FR3069128B1 - Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante - Google Patents
Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante Download PDFInfo
- Publication number
- FR3069128B1 FR3069128B1 FR1756700A FR1756700A FR3069128B1 FR 3069128 B1 FR3069128 B1 FR 3069128B1 FR 1756700 A FR1756700 A FR 1756700A FR 1756700 A FR1756700 A FR 1756700A FR 3069128 B1 FR3069128 B1 FR 3069128B1
- Authority
- FR
- France
- Prior art keywords
- insulating layer
- fixing
- cms
- cavity
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
L'invention concerne un procédé de fixation (S) d'un CMS sur un circuit imprimé (10) comprenant les étapes suivantes : - appliquer une couche isolante (20) (S1) sur le circuit imprimé (10), - former une cavité (22) dans la couche isolante (20) au-dessus de la couche conductrice (12) (S2) du circuit imprimé, - remplir la cavité (22) avec une crème à braser (3), - placer le CMS au-dessus de la cavité (22) (S4), - appliquer un traitement thermique (S5) au circuit imprimé (10).
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1756700A FR3069128B1 (fr) | 2017-07-13 | 2017-07-13 | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante |
US16/630,268 US10959338B2 (en) | 2017-07-13 | 2018-07-13 | Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer |
EP18738344.3A EP3653025A1 (fr) | 2017-07-13 | 2018-07-13 | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavité réalisée dans une couche isolante |
IL271985A IL271985B (en) | 2017-07-13 | 2018-07-13 | Connection of smd to an insulation layer with a soldered connection in the space created in the insulation layer |
CN201880055711.5A CN111034375B (zh) | 2017-07-13 | 2018-07-13 | 将电子元件附接至印刷电路的方法 |
PCT/EP2018/069149 WO2019012136A1 (fr) | 2017-07-13 | 2018-07-13 | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavité réalisée dans une couche isolante |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1756700 | 2017-07-13 | ||
FR1756700A FR3069128B1 (fr) | 2017-07-13 | 2017-07-13 | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3069128A1 FR3069128A1 (fr) | 2019-01-18 |
FR3069128B1 true FR3069128B1 (fr) | 2020-06-26 |
Family
ID=60080971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1756700A Active FR3069128B1 (fr) | 2017-07-13 | 2017-07-13 | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante |
Country Status (6)
Country | Link |
---|---|
US (1) | US10959338B2 (fr) |
EP (1) | EP3653025A1 (fr) |
CN (1) | CN111034375B (fr) |
FR (1) | FR3069128B1 (fr) |
IL (1) | IL271985B (fr) |
WO (1) | WO2019012136A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3093270B1 (fr) | 2019-02-25 | 2021-11-05 | Safran Electronics & Defense | Superposition de composants électroniques avec insertion dans des cavités |
FR3093271B1 (fr) | 2019-02-25 | 2021-11-05 | Safran Electronics & Defense | Carte électronique comprenant des composants dans des cavités et des plages de brasage partagées |
FR3114215B1 (fr) | 2020-09-15 | 2023-05-26 | Safran Electronics & Defense | Carte électronique comprenant des composants enterrés dans des cavités |
FR3114214B1 (fr) | 2020-09-15 | 2023-03-24 | Safran Electronics & Defense | Carte électronique comprenant des composants enterrés dans des cavités |
FR3117303B1 (fr) | 2020-12-09 | 2023-01-06 | Safran Electronics & Defense | Réduction des zones de contraintes dans les joints brasés d’une carte électronique |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4243356A1 (de) * | 1992-12-21 | 1994-06-23 | Siemens Ag | Bestückungsverfahren für eine Leiterplatte |
JPH11204928A (ja) * | 1998-01-07 | 1999-07-30 | Nec Corp | 半田ペースト塗布方法および回路基板 |
US20020046627A1 (en) * | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
JP3461172B2 (ja) * | 2001-07-05 | 2003-10-27 | 日東電工株式会社 | 多層配線回路基板の製造方法 |
CN101180727B (zh) * | 2005-05-23 | 2010-06-16 | 揖斐电株式会社 | 印刷线路板及其制造方法 |
CN101171895B (zh) * | 2005-06-30 | 2010-06-23 | 揖斐电株式会社 | 印刷线路板 |
US20070145104A1 (en) * | 2005-12-28 | 2007-06-28 | Mengzhi Pang | System and method for advanced solder bumping using a disposable mask |
DE102007033288A1 (de) * | 2007-07-17 | 2009-01-22 | Siemens Ag | Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung |
KR101097812B1 (ko) * | 2009-09-30 | 2011-12-23 | 엘지이노텍 주식회사 | 파인 피치 구조를 갖는 인쇄회로기판 및 이의 제조 방법 |
JP2016122802A (ja) * | 2014-12-25 | 2016-07-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
WO2016125264A1 (fr) * | 2015-02-04 | 2016-08-11 | オリンパス株式会社 | Dispositif à semi-conducteurs |
JP6534122B2 (ja) * | 2015-12-28 | 2019-06-26 | パナソニックIpマネジメント株式会社 | 樹脂フラックスはんだペースト及び実装構造体 |
-
2017
- 2017-07-13 FR FR1756700A patent/FR3069128B1/fr active Active
-
2018
- 2018-07-13 IL IL271985A patent/IL271985B/en unknown
- 2018-07-13 CN CN201880055711.5A patent/CN111034375B/zh active Active
- 2018-07-13 US US16/630,268 patent/US10959338B2/en active Active
- 2018-07-13 WO PCT/EP2018/069149 patent/WO2019012136A1/fr unknown
- 2018-07-13 EP EP18738344.3A patent/EP3653025A1/fr not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CN111034375B (zh) | 2020-12-01 |
US20200214142A1 (en) | 2020-07-02 |
IL271985A (en) | 2020-02-27 |
FR3069128A1 (fr) | 2019-01-18 |
WO2019012136A1 (fr) | 2019-01-17 |
US10959338B2 (en) | 2021-03-23 |
IL271985B (en) | 2022-07-01 |
CN111034375A (zh) | 2020-04-17 |
EP3653025A1 (fr) | 2020-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR3069128B1 (fr) | Fixation d'un cms sur une couche isolante avec un joint de brasure dans une cavite realisee dans une couche isolante | |
EP3171666A3 (fr) | Ensemble de chauffage, atomiseur et cigarette électronique les comprenant | |
WO2019012139A9 (fr) | Carte électronique comprenant des cms brasés sur des plages de brasage enterrées | |
EA201791338A1 (ru) | Стекло, имеющее электрический подключающий элемент и гибкий подключающий кабель | |
MA38104B1 (fr) | Vitre comprenant un élément de connexion électrique et des plaques compensatrices | |
EP2782431A3 (fr) | Procédé de fabrication de dispositif semi-conducteur et gabarit de montage | |
EA201692178A1 (ru) | Электрический соединительный элемент для контактирования электропроводной структуры на подложке | |
PH12019501140A1 (en) | Soldering method | |
FR3047111B1 (fr) | Assemblage comprenant des moyens d'interconnexion mixtes comportant des elements intermediaires d'interconnexion et des joints frittes metalliques et procede de fabrication | |
US9831575B2 (en) | Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same | |
ATE534269T1 (de) | Verfahren zum aufbau von oberflächen- elektronikvorrichtungen | |
FR3048210B1 (fr) | Element de garnissage comprenant une station d'accueil d'un appareil electronique nomade | |
EA201792377A1 (ru) | Панель с электрическим присоединительным элементом и прикрепленным к нему элементом соединения | |
EP3226540A3 (fr) | Procédé de fabrication d'une caméra destinée à être utilisée sur un véhicule | |
MY178008A (en) | Lubrication structure and transmission | |
EA201790542A1 (ru) | Способ изготовления стеклянной пластины с электропроводящим покрытием и припаянной к нему металлической полосой и соответствующая стеклянная пластина | |
EP3770305A4 (fr) | Liquide de placage d'étain ou d'alliage d'étain, procédé de formation de bosse et procédé de production de carte de circuit imprimé | |
EP2897276A3 (fr) | Dispositif semi-conducteur | |
FR3084780B1 (fr) | Systeme de connecteurs de carte de circuit imprime et procede d'interconnexion entre carte de circuit imprime | |
TWI582799B (zh) | Metal plate micro resistance | |
EP4166073C0 (fr) | Procédé de fabrication de dispositifs médicaux à circuit intégré | |
TH174981B (th) | แผ่นวงจรเดินสาย | |
JP6400318B2 (ja) | チップ部品及びその製造方法 | |
TWI596837B (zh) | 電連接器及其組裝方法 | |
RU139747U1 (ru) | Конструкция корпуса bga-компонентов для применения в жестких условиях эксплуатации |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLSC | Publication of the preliminary search report |
Effective date: 20190118 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |