FR2916192B1 - Composant de micromecanique a couche mince d'encapsulage et procede de fabrication de ce composant - Google Patents

Composant de micromecanique a couche mince d'encapsulage et procede de fabrication de ce composant

Info

Publication number
FR2916192B1
FR2916192B1 FR0853017A FR0853017A FR2916192B1 FR 2916192 B1 FR2916192 B1 FR 2916192B1 FR 0853017 A FR0853017 A FR 0853017A FR 0853017 A FR0853017 A FR 0853017A FR 2916192 B1 FR2916192 B1 FR 2916192B1
Authority
FR
France
Prior art keywords
encapsuling
micromechanic
manufacturing
component
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0853017A
Other languages
English (en)
Other versions
FR2916192A1 (fr
Inventor
Ando Feyh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2916192A1 publication Critical patent/FR2916192A1/fr
Application granted granted Critical
Publication of FR2916192B1 publication Critical patent/FR2916192B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
FR0853017A 2007-05-14 2008-05-07 Composant de micromecanique a couche mince d'encapsulage et procede de fabrication de ce composant Expired - Fee Related FR2916192B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007022509.3A DE102007022509B4 (de) 2007-05-14 2007-05-14 Mikromechanisches Bauteil mit Dünnschichtverkappung und Herstellungsverfahrung

Publications (2)

Publication Number Publication Date
FR2916192A1 FR2916192A1 (fr) 2008-11-21
FR2916192B1 true FR2916192B1 (fr) 2013-08-02

Family

ID=39868675

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0853017A Expired - Fee Related FR2916192B1 (fr) 2007-05-14 2008-05-07 Composant de micromecanique a couche mince d'encapsulage et procede de fabrication de ce composant

Country Status (5)

Country Link
US (1) US7923794B2 (fr)
JP (1) JP2008279595A (fr)
DE (1) DE102007022509B4 (fr)
FR (1) FR2916192B1 (fr)
IT (1) ITMI20080848A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009000048A1 (de) * 2009-01-07 2010-07-08 Robert Bosch Gmbh Mikrotechnisches System und Verfahren zur Herstellung eines mikrotechnischen Systems
EP2375219B1 (fr) * 2009-04-17 2019-02-20 Hitachi, Ltd. Capteur d'inertie et procédé pour la fabrication de celui-ci
DE102009027284A1 (de) 2009-06-29 2010-12-30 Robert Bosch Gmbh Verfahren zur Herstellung mikromechanischer Strukturen und mikromechanische Strukturen
DE102009027898B4 (de) 2009-07-21 2019-09-05 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauelement
DE102009029184A1 (de) 2009-09-03 2011-03-10 Robert Bosch Gmbh Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement
US8692530B2 (en) 2010-11-30 2014-04-08 Microchip Technology Incorporated Efficiency-optimizing, calibrated sensorless power/energy conversion in a switch-mode power supply
US8957651B2 (en) 2010-12-06 2015-02-17 Microchip Technology Incorporated User-configurable, efficiency-optimizing, power/energy conversion switch-mode power supply with a serial communications interface
FR2980034B1 (fr) * 2011-09-08 2014-07-04 Commissariat Energie Atomique Procede de realisation d'une structure a cavite fermee hermetiquement et sous atmosphere controlee
DE102013102213B4 (de) * 2013-03-06 2020-01-02 Snaptrack, Inc. Miniaturisiertes Bauelement mit Dünnschichtabdeckung und Verfahren zur Herstellung
DE102015206745B4 (de) 2015-04-15 2022-05-05 Infineon Technologies Dresden Gmbh Strahler und Verfahren zu dessen Herstellung
CN107777656A (zh) * 2016-08-26 2018-03-09 深迪半导体(上海)有限公司 一种mems器件及腔体气压控制方法
CN110137083B (zh) * 2019-04-17 2020-12-08 深圳市华星光电技术有限公司 阵列基板及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3924595A1 (de) 1989-07-25 1991-01-31 Becker Autoradio Steueranordnung fuer ein rueckhaltesystem in kraftfahrzeugen
EP0963603B1 (fr) * 1997-01-21 2003-12-03 Georgia Tech Research Corporation Fabrication d'un dispositif semi-conducteur pourvu d'espaces d'air pour des interconnexions a capacite tres faible
EP0951068A1 (fr) * 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Procédé de fabrication pour une microstructure avec une cavité interne
DE10005555A1 (de) * 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US7429495B2 (en) * 2002-08-07 2008-09-30 Chang-Feng Wan System and method of fabricating micro cavities
US7514283B2 (en) 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
FR2864340B1 (fr) * 2003-12-19 2006-03-24 Commissariat Energie Atomique Microcomposant comportant une microcavite hermetique et procede de fabrication d'un tel microcomposant
EP1843971B1 (fr) * 2005-02-04 2016-04-13 Imec Procede d'encapsulation d'un dispositif dans une microcavite
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
JP4988217B2 (ja) * 2006-02-03 2012-08-01 株式会社日立製作所 Ｍｅｍｓ構造体の製造方法

Also Published As

Publication number Publication date
US7923794B2 (en) 2011-04-12
JP2008279595A (ja) 2008-11-20
US20080296747A1 (en) 2008-12-04
DE102007022509A1 (de) 2008-11-20
FR2916192A1 (fr) 2008-11-21
DE102007022509B4 (de) 2015-10-22
ITMI20080848A1 (it) 2008-11-15

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