frequency
- frequency capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 4
- 239000003989 dielectric material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Carte de circuit imprimé (2), comprenant : - une face de réception (10) de composants électroniques (20, 35, 38, 40), portant des conducteurs électriques (12, 13) de manière à définir une première entrée en tension continue (4) entre un premier potentiel positif et une masse, - un matériau diélectrique disposé entre la face de réception (10) et une face d’extrémité (11) parallèle à la face de réception (10) et, - au moins une alternance d’un conducteur électrique (50) au premier potentiel positif et d’un conducteur électrique (51) à la masse, ces conducteurs (50, 51) étant disposés à l’intérieur de la carte de circuit imprimé (2) entre la face de réception (10) et la face d’extrémité (11) de manière à ce que la carte (2) définisse un condensateur, notamment un condensateur ayant une inductance propre inférieure à 1 nH. Figure pour l’abrégé : Figure 3
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1903457A FR3094610B1 (fr) | 2019-04-01 | 2019-04-01 | Carte de circuit imprimé définissant un condensateur haute fréquence |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1903457 | 2019-04-01 | ||
FR1903457A FR3094610B1 (fr) | 2019-04-01 | 2019-04-01 | Carte de circuit imprimé définissant un condensateur haute fréquence |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3094610A1 FR3094610A1 (fr) | 2020-10-02 |
FR3094610B1 true FR3094610B1 (fr) | 2021-07-02 |
Family
ID=67875543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1903457A Active FR3094610B1 (fr) | 2019-04-01 | 2019-04-01 | Carte de circuit imprimé définissant un condensateur haute fréquence |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR3094610B1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001308222A (ja) * | 2000-04-21 | 2001-11-02 | Hitachi Ltd | 実装基板 |
DE112013006313B4 (de) * | 2012-12-31 | 2021-06-10 | Efficient Power Conversion Corporation | Leiterplatten-Layout-Design zur Reduzierung parasitärer Induktivitäten für Mehrlagen-Halbleiterbauelemente |
JP6515678B2 (ja) * | 2015-05-25 | 2019-05-22 | 富士通株式会社 | コンバータ搭載基板 |
JP6103122B1 (ja) * | 2016-08-17 | 2017-03-29 | 富士電機株式会社 | パワー半導体モジュール用信号中継基板 |
-
2019
- 2019-04-01 FR FR1903457A patent/FR3094610B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
FR3094610A1 (fr) | 2020-10-02 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20201002 |
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PLFP | Fee payment |
Year of fee payment: 3 |
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |