FR3034434B1 - Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation - Google Patents

Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation Download PDF

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Publication number
FR3034434B1
FR3034434B1 FR1552733A FR1552733A FR3034434B1 FR 3034434 B1 FR3034434 B1 FR 3034434B1 FR 1552733 A FR1552733 A FR 1552733A FR 1552733 A FR1552733 A FR 1552733A FR 3034434 B1 FR3034434 B1 FR 3034434B1
Authority
FR
France
Prior art keywords
plasma
objects
installation
storage area
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1552733A
Other languages
English (en)
Other versions
FR3034434A1 (fr
Inventor
Jocelyn Viard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coating Plasma Industrie SAS
Original Assignee
Coating Plasma Industrie SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coating Plasma Industrie SAS filed Critical Coating Plasma Industrie SAS
Priority to FR1552733A priority Critical patent/FR3034434B1/fr
Priority to EP16717427.5A priority patent/EP3278350A1/fr
Priority to PCT/FR2016/050699 priority patent/WO2016156728A1/fr
Priority to US15/560,605 priority patent/US10903058B2/en
Publication of FR3034434A1 publication Critical patent/FR3034434A1/fr
Application granted granted Critical
Publication of FR3034434B1 publication Critical patent/FR3034434B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32889—Connection or combination with other apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32403—Treating multiple sides of workpieces, e.g. 3D workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/32779—Continuous moving of batches of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32899—Multiple chambers, e.g. cluster tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Installation de traitement de surface d'objets par plasma, comprenant - une enceinte (10 ; 110) - des moyens (P45, P46) de mise sous vide de cette enceinte, - une zone de stockage des objets à traiter, dite zone de stockage amont (20 ; 120) - une zone de stockage des objets traités, dite zone de stockage aval (70 ; 120), - au moins deux chambres (40, 50, 60 ; 140, 150) de traitement plasma comprenant des moyens (42A, 42B ; 142A ; 142B) d'injection d'un mélange gazeux actif, des moyens (43 ; 143) de création d'une décharge électrique et des moyens de confinement du plasma dans le volume intérieur de la chambre, - des moyens de transport (30 ; 130) entre les zones de stockage et les chambres, caractérisée en ce que les moyens de transport sont des moyens de convoyage (30 ; 130) définissant une direction de convoyage (F30 ; F130), en ce que les différentes chambres sont placées les unes derrière les autres, selon la direction de convoyage, et en ce que les atmosphères des différentes chambres de traitement plasma ne sont pas hermétiques l'une par rapport à l'autre.
FR1552733A 2015-03-31 2015-03-31 Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation Active FR3034434B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1552733A FR3034434B1 (fr) 2015-03-31 2015-03-31 Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation
EP16717427.5A EP3278350A1 (fr) 2015-03-31 2016-03-29 Installation pour le traitement d'objets par plasma, utilisation de cette installation et procédé de mise en oeuvre de cette installation
PCT/FR2016/050699 WO2016156728A1 (fr) 2015-03-31 2016-03-29 Installation pour le traitement d'objets par plasma, utilisation de cette installation et procédé de mise en oeuvre de cette installation
US15/560,605 US10903058B2 (en) 2015-03-31 2016-03-29 Apparatus for treating objects with plasma, use of this apparatus and method of using this apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1552733A FR3034434B1 (fr) 2015-03-31 2015-03-31 Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation

Publications (2)

Publication Number Publication Date
FR3034434A1 FR3034434A1 (fr) 2016-10-07
FR3034434B1 true FR3034434B1 (fr) 2021-10-22

Family

ID=53200179

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1552733A Active FR3034434B1 (fr) 2015-03-31 2015-03-31 Installation pour le traitement d'objets par plasma, et procede de mise en oeuvre de cette installation

Country Status (4)

Country Link
US (1) US10903058B2 (fr)
EP (1) EP3278350A1 (fr)
FR (1) FR3034434B1 (fr)
WO (1) WO2016156728A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016114292A1 (de) * 2016-08-02 2018-02-08 Khs Corpoplast Gmbh Verfahren zum Beschichten von Kunststoffbehältern
JP6814998B1 (ja) * 2019-12-25 2021-01-20 株式会社プラズマイオンアシスト プラズマ処理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6296735B1 (en) 1993-05-03 2001-10-02 Unaxis Balzers Aktiengesellschaft Plasma treatment apparatus and method for operation same
JP4268303B2 (ja) * 2000-02-01 2009-05-27 キヤノンアネルバ株式会社 インライン型基板処理装置
US6667240B2 (en) * 2000-03-09 2003-12-23 Canon Kabushiki Kaisha Method and apparatus for forming deposited film
CN101451237B (zh) 2007-11-30 2012-02-08 中微半导体设备(上海)有限公司 具有多个等离子体反应区域的包括多个处理平台的等离子体反应室
DE102008019427A1 (de) 2008-04-17 2009-10-29 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Diffusionsbehandlung von Werkstücken
EP2220972A1 (fr) 2009-02-24 2010-08-25 Jura Elektroapparate AG Dispositif de distribution pour lait et/ou mousse de lait et machine à café dotée d'un tel dispositif de distribution
JP5131240B2 (ja) * 2009-04-09 2013-01-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
MY164208A (en) 2010-10-22 2017-11-30 Agc Glass Europe Modular coater separation
DE112013001298A5 (de) * 2012-03-05 2014-12-31 Dr. Laure Plasmatechnologie Gmbh Vorrichtung und Verfahren zur Plasmabeschichtung von länglichen zylindrischen Bauteilen
JP6134815B2 (ja) * 2013-02-25 2017-05-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 隣接スパッタカソードを用いた装置およびその操作方法

Also Published As

Publication number Publication date
EP3278350A1 (fr) 2018-02-07
US10903058B2 (en) 2021-01-26
WO2016156728A1 (fr) 2016-10-06
FR3034434A1 (fr) 2016-10-07
US20180053639A1 (en) 2018-02-22

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