FR2880117B1 - Detecteur de pression resistant aux acides - Google Patents

Detecteur de pression resistant aux acides

Info

Publication number
FR2880117B1
FR2880117B1 FR0513085A FR0513085A FR2880117B1 FR 2880117 B1 FR2880117 B1 FR 2880117B1 FR 0513085 A FR0513085 A FR 0513085A FR 0513085 A FR0513085 A FR 0513085A FR 2880117 B1 FR2880117 B1 FR 2880117B1
Authority
FR
France
Prior art keywords
pressure detector
acid resistant
resistant pressure
acid
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0513085A
Other languages
English (en)
Other versions
FR2880117A1 (fr
Inventor
Kouji Uchida
Norihiro Katayama
Keiji Horiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of FR2880117A1 publication Critical patent/FR2880117A1/fr
Application granted granted Critical
Publication of FR2880117B1 publication Critical patent/FR2880117B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
FR0513085A 2004-12-24 2005-12-21 Detecteur de pression resistant aux acides Expired - Fee Related FR2880117B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004372941A JP2006177859A (ja) 2004-12-24 2004-12-24 圧力センサ

Publications (2)

Publication Number Publication Date
FR2880117A1 FR2880117A1 (fr) 2006-06-30
FR2880117B1 true FR2880117B1 (fr) 2014-04-11

Family

ID=36585769

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0513085A Expired - Fee Related FR2880117B1 (fr) 2004-12-24 2005-12-21 Detecteur de pression resistant aux acides

Country Status (4)

Country Link
US (1) US7216545B2 (fr)
JP (1) JP2006177859A (fr)
DE (1) DE102005058951B4 (fr)
FR (1) FR2880117B1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008088937A (ja) * 2006-10-04 2008-04-17 Mitsubishi Electric Corp 検出装置及びエンジン制御装置
JP5541106B2 (ja) * 2010-11-16 2014-07-09 株式会社デンソー 圧力センサ
DE102011013912A1 (de) * 2011-03-15 2012-09-20 Volkswagen Aktiengesellschaft Drucksensor
US8671766B2 (en) * 2011-05-19 2014-03-18 Infineon Technologies Ag Integrated pressure sensor seal
JP5884921B2 (ja) * 2012-11-30 2016-03-15 富士電機株式会社 圧力センサ装置および圧力センサ装置の製造方法
DE102014105861B4 (de) * 2014-04-25 2015-11-05 Infineon Technologies Ag Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
US9598280B2 (en) * 2014-11-10 2017-03-21 Nxp Usa, Inc. Environmental sensor structure
JP6476036B2 (ja) * 2015-03-31 2019-02-27 株式会社フジクラ 圧力センサ
US9945747B1 (en) * 2016-10-13 2018-04-17 Honeywell International Inc. Gel filled port pressure sensor for robust media sealing
GB2555829B (en) 2016-11-11 2019-11-20 Sensata Technologies Inc Encapsulations for MEMS sense elements and wire bonds
US20180335360A1 (en) * 2017-05-16 2018-11-22 Honeywell International Inc. Ported Pressure Sensor With No Internally Trapped Fluid
DE102018222781A1 (de) * 2018-12-21 2020-06-25 Robert Bosch Gmbh Drucksensoranordnung
TWI693382B (zh) * 2019-01-24 2020-05-11 中光電智能感測股份有限公司 力量感測器
US20220221353A1 (en) * 2021-01-12 2022-07-14 Texas Instruments Incorporated Semiconductor force sensors
US11796412B2 (en) * 2021-09-13 2023-10-24 Honeywell International Inc. Sensing components comprising coupling elements
US11879790B2 (en) * 2021-10-28 2024-01-23 Texas Instruments Incorporated Isolated temperature sensor package with embedded spacer in dielectric opening

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2764113B1 (fr) * 1997-05-28 2000-08-04 Motorola Semiconducteurs Dispositif capteur et son procede de fabrication
FR2798732B1 (fr) * 1999-09-17 2003-07-04 Denso Corp Dispositif formant capteur de pression a semiconducteurs comportant une plaquette de capteur recouverte par un element de protection
US6512255B2 (en) * 1999-09-17 2003-01-28 Denso Corporation Semiconductor pressure sensor device having sensor chip covered with protective member
US6260417B1 (en) * 1999-10-13 2001-07-17 Denso Corporation Semiconductor pressure sensor device with multi-layered protective member that reduces void formation
JP4320963B2 (ja) * 2000-11-27 2009-08-26 株式会社デンソー 圧力センサ
DE20218044U1 (de) * 2002-11-20 2003-02-27 Infineon Technologies AG, 81669 München Drucksensor
JP2005326338A (ja) * 2004-05-17 2005-11-24 Denso Corp 圧力センサ

Also Published As

Publication number Publication date
DE102005058951A1 (de) 2006-07-06
JP2006177859A (ja) 2006-07-06
FR2880117A1 (fr) 2006-06-30
US20060137458A1 (en) 2006-06-29
US7216545B2 (en) 2007-05-15
DE102005058951B4 (de) 2015-09-03

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20160831