FR3045156B1 - Procede de detection de defauts et dispositif associe - Google Patents

Procede de detection de defauts et dispositif associe

Info

Publication number
FR3045156B1
FR3045156B1 FR1562233A FR1562233A FR3045156B1 FR 3045156 B1 FR3045156 B1 FR 3045156B1 FR 1562233 A FR1562233 A FR 1562233A FR 1562233 A FR1562233 A FR 1562233A FR 3045156 B1 FR3045156 B1 FR 3045156B1
Authority
FR
France
Prior art keywords
hole
signal
picked
defect
pixels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1562233A
Other languages
English (en)
Other versions
FR3045156A1 (fr
Inventor
Olivier Pfersdorff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR1562233A priority Critical patent/FR3045156B1/fr
Priority to TW105138739A priority patent/TWI713638B/zh
Priority to JP2016229308A priority patent/JP6776492B2/ja
Priority to CN201611113931.8A priority patent/CN107036531B/zh
Priority to DE102016224467.1A priority patent/DE102016224467A1/de
Priority to KR1020160167731A priority patent/KR20170069946A/ko
Priority to US15/374,902 priority patent/US10509214B2/en
Publication of FR3045156A1 publication Critical patent/FR3045156A1/fr
Application granted granted Critical
Publication of FR3045156B1 publication Critical patent/FR3045156B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/04—Measuring microscopes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/06—Means for illuminating specimens
    • G02B21/08—Condensers
    • G02B21/10—Condensers affording dark-field illumination
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/26—Stages; Adjusting means therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
    • G02B21/365—Control or image processing arrangements for digital or video microscopes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N2021/8928—Haze defects, i.e. with a part of diffracted light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4738—Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20076—Probabilistic image processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

L'invention concerne un procédé de détermination de la taille d'un défaut de type trou sur une face supérieure d'une structure comprenant une couche superficielle disposée sur un substrat, ledit défaut étant situé dans la couche superficielle ; le procédé comprenant : a) une étape d'introduction de la structure dans un dispositif de microscopie en champ sombre par réflexion pour générer, à partir d'un rayon lumineux diffusé par la face supérieure, un premier signal de défauts et un second signal de rugosité ; b) une étape de capture sur une pluralité de pixels de l'intensité du second signal de rugosité ; Le procédé étant remarquable en ce qu'il comprend en outre : c) une étape de traitement pour comparer l'intensité captée par chaque pixel avec celles captées par des pixels voisins et définir si ledit pixel est inclus dans une zone anormale ; d) une étape d'extraction de l'écart-type des valeurs des intensités captées par les pixels de la zone anormale ; e) une étape de détermination de la taille du défaut de type trou relatif a la zone anormale, à partir de l'écart-type extrait. L'invention concerne également un dispositif de détection de défauts de type trou.
FR1562233A 2015-12-11 2015-12-11 Procede de detection de defauts et dispositif associe Active FR3045156B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FR1562233A FR3045156B1 (fr) 2015-12-11 2015-12-11 Procede de detection de defauts et dispositif associe
TW105138739A TWI713638B (zh) 2015-12-11 2016-11-24 缺陷檢測方法及相關裝置
JP2016229308A JP6776492B2 (ja) 2015-12-11 2016-11-25 欠陥を検出するための方法及び関連する装置
CN201611113931.8A CN107036531B (zh) 2015-12-11 2016-12-07 确定空洞型缺陷的尺寸的方法和检测空洞型缺陷的装置
DE102016224467.1A DE102016224467A1 (de) 2015-12-11 2016-12-08 Verfahren zur Erkennung von Defekten und dazugehörige Vorrichtung
KR1020160167731A KR20170069946A (ko) 2015-12-11 2016-12-09 결함들을 검출하기 위한 방법 및 연관된 디바이스
US15/374,902 US10509214B2 (en) 2015-12-11 2016-12-09 Method for detecting defects and associated device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1562233A FR3045156B1 (fr) 2015-12-11 2015-12-11 Procede de detection de defauts et dispositif associe

Publications (2)

Publication Number Publication Date
FR3045156A1 FR3045156A1 (fr) 2017-06-16
FR3045156B1 true FR3045156B1 (fr) 2017-12-22

Family

ID=55182459

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1562233A Active FR3045156B1 (fr) 2015-12-11 2015-12-11 Procede de detection de defauts et dispositif associe

Country Status (7)

Country Link
US (1) US10509214B2 (fr)
JP (1) JP6776492B2 (fr)
KR (1) KR20170069946A (fr)
CN (1) CN107036531B (fr)
DE (1) DE102016224467A1 (fr)
FR (1) FR3045156B1 (fr)
TW (1) TWI713638B (fr)

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CN110806412A (zh) * 2019-11-15 2020-02-18 中国工程物理研究院激光聚变研究中心 一种基于光学元件的缺陷尺寸检测方法及系统
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Also Published As

Publication number Publication date
TWI713638B (zh) 2020-12-21
FR3045156A1 (fr) 2017-06-16
CN107036531B (zh) 2020-07-10
JP2017129569A (ja) 2017-07-27
US10509214B2 (en) 2019-12-17
CN107036531A (zh) 2017-08-11
KR20170069946A (ko) 2017-06-21
TW201727218A (zh) 2017-08-01
DE102016224467A1 (de) 2017-06-14
JP6776492B2 (ja) 2020-10-28
US20170168279A1 (en) 2017-06-15

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