FR2957548B1 - Procede de polissage d'un substrat comprenant du polysilicium, de l'oxyde de silicium et du nitrure de silicium - Google Patents
Procede de polissage d'un substrat comprenant du polysilicium, de l'oxyde de silicium et du nitrure de siliciumInfo
- Publication number
- FR2957548B1 FR2957548B1 FR1152170A FR1152170A FR2957548B1 FR 2957548 B1 FR2957548 B1 FR 2957548B1 FR 1152170 A FR1152170 A FR 1152170A FR 1152170 A FR1152170 A FR 1152170A FR 2957548 B1 FR2957548 B1 FR 2957548B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- chemical
- mechanical polishing
- silicon oxide
- silicon nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Abstract
Il est proposé un procédé de polissage chimico-mécanique d'un substrat, comprenant tes étapes consistant à : fournir un substrat, dans lequel le substrat comprend du polysilicium de l'oxyde de silicium et du nitrure de silicium ; fournir une composition de polissage chimico-mécanique comprenant, comme composants initiaux : de l'eau ; un abrasif ; et un composé sulfonate d'alkylarylpolyéther, où le composé sulfonate d'alkylarylpolyéther comporte une portion hydrophobe comportant un groupe alkyle lié à un cycle aryle et une portion hydrophile a cyclique non ionique comportant 4 à 100 atomes de carbone ; et une substance selon la formule I dans laquelle chacun de R1, R2, R3, R4, R5, R6 et R7 est un groupe de pontage de formule -(CH2)n-, où n est un entier choisi parmi 1 à 10 ; fournir un tampon de polissage chimico-mécanique avec une surface de polissage ; déplacer la surface de polissage par rapport au substrat ; distribuer la composition de polissage chimico-mécanique sur la surface de polissage ; et abraser au moins une partie du substrat pour polir le substrat ; où au moins une partie du polysilicium est éliminée du substrat ; et où au moins une partie de l'oxyde de silicium et du nitrure de silicium est éliminée du substrat.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/724,685 US8491808B2 (en) | 2010-03-16 | 2010-03-16 | Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2957548A1 FR2957548A1 (fr) | 2011-09-23 |
FR2957548B1 true FR2957548B1 (fr) | 2015-07-03 |
Family
ID=44558416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1152170A Expired - Fee Related FR2957548B1 (fr) | 2010-03-16 | 2011-03-16 | Procede de polissage d'un substrat comprenant du polysilicium, de l'oxyde de silicium et du nitrure de silicium |
Country Status (7)
Country | Link |
---|---|
US (1) | US8491808B2 (fr) |
JP (1) | JP5957777B2 (fr) |
KR (1) | KR101672811B1 (fr) |
CN (1) | CN102199399B (fr) |
DE (1) | DE102011013981A1 (fr) |
FR (1) | FR2957548B1 (fr) |
TW (1) | TWI500750B (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8496843B2 (en) * | 2010-03-16 | 2013-07-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
US8492277B2 (en) * | 2010-03-16 | 2013-07-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
US20130171824A1 (en) * | 2010-09-08 | 2013-07-04 | Basf Se | Process for chemically mechanically polishing substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films |
KR101340551B1 (ko) * | 2010-12-31 | 2013-12-11 | 제일모직주식회사 | 질화규소를 선택적으로 연마하는 cmp 슬러리 조성물 |
US9303187B2 (en) * | 2013-07-22 | 2016-04-05 | Cabot Microelectronics Corporation | Compositions and methods for CMP of silicon oxide, silicon nitride, and polysilicon materials |
CN107030583A (zh) * | 2017-03-21 | 2017-08-11 | 天津华海清科机电科技有限公司 | 硅衬底片抛光方法和装置 |
US20190085205A1 (en) * | 2017-09-15 | 2019-03-21 | Cabot Microelectronics Corporation | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS |
CN109971356A (zh) | 2017-12-27 | 2019-07-05 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
JP7120846B2 (ja) * | 2018-08-10 | 2022-08-17 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びその製造方法並びに研磨方法並びに基板の製造方法 |
US10763119B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
US10759970B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
US11680186B2 (en) | 2020-11-06 | 2023-06-20 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3457107A (en) * | 1965-07-20 | 1969-07-22 | Diversey Corp | Method and composition for chemically polishing metals |
US4283321A (en) * | 1979-10-03 | 1981-08-11 | Gaf Corporation | Alkyl aryl ethyleneoxy sulfonate surfactants for vinyl acetate polymerization |
KR100378180B1 (ko) * | 2000-05-22 | 2003-03-29 | 삼성전자주식회사 | 화학기계적 연마 공정용 슬러리 및 이를 이용한 반도체소자의 제조방법 |
US6743683B2 (en) * | 2001-12-04 | 2004-06-01 | Intel Corporation | Polysilicon opening polish |
US7201647B2 (en) * | 2002-06-07 | 2007-04-10 | Praxair Technology, Inc. | Subpad having robust, sealed edges |
US7018560B2 (en) * | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
KR100795364B1 (ko) * | 2004-02-10 | 2008-01-17 | 삼성전자주식회사 | 반도체 기판용 세정액 조성물, 이를 이용한 세정 방법 및도전성 구조물의 제조 방법 |
JP2005347737A (ja) * | 2004-05-07 | 2005-12-15 | Nissan Chem Ind Ltd | シリコンウェハー用研磨組成物 |
KR100591719B1 (ko) * | 2004-11-09 | 2006-06-22 | 삼성전자주식회사 | 에피텍셜 콘택 플러그 제조방법, 그 제조 방법을 이용한반도체 장치 제조 방법 및 그 제조 방법을 이용한 더블스택형 트랜지스터 제조 방법 |
US7790618B2 (en) * | 2004-12-22 | 2010-09-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Selective slurry for chemical mechanical polishing |
US20070077865A1 (en) * | 2005-10-04 | 2007-04-05 | Cabot Microelectronics Corporation | Method for controlling polysilicon removal |
US8017524B2 (en) * | 2008-05-23 | 2011-09-13 | Cabot Microelectronics Corporation | Stable, high rate silicon slurry |
JP5441362B2 (ja) * | 2008-05-30 | 2014-03-12 | 富士フイルム株式会社 | 研磨液及び研磨方法 |
JP5467804B2 (ja) * | 2008-07-11 | 2014-04-09 | 富士フイルム株式会社 | 窒化ケイ素用研磨液及び研磨方法 |
US8119529B2 (en) * | 2009-04-29 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing a substrate |
US8492277B2 (en) * | 2010-03-16 | 2013-07-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
US8496843B2 (en) * | 2010-03-16 | 2013-07-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride |
-
2010
- 2010-03-16 US US12/724,685 patent/US8491808B2/en not_active Expired - Fee Related
-
2011
- 2011-03-10 JP JP2011052897A patent/JP5957777B2/ja not_active Expired - Fee Related
- 2011-03-14 TW TW100108481A patent/TWI500750B/zh not_active IP Right Cessation
- 2011-03-15 KR KR1020110022824A patent/KR101672811B1/ko active IP Right Grant
- 2011-03-15 DE DE102011013981.8A patent/DE102011013981A1/de not_active Withdrawn
- 2011-03-16 CN CN201110072210.8A patent/CN102199399B/zh not_active Expired - Fee Related
- 2011-03-16 FR FR1152170A patent/FR2957548B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5957777B2 (ja) | 2016-07-27 |
TW201139636A (en) | 2011-11-16 |
CN102199399A (zh) | 2011-09-28 |
CN102199399B (zh) | 2014-04-02 |
FR2957548A1 (fr) | 2011-09-23 |
KR101672811B1 (ko) | 2016-11-04 |
JP2011205096A (ja) | 2011-10-13 |
KR20110104443A (ko) | 2011-09-22 |
US20110230048A1 (en) | 2011-09-22 |
TWI500750B (zh) | 2015-09-21 |
US8491808B2 (en) | 2013-07-23 |
DE102011013981A1 (de) | 2014-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
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PLFP | Fee payment |
Year of fee payment: 8 |
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PLFP | Fee payment |
Year of fee payment: 10 |
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ST | Notification of lapse |
Effective date: 20211105 |