FR3022689B1 - Module emetteur de lumiere - Google Patents

Module emetteur de lumiere Download PDF

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Publication number
FR3022689B1
FR3022689B1 FR1555746A FR1555746A FR3022689B1 FR 3022689 B1 FR3022689 B1 FR 3022689B1 FR 1555746 A FR1555746 A FR 1555746A FR 1555746 A FR1555746 A FR 1555746A FR 3022689 B1 FR3022689 B1 FR 3022689B1
Authority
FR
France
Prior art keywords
light emitting
emitting module
module
light
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1555746A
Other languages
English (en)
Other versions
FR3022689A1 (fr
Inventor
Hisayoshi Daicho
Shogo Sugimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of FR3022689A1 publication Critical patent/FR3022689A1/fr
Application granted granted Critical
Publication of FR3022689B1 publication Critical patent/FR3022689B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
FR1555746A 2014-06-24 2015-06-23 Module emetteur de lumiere Expired - Fee Related FR3022689B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014129541A JP2016009761A (ja) 2014-06-24 2014-06-24 発光モジュール
JP2014129541 2014-06-24

Publications (2)

Publication Number Publication Date
FR3022689A1 FR3022689A1 (fr) 2015-12-25
FR3022689B1 true FR3022689B1 (fr) 2018-03-16

Family

ID=54782996

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1555746A Expired - Fee Related FR3022689B1 (fr) 2014-06-24 2015-06-23 Module emetteur de lumiere

Country Status (5)

Country Link
US (1) US20150372198A1 (fr)
JP (1) JP2016009761A (fr)
CN (1) CN105280801A (fr)
DE (1) DE102015211398A1 (fr)
FR (1) FR3022689B1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170137328A1 (en) * 2014-06-18 2017-05-18 Osram Sylvania Inc. Method of making a ceramic wavelength converter assembly
JP6782551B2 (ja) * 2016-03-28 2020-11-11 シチズン時計株式会社 Ｌｅｄ発光装置
KR102525592B1 (ko) * 2016-04-25 2023-05-03 엘지이노텍 주식회사 조명장치
JP6493308B2 (ja) * 2016-05-31 2019-04-03 日亜化学工業株式会社 発光装置
CN109838751A (zh) * 2017-11-27 2019-06-04 深圳市绎立锐光科技开发有限公司 光源系统及使用该光源系统的汽车照明装置
JP6702349B2 (ja) * 2018-03-27 2020-06-03 日亜化学工業株式会社 発光装置
JP7007598B2 (ja) * 2018-12-14 2022-02-10 日亜化学工業株式会社 発光装置、発光モジュール及び発光装置の製造方法
JP6879290B2 (ja) * 2018-12-26 2021-06-02 日亜化学工業株式会社 発光装置
US11205886B2 (en) 2019-03-12 2021-12-21 Nichia Corporation Method of manufacturing optical member, optical member, and light emitting device
CN113917777A (zh) * 2020-07-09 2022-01-11 成都极米科技股份有限公司 一种光源设备以及投影显示设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006090804A1 (fr) * 2005-02-23 2006-08-31 Mitsubishi Chemical Corporation Element de composant electroluminescent a semiconducteur, son procede de fabrication et composant electroluminescent l'utilisant
JP5233172B2 (ja) 2007-06-07 2013-07-10 日亜化学工業株式会社 半導体発光装置
WO2009093163A2 (fr) * 2008-01-22 2009-07-30 Koninklijke Philips Electronics N.V. Dispositif d'éclairage à del et support transmissif comprenant une matière luminescente
JP2009289976A (ja) 2008-05-29 2009-12-10 Nichia Corp 発光装置
DE102008057140A1 (de) * 2008-11-13 2010-05-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20100207511A1 (en) * 2009-02-19 2010-08-19 Mitsunori Harada Semiconductor light emitting device
US9500325B2 (en) * 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
WO2012014360A1 (fr) * 2010-07-26 2012-02-02 株式会社小糸製作所 Module émetteur de lumière
JP6121915B2 (ja) * 2011-03-07 2017-04-26 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光モジュール、ランプ、照明器具、及び表示装置

Also Published As

Publication number Publication date
FR3022689A1 (fr) 2015-12-25
JP2016009761A (ja) 2016-01-18
CN105280801A (zh) 2016-01-27
DE102015211398A1 (de) 2016-01-07
US20150372198A1 (en) 2015-12-24

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