FR3061603B1 - Dispositif optoelectronique a diodes electroluminescentes - Google Patents
Dispositif optoelectronique a diodes electroluminescentes Download PDFInfo
- Publication number
- FR3061603B1 FR3061603B1 FR1663509A FR1663509A FR3061603B1 FR 3061603 B1 FR3061603 B1 FR 3061603B1 FR 1663509 A FR1663509 A FR 1663509A FR 1663509 A FR1663509 A FR 1663509A FR 3061603 B1 FR3061603 B1 FR 3061603B1
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- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
L'invention concerne un procédé de fabrication d'un dispositif optoélectronique (10) comprenant les étapes successives suivantes : a) prévoir un substrat au moins en partie formé d'un matériau semiconducteur et ayant des première et deuxième faces opposées ; b) former un empilement (19) de couches semiconductrices (22, 23, 24) sur la première face, ledit empilement (19) comprenant des troisième et quatrième faces opposées (20, 21), la quatrième face (21) étant du côté du substrat, ledit empilement comprenant des diodes électroluminescentes (16) ; c) former des ouvertures (34) traversantes dans le substrat du côté de la deuxième face, lesdites ouvertures faisant face au moins en partie aux diodes électroluminescentes et délimitant des murs (30) dans le substrat ; d) former des plots conducteurs (36) sur la quatrième face dans au moins certaines des ouvertures en contact avec l'empilement ; et e) former des blocs photoluminescents (38) dans au moins certaines des ouvertures.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1663509A FR3061603B1 (fr) | 2016-12-29 | 2016-12-29 | Dispositif optoelectronique a diodes electroluminescentes |
TW106146147A TWI750289B (zh) | 2016-12-29 | 2017-12-28 | 具有發光二極體的光電裝置 |
US16/475,066 US10916580B2 (en) | 2016-12-29 | 2017-12-28 | Optoelectronic device with light-emitting diodes |
PCT/EP2017/084776 WO2018122354A1 (fr) | 2016-12-29 | 2017-12-28 | Dispositif optoélectronique à diodes électroluminescentes |
JP2019535789A JP7306992B2 (ja) | 2016-12-29 | 2017-12-28 | 発光ダイオードを備えた光電子デバイス |
EP17822339.2A EP3563425B1 (fr) | 2016-12-29 | 2017-12-28 | Dispositif optoélectronique avec diodes électroluminescentes et procédé de fabrication |
CN201780081858.7A CN110168753B (zh) | 2016-12-29 | 2017-12-28 | 具有发光二极管的光电器件 |
KR1020197021899A KR102496367B1 (ko) | 2016-12-29 | 2017-12-28 | 발광다이오드를 구비한 광전자장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1663509 | 2016-12-29 | ||
FR1663509A FR3061603B1 (fr) | 2016-12-29 | 2016-12-29 | Dispositif optoelectronique a diodes electroluminescentes |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3061603A1 FR3061603A1 (fr) | 2018-07-06 |
FR3061603B1 true FR3061603B1 (fr) | 2021-01-29 |
Family
ID=58737671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1663509A Active FR3061603B1 (fr) | 2016-12-29 | 2016-12-29 | Dispositif optoelectronique a diodes electroluminescentes |
Country Status (8)
Country | Link |
---|---|
US (1) | US10916580B2 (fr) |
EP (1) | EP3563425B1 (fr) |
JP (1) | JP7306992B2 (fr) |
KR (1) | KR102496367B1 (fr) |
CN (1) | CN110168753B (fr) |
FR (1) | FR3061603B1 (fr) |
TW (1) | TWI750289B (fr) |
WO (1) | WO2018122354A1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018118808A1 (de) * | 2018-08-02 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines bauteils und optoelektronisches bauteil |
KR20200062863A (ko) | 2018-11-27 | 2020-06-04 | 삼성전자주식회사 | 디스플레이 장치 및 제조 방법 |
DE102019107030A1 (de) * | 2019-03-19 | 2020-09-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische halbleitervorrichtung mit einer vielzahl von bildelementen und trennelementen und verfahren zur herstellung der optoelektronischen halbleitervorrichtung |
GB2593699B (en) * | 2020-03-30 | 2022-10-26 | Plessey Semiconductors Ltd | Monolithic LED pixel |
CN112864290B (zh) * | 2020-04-09 | 2022-04-22 | 镭昱光电科技(苏州)有限公司 | 微型led显示器及其制造方法 |
JP7091598B2 (ja) * | 2020-05-20 | 2022-06-28 | 日亜化学工業株式会社 | 発光装置の製造方法 |
TWI729846B (zh) * | 2020-06-10 | 2021-06-01 | 友達光電股份有限公司 | 發光裝置 |
US20230268468A1 (en) * | 2022-02-22 | 2023-08-24 | Osram Opto Semiconductors Gmbh | Light emitting semiconductor chip and method for manufacturing a plurality of light emitting semiconductor chips |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US5449926A (en) * | 1994-05-09 | 1995-09-12 | Motorola, Inc. | High density LED arrays with semiconductor interconnects |
US6547249B2 (en) | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
EP1700329A2 (fr) | 2003-12-22 | 2006-09-13 | Koninklijke Philips Electronics N.V. | Fabrication d'un ensemble de nanofils semi-conducteurs, et composant electrique comportant un ensemble de nanofils |
CN100487931C (zh) * | 2004-09-27 | 2009-05-13 | 松下电器产业株式会社 | 半导体发光元件及其制造方法和安装方法、发光器件 |
KR100755598B1 (ko) | 2006-06-30 | 2007-09-06 | 삼성전기주식회사 | 질화물 반도체 발광소자 어레이 |
JP5091445B2 (ja) * | 2006-09-15 | 2012-12-05 | 株式会社東芝 | 半導体装置およびその製造方法 |
JP5253740B2 (ja) | 2007-01-09 | 2013-07-31 | 学校法人上智学院 | Iii族窒化物半導体微細柱状結晶の製造方法およびiii族窒化物構造体 |
KR101468696B1 (ko) * | 2007-12-31 | 2014-12-08 | 서울반도체 주식회사 | 발광 소자 |
DE102008016534A1 (de) * | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements |
JP2010040867A (ja) * | 2008-08-06 | 2010-02-18 | Showa Denko Kk | Iii族窒化物半導体積層構造体およびその製造方法 |
US20110140072A1 (en) | 2008-08-21 | 2011-06-16 | Nanocrystal Corporation | Defect-free group iii - nitride nanostructures and devices using pulsed and non-pulsed growth techniques |
TW201044568A (en) | 2009-04-20 | 2010-12-16 | 3M Innovative Properties Co | Non-radiatively pumped wavelength converter |
JP5277270B2 (ja) | 2010-07-08 | 2013-08-28 | 学校法人立命館 | 結晶成長方法および半導体素子 |
EP2495772A1 (fr) * | 2011-03-02 | 2012-09-05 | Azzurro Semiconductors AG | Dispositif électroluminescent semi-conducteur |
US8796665B2 (en) * | 2011-08-26 | 2014-08-05 | Micron Technology, Inc. | Solid state radiation transducers and methods of manufacturing |
DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
FR2985989B1 (fr) | 2012-01-23 | 2017-03-03 | Commissariat Energie Atomique | Procede d'isolation de nanofils ou de microfils |
JP3174776U (ja) | 2012-01-26 | 2012-04-05 | サンケン電気株式会社 | 半導体発光装置 |
KR20130104612A (ko) * | 2012-03-14 | 2013-09-25 | 서울바이오시스 주식회사 | 발광 다이오드 및 그것을 제조하는 방법 |
TWI480660B (zh) * | 2012-12-25 | 2015-04-11 | Au Optronics Corp | 顯示裝置 |
FR3003403B1 (fr) * | 2013-03-14 | 2016-11-04 | Commissariat Energie Atomique | Procede de formation de diodes electroluminescentes |
US9059339B1 (en) * | 2014-02-11 | 2015-06-16 | International Business Machines Corporation | Light emitting diodes with via contact scheme |
DE102014112551A1 (de) * | 2014-09-01 | 2016-03-03 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US20160141446A1 (en) * | 2014-11-18 | 2016-05-19 | PlayNitride Inc. | Method for manufacturing light emitting device |
DE102015103055A1 (de) * | 2014-12-04 | 2016-06-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
TWI543394B (zh) * | 2014-12-05 | 2016-07-21 | Electroluminescence and Photoluminescence Multiband White Light Emitting Diodes | |
JP5838357B1 (ja) | 2015-01-13 | 2016-01-06 | パナソニックIpマネジメント株式会社 | 発光装置及びその製造方法 |
FR3033939B1 (fr) * | 2015-03-20 | 2018-04-27 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a diode electroluminescente |
-
2016
- 2016-12-29 FR FR1663509A patent/FR3061603B1/fr active Active
-
2017
- 2017-12-28 EP EP17822339.2A patent/EP3563425B1/fr active Active
- 2017-12-28 CN CN201780081858.7A patent/CN110168753B/zh active Active
- 2017-12-28 JP JP2019535789A patent/JP7306992B2/ja active Active
- 2017-12-28 TW TW106146147A patent/TWI750289B/zh active
- 2017-12-28 WO PCT/EP2017/084776 patent/WO2018122354A1/fr unknown
- 2017-12-28 US US16/475,066 patent/US10916580B2/en active Active
- 2017-12-28 KR KR1020197021899A patent/KR102496367B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN110168753B (zh) | 2022-03-08 |
US20190326351A1 (en) | 2019-10-24 |
EP3563425B1 (fr) | 2023-05-17 |
US10916580B2 (en) | 2021-02-09 |
EP3563425A1 (fr) | 2019-11-06 |
TWI750289B (zh) | 2021-12-21 |
WO2018122354A1 (fr) | 2018-07-05 |
KR102496367B1 (ko) | 2023-02-03 |
JP7306992B2 (ja) | 2023-07-11 |
TW201838202A (zh) | 2018-10-16 |
CN110168753A (zh) | 2019-08-23 |
KR20190098239A (ko) | 2019-08-21 |
FR3061603A1 (fr) | 2018-07-06 |
JP2020503691A (ja) | 2020-01-30 |
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