FR3024279B1 - Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 - Google Patents
Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13Info
- Publication number
- FR3024279B1 FR3024279B1 FR1457268A FR1457268A FR3024279B1 FR 3024279 B1 FR3024279 B1 FR 3024279B1 FR 1457268 A FR1457268 A FR 1457268A FR 1457268 A FR1457268 A FR 1457268A FR 3024279 B1 FR3024279 B1 FR 3024279B1
- Authority
- FR
- France
- Prior art keywords
- semi
- manufacturing
- material based
- conductor material
- element nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Led Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1457268A FR3024279B1 (fr) | 2014-07-28 | 2014-07-28 | Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 |
PCT/EP2015/067117 WO2016016171A1 (fr) | 2014-07-28 | 2015-07-27 | Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 |
US15/327,736 US10181399B2 (en) | 2014-07-28 | 2015-07-27 | Method for manufacturing a wafer of semiconducting material based on a group 13 element nitride |
EP15750002.6A EP3174677A1 (fr) | 2014-07-28 | 2015-07-27 | Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 |
TW104124433A TW201611322A (zh) | 2014-07-28 | 2015-07-28 | 基於13族元素之氮化物半導體材料的晶圓之製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1457268A FR3024279B1 (fr) | 2014-07-28 | 2014-07-28 | Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3024279A1 FR3024279A1 (fr) | 2016-01-29 |
FR3024279B1 true FR3024279B1 (fr) | 2017-11-10 |
Family
ID=51519126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1457268A Expired - Fee Related FR3024279B1 (fr) | 2014-07-28 | 2014-07-28 | Procede de fabrication d'une plaquette de materiau semi-conducteur a base de nitrure d'elements 13 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10181399B2 (fr) |
EP (1) | EP3174677A1 (fr) |
FR (1) | FR3024279B1 (fr) |
TW (1) | TW201611322A (fr) |
WO (1) | WO2016016171A1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009266874A (ja) * | 2008-04-22 | 2009-11-12 | Nippon Telegr & Teleph Corp <Ntt> | 半導体結晶成長用基板および半導体結晶 |
JP2010199347A (ja) * | 2009-02-26 | 2010-09-09 | Canon Inc | 露光方法及びデバイス製造方法 |
TWI525664B (zh) * | 2010-03-05 | 2016-03-11 | Namiki Precision Jewel Co Ltd | A crystalline film, a device, and a method for producing a crystalline film or device |
US9105472B2 (en) * | 2010-04-13 | 2015-08-11 | Namiki Seimitsu Houseki Kabushiki Kaisha | Single-crystal substrate,single-crystal substrate having crystalline film,crystalline film,method for producing single-crystal substrate having crystalline film,method for producing crystalline substrate,and method for producing element |
-
2014
- 2014-07-28 FR FR1457268A patent/FR3024279B1/fr not_active Expired - Fee Related
-
2015
- 2015-07-27 WO PCT/EP2015/067117 patent/WO2016016171A1/fr active Application Filing
- 2015-07-27 US US15/327,736 patent/US10181399B2/en active Active
- 2015-07-27 EP EP15750002.6A patent/EP3174677A1/fr not_active Withdrawn
- 2015-07-28 TW TW104124433A patent/TW201611322A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
FR3024279A1 (fr) | 2016-01-29 |
US10181399B2 (en) | 2019-01-15 |
WO2016016171A1 (fr) | 2016-02-04 |
EP3174677A1 (fr) | 2017-06-07 |
US20170213719A1 (en) | 2017-07-27 |
TW201611322A (zh) | 2016-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT201700055987A1 (it) | Procedimento per fabbricare dispositivi a semiconduttore e corrispondente prodotto | |
DE102016200026B8 (de) | Wafer-Herstellungsverfahren | |
FR3031015B1 (fr) | Procede de fabrication d'un article chaussant | |
FR3024587B1 (fr) | Procede de fabrication d'une structure hautement resistive | |
JP2017199900A5 (ja) | 半導体装置の作製方法 | |
SG11201708564WA (en) | Film for manufacturing semiconductor parts | |
KR20180084795A (ko) | 반도체 장치, 이 반도체 장치의 제작 방법, 또는 이 반도체 장치를 가지는 표시 장치 | |
FR3026557B1 (fr) | Procede de dopage d'un semi-conducteur a base de gan | |
FR3031834B1 (fr) | Fabrication d'un support semi-conducteur a base de nitrures d'elements iii | |
ITUB20160027A1 (it) | Procedimento per produrre dispositivi a semiconduttore e corrispondente dispositivo | |
FR3051596B1 (fr) | Procede de fabrication d'un substrat de type semi-conducteur contraint sur isolant | |
TWI800668B (zh) | 晶片製造方法 | |
DK3648911T3 (da) | Fremgangsmåde til fremstilling af en køleplade | |
FR3051968B1 (fr) | Procede de fabrication d'un substrat semi-conducteur a haute resistivite | |
FR3051595B1 (fr) | Procede de fabrication d'un substrat de type semi-conducteur contraint sur isolant | |
FR3031242B1 (fr) | Procede de fabrication de nanofils ou de microfils semiconducteurs a pieds isoles | |
DE112017002987A5 (de) | Optoelektronisches halbleiterbauelement | |
GB2561730B (en) | Semiconductor substrate | |
TWI800509B (zh) | 器件晶片的製造方法 | |
DK3570662T3 (da) | Fremgangsmåde til fremstilling af en såmateriale-enhed | |
FR3020987B1 (fr) | Procede de fabrication d'un element de securite. | |
TWI800658B (zh) | 晶片製造方法 | |
FR3031833B1 (fr) | Procede de fabrication d'une structure semi-conductrice a base de nitrures d'elements iii passivee et une telle structure | |
HK1250281A1 (zh) | 製造半導體裝置的方法 | |
FR3050670B1 (fr) | Virole et procede de fabrication d'un carter comprenant une virole |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Search report ready |
Effective date: 20160129 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
ST | Notification of lapse |
Effective date: 20200306 |